Preface Testing Integrated Circuits for manufacturing defects includes four basic disciplines. First of all an understanding of the origin and behaviour of defects. Secondly, knowledge of IC design and IC design styles. Thirdly, knowledge of how to create a test program for an IC which is targeted on detecting these defects, and finally, understanding of the hardware, Automatic Test Equipment, to run the test on. All four items have to be treated, managed, and to a great extent integrated before the term 'IC quality' gets a certain meaning and a test a certain measurable value. The contents of this book reflects our activities on testability concepts for complex digital ICs as performed at Philips Research Laboratories in Eindhoven, The Netherlands. Based on the statements above, we have worked along a long term plan, which was based on four pillars. 1. The definition of a test methodology suitable for 'future' IC design styles, 2. capable of handling improved defect models, 3. supported by software tools, and 4. providing an easy link to Automatic Test Equipment. The reasoning we have followed was continuously focused on IC qUality. Quality expressed in terms of the ability of delivering a customer a device with no residual manufacturing defects. Bad devices should not escape a test. The basis of IC quality is a thorough understanding of defects and defect models.
Solid-State NMR is a branch of Nuclear Magnetic Resonance which is presently experiencing a phase of strongly increasing popularity. The most striking evidence is the large number of contributions from Solid-State Resonance at NMR meetings, approaching that ofliquid state resonance. Important progress can be observed in the areas of methodological developments and applications to organic and inorganic matter. One volume devoted to more or less one of each of these areas has been published in the preceding three issues. This volume can be considered an addendum to this series. Selected methods and applications of Solid-State NMR are featured in three chapters. The first one treats the recoupling of dipolar interactions in solids, which are averaged by fast sample rotation. Following an introduction to effective Hamiltonians and Floquet theory, different types of experiment such as rotary resonance, dipolar chemical shift correlation spectroscopy, rotational resonance and multipulse recoupling are treated in the powerful Floquet formalism. In the second chapter, the different approaches to line narrowing of quadrupolar nuclei are reviewed in a. consistent formulation of double resonance (DaR) and dynamic angle spinning (DAS). Practical aspects of probe design are considered as well as advanced 2D experiments, sensitivity enhancement techniques, and spinning sideband manipulations. The use of such techniques dramatically increases the number of nuclei which can be probed in high resolution NMR spectroscopy. The final chapter describes new experimental approaches and results of structural studies of noncrystalline solids.
Preface Testing Integrated Circuits for manufacturing defects includes four basic disciplines. First of all an understanding of the origin and behaviour of defects. Secondly, knowledge of IC design and IC design styles. Thirdly, knowledge of how to create a test program for an IC which is targeted on detecting these defects, and finally, understanding of the hardware, Automatic Test Equipment, to run the test on. All four items have to be treated, managed, and to a great extent integrated before the term 'IC quality' gets a certain meaning and a test a certain measurable value. The contents of this book reflects our activities on testability concepts for complex digital ICs as performed at Philips Research Laboratories in Eindhoven, The Netherlands. Based on the statements above, we have worked along a long term plan, which was based on four pillars. 1. The definition of a test methodology suitable for 'future' IC design styles, 2. capable of handling improved defect models, 3. supported by software tools, and 4. providing an easy link to Automatic Test Equipment. The reasoning we have followed was continuously focused on IC qUality. Quality expressed in terms of the ability of delivering a customer a device with no residual manufacturing defects. Bad devices should not escape a test. The basis of IC quality is a thorough understanding of defects and defect models.
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