In this invaluable resource for graduate students and practicing professionals, Tu and Liu provide a comprehensive account of electromigration and give a practical guide on how to manage its effects in microelectronic devices, especially newer devices that make use of 3D architectures. In the era of big data and artificial intelligence, next-generation microelectronic devices for consumers must be smaller, consume less power, cost less, and, most importantly, have higher functionality and reliability than ever before. However, with miniaturization, the average current density increases, and so does the probability of electromigration failure. This book covers all critical elements of electromigration, including basic theory, various failure modes induced by electromigration, methods to prevent failure, and equations for predicting mean-time-to-failure. Furthermore, effects such as stress, Joule heating, current crowding, and oxidation on electromigration are covered, and the new and modified mean-time-to-failure equations based on low entropy production are given. Readers will be able to apply this information to the design and application of microelectronic devices to minimize the risk of electromigration-induced failure in microelectronic devices. This book essential for anyone who wants to understand these critical elements and minimize their effects. It is particularly valuable for both graduate students of electrical engineering and materials science engineering and engineers working in the semiconductor and electronic packaging technology industries.
This research project has been supported by the Ford Foundation, the Lynch School of Education at Boston College, and the Program of Research on Private Higher Education at the University at Albany.
This book is an expanded and updated version of Part III of the authors' previous work, Advanced Structural Inorganic Chemistry (OUP 2008). The original part deals with main-group elements, the rare-earth elements, transition-metal clusters, and supramolecular systems. In this new book, selected material from significant advances in the past decade has been added, with particular emphasis on compounds that exemplify new types of bonds such as sigma-hole, triel bond, tetrel bond, pnictogen bond, chalcogen bond, halogen bond, halogen-halogen interaction, aerogen bond, as well as quintuple and sextuple metal-metal bonds. Other new topics include actinide compounds, metallophilicity, heterometallic macrocycles and cages, com- and dis-proportionation reactions, hydrogen-bonded organic frameworks (HOFs), halogen-bonded organic frameworks, halogen-halogen interactions in supramolecular frameworks, covalent organic frameworks (COFs), and metal-organic frameworks (MOFs).
This book introduces readers to a workload-aware methodology for large-scale graph algorithm optimization in graph-computing systems, and proposes several optimization techniques that can enable these systems to handle advanced graph algorithms efficiently. More concretely, it proposes a workload-aware cost model to guide the development of high-performance algorithms. On the basis of the cost model, the book subsequently presents a system-level optimization resulting in a partition-aware graph-computing engine, PAGE. In addition, it presents three efficient and scalable advanced graph algorithms – the subgraph enumeration, cohesive subgraph detection, and graph extraction algorithms. This book offers a valuable reference guide for junior researchers, covering the latest advances in large-scale graph analysis; and for senior researchers, sharing state-of-the-art solutions based on advanced graph algorithms. In addition, all readers will find a workload-aware methodology for designing efficient large-scale graph algorithms.
Private Higher Education and the Labor Market in China focuses on Chinese private higher education institutions and investigates their institutional management efforts in linking private higher education to the labor market. The dissertation firstly describes and analyzes how these mostly demand-absorbing institutions include elements aimed at meeting labor market demands in their mission statements, and how they improve student employability and bridge graduates and employers through job-oriented fields of study provision, educational delivery, career services, as well as networking and partnerships. It then examines graduate surveys on initial employment outcomes about employment status, starting salary, job and education match, and job satisfaction, while exploring the associations of these outcomes with managed institutional efforts. Finally, it builds a conceptual model with two dimensions that illustrates institutional variations in management efforts and initial graduate employment outcomes. This dissertation concludes that many of the demand-absorbing Chinese private higher education institutions have managed serious efforts in linking private higher education to the labor market and some of them are even semi-elite in their job-oriented institutional efforts and initial employment outcomes.
In this invaluable resource for graduate students and practicing professionals, Tu and Liu provide a comprehensive account of electromigration and give a practical guide on how to manage its effects in microelectronic devices, especially newer devices that make use of 3D architectures. In the era of big data and artificial intelligence, next-generation microelectronic devices for consumers must be smaller, consume less power, cost less, and, most importantly, have higher functionality and reliability than ever before. However, with miniaturization, the average current density increases, and so does the probability of electromigration failure. This book covers all critical elements of electromigration, including basic theory, various failure modes induced by electromigration, methods to prevent failure, and equations for predicting mean-time-to-failure. Furthermore, effects such as stress, Joule heating, current crowding, and oxidation on electromigration are covered, and the new and modified mean-time-to-failure equations based on low entropy production are given. Readers will be able to apply this information to the design and application of microelectronic devices to minimize the risk of electromigration-induced failure in microelectronic devices. This book essential for anyone who wants to understand these critical elements and minimize their effects. It is particularly valuable for both graduate students of electrical engineering and materials science engineering and engineers working in the semiconductor and electronic packaging technology industries.
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