Title

Quizzes

Clubs

Login

Join

Book's by Randy Hsiao-Yu Lo

Covers

List

Semiconductor Packaging

Materials Interaction and Reliability

By: Andrea Chen,Randy Hsiao-Yu Lo

Write a review Read reviews Take a Quiz Solve Book Puzzle

Semiconductor Packaging

Materials Interaction and Reliability

By: Andrea Chen,Randy Hsiao-Yu Lo

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.

Average ratings

N/A

5

0%

4

0%

3

0%

2

0%

1

0%

Write a review

Solve jigsaw puzzle

Age

Page Count

216

Publisher

CRC Press

Published Date

ISBN 10

1439862079

ISBN 13

9781439862070

Semiconductor Packaging

Materials Interaction and Reliability

By: Andrea Chen,Randy Hsiao-Yu Lo

Write a review Read reviews Take a Quiz Solve Book Puzzle

Semiconductor Packaging

Materials Interaction and Reliability

By: Andrea Chen,Randy Hsiao-Yu Lo

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.

Average ratings

N/A

5

0%

4

0%

3

0%

2

0%

1

0%

Write a review

Solve jigsaw puzzle

Age

Page Count

218

Publisher

CRC Press

Published Date

ISBN 10

1000218619

ISBN 13

9781000218619

Book's by Randy Hsiao-Yu Lo

Semiconductor Packaging

Semiconductor Packaging

Semiconductor Packaging

Semiconductor Packaging

Username

Password

Username

Password

Password again

Birthday

Email