The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.
TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters. A series of cases are presented, including an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, offering researchers and engineers in microelectronics a uniquely useful handbook to help solve problems in 3D heterogenous RF integration oriented Hr-Si interposer technology. - Provides a detailed demonstration of the design and process development of HR-Si (High-Resistivity Silicon) interposer technology - Presents a series of implementation case studies that detail modeling and simulation, integration, qualification and testing methods - Offers a systematic and comparative literature review of HR-Si interposer technology by topic - Offers solutions to problems with TSV (through silicon via) interposer technology, including high frequency loss and cooling problems - Gives a systematic and accessible accounting on this leading technology
Magnesium Alloys as Degradable Biomaterials provides a comprehensive review of the biomedical applications of biodegradable magnesium and its alloys. Magnesium has seen increasing use in orthopedic and cardiovascular applications over the last decade, particularly for coronary stents and bone implants.The book discusses the basic concepts of biodeg
This book focuses on the topology theory of mechanisms developed by the authors and provides a systematic method for the topology design of robot mechanisms. The main original theoretical contributions of this book include: A. Three basic concepts · The “geometrical constraint type of axes” is introduced as the third element of the topological structure of a mechanism. When it is combined with the other two elements, the kinematic pair and the connection of links, the symbolic expression of the topological structure is independent of the motion positions (except for the singularity positions) and the fixed coordinate system (Chapter 2). · The position and orientation characteristic (POC) set is used to describe the POC of the relative motion between any two links. The POC set, derived from the unit vector set of the velocity of a link, is only depend on the topological structure of a mechanism. Therefore, it is also independent of the motion positions and the fixed coordinate system (Chapter 3). · The single open chain (SOC) unit is the base unit of the topological structure used to develop the four basic equations of the mechanism topology (Chapters 2, 4–6). B. The mechanism composition principle based on the SOC units This book proposes a mechanism composition principle, based on the SOC units, to establish a systematic theory for the unified modeling of the topology, kinematics, and dynamics of mechanisms based on the SOC units (Chapter 7). C. Four basic equations • The POC equation of serial mechanisms with 10 symbolic operation rules (Chapter 4). • The POC equation of parallel mechanisms with 14 symbolic operation rules (Chapter 5). • The general DOF formula for spatial mechanisms (Chapter 6). • The coupling degree formula for the Assur kinematic chain (Chapter 7). D. One systematic method for the topology design of robot mechanisms (Chapters 8–10) Based on the three basic concepts and the four basic equations addressed above, this book puts forward a systematic method for the topology design of parallel mechanisms, which is fundamentally different from all existing methods. Its main characteristics are as follows: • The design process includes two stages: the first is structure synthesis, which derives many structure types; the second involves the performance analysis, classification and optimization of structure types derived from the first stage. • The design operation is independent of the motion positions and the fixed coordinate system. Therefore, the proposed method is essentially a geometrical method, which ensures the full-cycle DOF and the generality of geometric conditions of mechanism existence. • Each individual design step follows an explicit formula or the guidelines for design criteria, making the operation simple, feasible and reproducible. In addition, the topology design of the SCARA PMs is studied in detail to demonstrate the proposed method (Chapter 10).
Recent advancements in mobile device technologies are revolutionizing how we socialize, interact, and connect. By connecting the virtual community with the local environment, mobile social networks (MSNs) create the opportunity for a multitude of new personalized services for mobile users. Along with that comes the need for new paradigms, mechanism
Principles and Applications of Therapeutic Ultrasound in Healthcare introduces concepts, principles, construction, and applications of therapeutic ultrasound: from bench to bedside. A comprehensive examination of the industry and medical application of ultrasound therapy, this book highlights working principles, research progress, and system
D2D-based proximity service is a very hot topic with great commercial potential from an application standpoint. Unlike existing books which focus on D2D communications technologies, this book fills a gap by summarizing and analyzing the latest applications and research results in academic, industrial fields, and standardization. The authors present the architecture, fundamental issues, and applications in a D2D networking environment from both application and interdisciplinary points of view.
The differential quadrature hierarchical finite element method (DQHFEM) was proposed by Bo Liu. This method incorporated the advantages and the latest research achievements of the hierarchical finite element method (HFEM), the differential quadrature method (DQM) and the isogeometric analysis (IGA). The DQHFEM also overcame many limitations or difficulties of the three methods.This unique compendium systemically introduces the construction of various DQHFEM elements of commonly used geometric shapes like triangle, tetrahedrons, pyramids, etc. Abundant examples are also included such as statics and dynamics, isotropic materials and composites, linear and nonlinear problems, plates as well as shells and solid structures.This useful reference text focuses largely on numerical algorithms, but also introduces some latest advances on high order mesh generation, which often has been regarded as the major bottle neck for the wide application of high order FEM.
