Learn to assess electromigration reliability and design more resilient chips in this comprehensive and practical resource. Beginning with fundamental physics and building to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids. Through a detailed review on the role of microstructure, interfaces and processing on electromigration reliability, as well as characterisation, testing and analysis, the book follows the development of on-chip interconnects from microscale to nanoscale. Practical modeling methodologies for statistical analysis, from simple 1D approximation to complex 3D description, can be used for step-by-step development of reliable on-chip wiring stacks and industrial-grade power/ground grids. This is an ideal resource for materials scientists and reliability and chip design engineers.
In this monograph, the authors develop a methodology that allows one to construct and substantiate optimal and suboptimal algorithms to solve problems in computational and applied mathematics. Throughout the book, the authors explore well-known and proposed algorithms with a view toward analyzing their quality and the range of their efficiency. The concept of the approach taken is based on several theories (of computations, of optimal algorithms, of interpolation, interlination, and interflatation of functions, to name several). Theoretical principles and practical aspects of testing the quality of algorithms and applied software, are a major component of the exposition. The computer technology in construction of T-efficient algorithms for computing ε-solutions to problems of computational and applied mathematics, is also explored. The readership for this monograph is aimed at scientists, postgraduate students, advanced students, and specialists dealing with issues of developing algorithmic and software support for the solution of problems of computational and applied mathematics.
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