Shenglin Chang's Books

The Global Silicon Valley Home

Lives and Landscapes Within Taiwanese American Trans-Pacific Culture

By: Shenglin Chang

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The Global Silicon Valley Home

Lives and Landscapes Within Taiwanese American Trans-Pacific Culture

By: Shenglin Chang

The Global Silicon Valley Home takes a close look at how residents (Taiwanese American high-tech engineer families) of the jet-set, wired-to-the-Net, trans-Pacific commuter culture have invented new ways of thinking about how their homes and landscapes reflect their personal identities—ways that enable them to make sense of "living life within two places at once.

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Page Count

298

Publisher

Stanford University Press

Published Date

ISBN 10

080475215X

ISBN 13

9780804752152

The Global Silicon Valley Home

Lives and Landscapes Within Taiwanese American Trans-Pacific Culture

By: Shenglin Chang

Write a review Read reviews Take a Quiz Solve Book Puzzle

The Global Silicon Valley Home

Lives and Landscapes Within Taiwanese American Trans-Pacific Culture

By: Shenglin Chang

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Page Count

298

Publisher

Stanford University Press

Published Date

ISBN 10

080475215X

ISBN 13

9780804752152

In Pursuit of Presence or Prominence?

The Prospect of Chinese Banks' Global Expansion and Their Benchmarks

By: Shenglin Ben,Jiefang Yu,Yue Gu,Jiamin Lv,Lijun Zhang,Huichao Gong,Hanting Gu,Qi Shuai

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In Pursuit of Presence or Prominence?

The Prospect of Chinese Banks' Global Expansion and Their Benchmarks

By: Shenglin Ben,Jiefang Yu,Yue Gu,Jiamin Lv,Lijun Zhang,Huichao Gong,Hanting Gu,Qi Shuai

This book summarizes Chinese banks’ achievements in global markets and examines the differences between Chinese and foreign banks. It also explores the future roadmap of internationalization and the risks involved in the process, in order to provide reference resource for Chinese banks. Based on the CBII (Chinese Bank Internationalization Index), which was first released in 2015, the book introduces the Banks’ Internationalization Index (“BII”) and expands the BII by examining two groups of data, including the number of overseas branches, overseas assets and revenue. In addition it analyzes representative Chinese banks’ internationalization, using 16 of the Global Systemically Important Banks (G-SIBs) as benchmarks.

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Page Count

185

Publisher

Springer

Published Date

ISBN 10

9811077304

ISBN 13

9789811077302

Point-of-Interest Recommendation in Location-Based Social Networks

By: Shenglin Zhao,Michael R. Lyu,Irwin King

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Point-of-Interest Recommendation in Location-Based Social Networks

By: Shenglin Zhao,Michael R. Lyu,Irwin King

This book systematically introduces Point-of-interest (POI) recommendations in Location-based Social Networks (LBSNs). Starting with a review of the advances in this area, the book then analyzes user mobility in LBSNs from geographical and temporal perspectives. Further, it demonstrates how to build a state-of-the-art POI recommendation system by incorporating the user behavior analysis. Lastly, the book discusses future research directions in this area. This book is intended for professionals involved in POI recommendation and graduate students working on problems related to location-based services. It is assumed that readers have a basic knowledge of mathematics, as well as some background in recommendation systems.

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Page Count

110

Publisher

Springer

Published Date

ISBN 10

9811313490

ISBN 13

9789811313493

TSV 3D RF Integration

High Resistivity Si Interposer Technology

By: Shenglin Ma,Yufeng Jin

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TSV 3D RF Integration

High Resistivity Si Interposer Technology

By: Shenglin Ma,Yufeng Jin

TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters. A series of cases are presented, including an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, offering researchers and engineers in microelectronics a uniquely useful handbook to help solve problems in 3D heterogenous RF integration oriented Hr-Si interposer technology. - Provides a detailed demonstration of the design and process development of HR-Si (High-Resistivity Silicon) interposer technology - Presents a series of implementation case studies that detail modeling and simulation, integration, qualification and testing methods - Offers a systematic and comparative literature review of HR-Si interposer technology by topic - Offers solutions to problems with TSV (through silicon via) interposer technology, including high frequency loss and cooling problems - Gives a systematic and accessible accounting on this leading technology

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Page Count

294

Publisher

Elsevier

Published Date

ISBN 10

0323996035

ISBN 13

9780323996037

Book's by Shenglin Chang

The Global Silicon Valley Home

The Global Silicon Valley Home

The Global Silicon Valley Home

The Global Silicon Valley Home

In Pursuit of Presence or Prominence?

In Pursuit of Presence or Prominence?

Point-of-Interest Recommendation in Location-Based Social Networks

Point-of-Interest Recommendation in Location-Based Social Networks

TSV 3D RF Integration

TSV 3D RF Integration

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