With its comprehensive coverage of recent progress in metallic biomaterials, this reference focuses on emerging materials and new biofunctions for promising applications. The text is systematically structured, with the information organized according to different material systems, and concentrates on various advanced materials, such as anti-bacterial functionalized stainless steel, biodegradable metals with bioactivity, and novel structured metallic biomaterials. Authors from well-known academic institutes and with many years of clinical experience discuss all important aspects, including design strategies, fabrication and modification techniques, and biocompatibility.
TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters. A series of cases are presented, including an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, offering researchers and engineers in microelectronics a uniquely useful handbook to help solve problems in 3D heterogenous RF integration oriented Hr-Si interposer technology. - Provides a detailed demonstration of the design and process development of HR-Si (High-Resistivity Silicon) interposer technology - Presents a series of implementation case studies that detail modeling and simulation, integration, qualification and testing methods - Offers a systematic and comparative literature review of HR-Si interposer technology by topic - Offers solutions to problems with TSV (through silicon via) interposer technology, including high frequency loss and cooling problems - Gives a systematic and accessible accounting on this leading technology
The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.
This book focuses on the topology theory of mechanisms developed by the authors and provides a systematic method for the topology design of robot mechanisms. The main original theoretical contributions of this book include: A. Three basic concepts · The “geometrical constraint type of axes” is introduced as the third element of the topological structure of a mechanism. When it is combined with the other two elements, the kinematic pair and the connection of links, the symbolic expression of the topological structure is independent of the motion positions (except for the singularity positions) and the fixed coordinate system (Chapter 2). · The position and orientation characteristic (POC) set is used to describe the POC of the relative motion between any two links. The POC set, derived from the unit vector set of the velocity of a link, is only depend on the topological structure of a mechanism. Therefore, it is also independent of the motion positions and the fixed coordinate system (Chapter 3). · The single open chain (SOC) unit is the base unit of the topological structure used to develop the four basic equations of the mechanism topology (Chapters 2, 4–6). B. The mechanism composition principle based on the SOC units This book proposes a mechanism composition principle, based on the SOC units, to establish a systematic theory for the unified modeling of the topology, kinematics, and dynamics of mechanisms based on the SOC units (Chapter 7). C. Four basic equations • The POC equation of serial mechanisms with 10 symbolic operation rules (Chapter 4). • The POC equation of parallel mechanisms with 14 symbolic operation rules (Chapter 5). • The general DOF formula for spatial mechanisms (Chapter 6). • The coupling degree formula for the Assur kinematic chain (Chapter 7). D. One systematic method for the topology design of robot mechanisms (Chapters 8–10) Based on the three basic concepts and the four basic equations addressed above, this book puts forward a systematic method for the topology design of parallel mechanisms, which is fundamentally different from all existing methods. Its main characteristics are as follows: • The design process includes two stages: the first is structure synthesis, which derives many structure types; the second involves the performance analysis, classification and optimization of structure types derived from the first stage. • The design operation is independent of the motion positions and the fixed coordinate system. Therefore, the proposed method is essentially a geometrical method, which ensures the full-cycle DOF and the generality of geometric conditions of mechanism existence. • Each individual design step follows an explicit formula or the guidelines for design criteria, making the operation simple, feasible and reproducible. In addition, the topology design of the SCARA PMs is studied in detail to demonstrate the proposed method (Chapter 10).
D2D-based proximity service is a very hot topic with great commercial potential from an application standpoint. Unlike existing books which focus on D2D communications technologies, this book fills a gap by summarizing and analyzing the latest applications and research results in academic, industrial fields, and standardization. The authors present the architecture, fundamental issues, and applications in a D2D networking environment from both application and interdisciplinary points of view.
SPIE-International Society for Optical Engineering
Published Date
ISBN 10
0819488321
ISBN 13
9780819488329
Select your Age
This will help us customize your experience to showcase the most relevant content to your age group
Please select from below
Login
Not registered?
Sign up
Already registered?
Success – Your message will goes here
We'd love to hear from you!
Thank you for visiting our website. Would you like to provide feedback on how we could improve your experience?
This site does not use any third party cookies with one exception — it uses cookies from Google to deliver its services and to analyze traffic.Learn More.