Rao Tummala's Books

Microelectronics Packaging Handbook

Subsystem Packaging

By: Rao Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein

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Microelectronics Packaging Handbook

Subsystem Packaging

By: Rao Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein

This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.

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Page Count

662

Publisher

Springer Science & Business Media

Published Date

ISBN 10

0412084511

ISBN 13

9780412084515

Public Administration, Steel Or Plastic Frame

By: V. Bhaskara Rao

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Public Administration, Steel Or Plastic Frame

By: V. Bhaskara Rao

Public Administrative System In India Continuously Spread And Expanded Its Scope Carrying Its Steel Frame For About 40 Years After Independence. Steel Is Symbolic Of Hardness Of Character, Strength, Firmness And Malleability. The Steel Frame Is Now Tempered And Transformed In To Plastic. The System For The Last 20 Years Is Getting Molded To The Needs Of Global Environmental Changes And Undergoing Certain Plastic Surgery. The Volume Contains The Research Papers Of The Author Contributed To Various Seminars, Conferences And Journals. The Papers Are Varied On Different Aspects Of The Discipline And Profession Of Public Adminstration In India.

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Page Count

352

Publisher

Gyan Publishing House

Published Date

ISBN 10

8178356171

ISBN 13

9788178356174

The Political Economy of Federalism in India

By: M. Govinda Rao,Nirvikar Singh

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The Political Economy of Federalism in India

By: M. Govinda Rao,Nirvikar Singh

This is a comprehensive work on India's fiscal federalism. The book surveys and analyses the evolution of fiscal federalism from the angle of political economy and brings to bear analytical skills of a very high order to assess and relate the political and administrative dimensions of India's federal system to fiscal federal issues. The authors present a synthesized framework, combining both economic and political elements in a political economy prism such as the Cente–State relations with not only the political perspectives but also the economic ones with the belief that only such a framework can provide a useful guide to implementable reform of policies.

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Page Count

400

Publisher

Oxford University Press

Published Date

ISBN 10

0199087857

ISBN 13

9780199087853

Design of Shape Memory Alloy (SMA) Actuators

By: Ashwin Rao,A. R. Srinivasa,J. N. Reddy

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Design of Shape Memory Alloy (SMA) Actuators

By: Ashwin Rao,A. R. Srinivasa,J. N. Reddy

This short monograph presents an analysis and design methodology for shape memory alloy (SMA) components such as wires, beams, and springs for different applications. The solid-solid, diffusionless phase transformations in thermally responsive SMA allows them to demonstrate unique characteristics like superelasticity and shape memory effects. The combined sensing and actuating capabilities of such materials allows them to provide a system level response by combining multiple functions in a single material system. In SMA, the combined mechanical and thermal loading effects influence the functionality of such materials. The aim of this book is to make the analysis of these materials accessible to designers by developing a "strength of materials" approach to the analysis and design of such SMA components inspired from their various applications with a review of various factors influencing the design process for such materials.

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Page Count

137

Publisher

Springer

Published Date

ISBN 10

3319031880

ISBN 13

9783319031880

Vehicle Dynamics

By: Rao V. Dukkipati

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Vehicle Dynamics

By: Rao V. Dukkipati

Growing worldwide populations increasingly require faster, safer, and more efficient transportation systems. These needs have led to a renewed interest in high-speed guided ground transportation technology, inspired considerable research, and instigated the development of better analytical and experimental tools. A very significant body of knowledge currently exists, but has primarily remained scattered throughout the literature. Vehicle Dynamics consolidates information from a wide spectrum of sources in the area of guided ground transportation. Each chapter provides a concise, thorough statement of the fundamental theory, followed by illustrative worked examples and exercises. The author also includes a variety of unsolved problems designed to amplify and extend the theory and provide problem-solving experience. The subject of guided ground transportation is vast, but this book brings together the core topics, providing in-depth treatments of topics ranging from system classification, analysis, and response to lading dynamics and rail, air cushion, and maglev systems. In doing so, Vehicle Dynamics offers a singular opportunity for readers to build the solid background needed for solving practical vehicle dynamics problems or pursuing more advanced or specialized studies.

