Xingcun Colin Tong Ph.D's Books

Advanced Materials for Integrated Optical Waveguides

By: Xingcun Colin Tong Ph.D

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Advanced Materials for Integrated Optical Waveguides

By: Xingcun Colin Tong Ph.D

This book provides a comprehensive introduction to integrated optical waveguides for information technology and data communications. Integrated coverage ranges from advanced materials, fabrication, and characterization techniques to guidelines for design and simulation. A concluding chapter offers perspectives on likely future trends and challenges. The dramatic scaling down of feature sizes has driven exponential improvements in semiconductor productivity and performance in the past several decades. However, with the potential of gigascale integration, size reduction is approaching a physical limitation due to the negative impact on resistance and inductance of metal interconnects with current copper-trace based technology. Integrated optics provides a potentially lower-cost, higher performance alternative to electronics in optical communication systems. Optical interconnects, in which light can be generated, guided, modulated, amplified, and detected, can provide greater bandwidth, lower power consumption, decreased interconnect delays, resistance to electromagnetic interference, and reduced crosstalk when integrated into standard electronic circuits. Integrated waveguide optics represents a truly multidisciplinary field of science and engineering, with continued growth requiring new developments in modeling, further advances in materials science, and innovations in integration platforms. In addition, the processing and fabrication of these new devices must be optimized in conjunction with the development of accurate and precise characterization and testing methods. Students and professionals in materials science and engineering will find Advanced Materials for Integrated Optical Waveguides to be an invaluable reference for meeting these research and development goals.

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Page Count

574

Publisher

Springer Science & Business Media

Published Date

ISBN 10

3319015508

ISBN 13

9783319015507

Advanced Materials for Thermal Management of Electronic Packaging

By: Xingcun Colin Tong

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Advanced Materials for Thermal Management of Electronic Packaging

By: Xingcun Colin Tong

The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.

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Page Count

633

Publisher

Springer Science & Business Media

Published Date

ISBN 10

1441977597

ISBN 13

9781441977595

Advanced Materials for Thermal Management of Electronic Packaging

By: Xingcun Colin Tong Ph.D

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Advanced Materials for Thermal Management of Electronic Packaging

By: Xingcun Colin Tong Ph.D

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Page Count

618

Publisher

Springer

Published Date

ISBN 10

1441977600

ISBN 13

9781441977601

Book's by Xingcun Colin Tong Ph.D

Advanced Materials for Integrated Optical Waveguides

Advanced Materials for Integrated Optical Waveguides

Advanced Materials for Thermal Management of Electronic Packaging

Advanced Materials for Thermal Management of Electronic Packaging

Advanced Materials for Thermal Management of Electronic Packaging

Advanced Materials for Thermal Management of Electronic Packaging

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