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Page Count

612

Publisher

CRC Press

Published Date

ISBN 10

084930976X

ISBN 13

9780849309762

System on Package

Miniaturization of the Entire System

By: Rao Tummala

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System on Package

Miniaturization of the Entire System

By: Rao Tummala

System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.

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Page Count

807

Publisher

McGraw Hill Professional

Published Date

ISBN 10

0071593322

ISBN 13

9780071593328

A Comprehensive Approach to Congenital Heart Diseases

By: IB Vijayalakshmi,P Syamasundar Rao,Reema Chugh

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A Comprehensive Approach to Congenital Heart Diseases

By: IB Vijayalakshmi,P Syamasundar Rao,Reema Chugh

Congenital heart disease (CHD) is a problem with the structure and function of the heart that is present at birth and is the most common type of birth defect (PubMed Health). This comprehensive guide offers a step by step approach to the diagnosis and management of different types of CHD, at different stages of life. Beginning with an introduction to the development of the foetal cardiovascular system and genetic, the following section discusses the basics of heart examination, radiography and terminology. Each section progresses through different conditions and examines the transition of care into adulthood and long term issues facing adults with CHD. Key points Comprehensive, step by step guide to congenital heart disease (CHD) Covers diagnosis and management of CHD disorders at all stages of life Internationally recognised author and editor team Includes more than 1000 full colour images and illustrations

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Page Count

1134

Publisher

JP Medical Ltd

Published Date

ISBN 10

9350902672

ISBN 13

9789350902677

Fundamentals of Microsystems Packaging

By: Rao Tummala

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Fundamentals of Microsystems Packaging

By: Rao Tummala

LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. You’ll find: *Full coverage of electrical, mechanical, chemical, and materials aspects of each technology *Easy-to-read schematics and block diagrams *Fundamental approaches to all system issues *Examples of all common configurations and technologies—wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others *Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes *Basics of electrical and reliability testing

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Page Count

979

Publisher

McGraw Hill Professional

Published Date

ISBN 10

0071500596

ISBN 13

9780071500593

Five Decades

The National Academy of Letters, India : a Short History of Sahitya Akademi

By: D. S. Rao

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Five Decades

The National Academy of Letters, India : a Short History of Sahitya Akademi

By: D. S. Rao

On the completion of fiftieth year of Sahitya Akademi.

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Page Count

188

Publisher

Sahitya Akademi

Published Date

ISBN 10

8126020601

ISBN 13

9788126020607

Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition

By: Rao Tummala

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Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition

By: Rao Tummala

A fully updated, comprehensive guide to electronic packaging technologies This thoroughly revised resource offers rigorous and complete coverage of microsystems packaging at both the device and system level. You will get in-depth guidance on the latest technologies from academic and industry leaders. New chapters cover topics highly relevant to today's small and ultra-small systems. Fundamentals of Microsystems Packaging, Second Edition, discusses the entire field, from wafer to systems, and clearly explains every major contributing technology. The book details emerging systems, including smart wearables, the Internet of Things, bioelectronics for medical applications, cloud computing, and much more. Microelectronics, photonics, MEMS, sensors, RF, and wireless technologies are fully covered. • Covers the electrical, mechanical, chemical, and materials aspects of each technology • Contains examples of all common configurations and technologies • Written by the leading author in the field

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Page Count

849

Publisher

McGraw Hill Professional

Published Date

ISBN 10

1259861562

ISBN 13

9781259861567

Intraoperative Imaging, An Issue of Neurosurgery Clinics of North America

By: J. Bradley Elder,Ganesh Rao

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Intraoperative Imaging, An Issue of Neurosurgery Clinics of North America

By: J. Bradley Elder,Ganesh Rao

This issue of Neurosurgery Clinics focus on Intraoperative Imaging. Article topics will include historical, current and future intraoperative imaging modality; iMRI suites: history, design, utility and cost-effectiveness; Stereotactic platforms for iMRI; iMRI for tumor: maximizing extent of resection of glioma; IMRI for tumor: combining iMRI with functional MRI; iMRI for tumor: pituitary adenoma; iMRI for tumor: MR thermometry; iMRI for tumor: LITT for spinal tumors; iMRI for functional/epilepsy neurosurgery: DBS placement; iMRI for functional/epilepsy neurosurgery: MR thermometry for mesial temporal epilepsy; iMRI for functional/epilepsy neurosurgery: MR thermometry HIFU; Fluorescence imaging/agents in tumor resection; Intraoperative 3D ultrasound; Intraoperative 3D CT: spine surgery; Intraoperative 3D CT: cranial/functional/trigem; Intraoperative imaging for vascular lesions; Imaging of intraoperative drug delivery; Intraoperative ultrasound for peripheral nerve; and Intraoperative Raman Spectroscopy.

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Page Count

217

Publisher

Elsevier Health Sciences

Published Date

ISBN 10

0323546730

ISBN 13

9780323546737

Fundamentals of Microsystems Packaging

By: Rao Tummala

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Fundamentals of Microsystems Packaging

By: Rao Tummala

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978

Publisher

McGraw Hill Professional

Published Date

ISBN 10

0071418075

ISBN 13

9780071418072

System on Package

Miniaturization of the Entire System

By: Rao Tummala

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System on Package

Miniaturization of the Entire System

By: Rao Tummala

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Page Count

807

Publisher

McGraw Hill Professional

Published Date

ISBN 10

0071593322

ISBN 13

9780071593328

Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition

By: Rao Tummala

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Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition

By: Rao Tummala

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. A fully updated, comprehensive guide to microelectronic device and systems packaging principles and practices This thoroughly revised book offers the latest, comprehensive fundamentals in device and systems packaging technologies and applications. You will get in-depth explanations of the 15 core packaging technologies that make up any electronic system, including electrical design for power, signal, and EMI; thermal design by conduction, convection,and radiation heat transfer; thermo-mechanical failures and reliability;advanced packaging materials at micro and nanoscales; ceramic, organic, glass,and silicon substrates. This resource also discusses passive components such as capacitors, inductors, and resistors and their proximity integration with actives; chip-to-package interconnections and assembly; wafer and panel embedding technologies; 3D packaging with and without TS; RF and millimeter-wave packaging; role of optoelectronics; mems and sensor packaging;encapsulation, molding and sealing; and printed wiring board and its assembly to form end-product systems. Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition introduces the concept of Moore’s Law for packaging, as Moore’s Law for ICs is coming to an end due to physical, material, electrical, and financial limitations. Moore’s Law for Packaging (MLP) can be viewed as interconnecting and integrating many smaller chips with high aggregate transistor density, at higher performance and lower cost than Moore’s Law for ICs. This book lays the groundwork for Moore’s Law for Packaging by showing how I/Os have evolved from one package family node to the next, starting with

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Page Count

848

Publisher

McGraw-Hill Education

Published Date

ISBN 10

1259861554

ISBN 13

9781259861550

Book's by Rao Tummala

Microelectronics Packaging Handbook

Microelectronics Packaging Handbook

Public Administration, Steel Or Plastic Frame

Public Administration, Steel Or Plastic Frame

The Political Economy of Federalism in India

The Political Economy of Federalism in India

Design of Shape Memory Alloy (SMA) Actuators

Design of Shape Memory Alloy (SMA) Actuators

Vehicle Dynamics

Vehicle Dynamics

System on Package

System on Package

A Comprehensive Approach to Congenital Heart Diseases

A Comprehensive Approach to Congenital Heart Diseases

Fundamentals of Microsystems Packaging

Fundamentals of Microsystems Packaging

Five Decades

Five Decades

Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition

Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition

Intraoperative Imaging, An Issue of Neurosurgery Clinics of North America

Intraoperative Imaging, An Issue of Neurosurgery Clinics of North America

Fundamentals of Microsystems Packaging

Fundamentals of Microsystems Packaging

System on Package

System on Package

Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition

Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition

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