This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The
Current military historiography has a tendency to portray the military effectiveness of non-western, post-colonial states in broad generalized stereotypes. This monograph examines the militaries of Nigeria, Argentina, Egypt and India in times of crisis to challenge these assumptions. The book shows that despite having broad similarities, each of these states had unique characteristics that impacted their military effectiveness in different ways. These key variables included the military institutions’ maturity and skill sets, the availability and management of human and material resources, and the quality of both civil and military leadership.
Originally published in 2005. Analyzing the impact of FDI on industrial organization in India in the midst of changes wrought by globalization is a daunting task. The Indian economy is large and disparate, with a multitude of economic and political institutions and an unsteady record of policy reform. Drawing comparisons with other Asian economies, this monograph identifies the factors that contribute to the successful creation of globally competitive industries by illustrating the nature of interchange between FDI, indigenous capital, industry policy and institutions. It also analyzes the contribution of foreign affiliates and domestic enterprises to industrial development. Using case studies and quantitative analysis, the work reveals new and significant features of Indian business and industry. In view of the recent interest generated regarding India's prowess in high technology sectors and its potential to be the next economic 'powerhouse', the empirical analyses and issues raised in this book are both timely and comprehensive.
This study offers a panoramic view of the evolution of the South Asian state's military system and its contribution to the effectiveness of the state itself."--BOOK JACKET.
Urban Management Programme Paper No. 20. Reviews the specific actions that municipalities and city governments may take in contributing to urban poverty reduction. The paper highlights example of issues, options, and constraints that urban governments must address in fighting poverty. It focuses on municipalities and other city-level government entities as a critical institutional level of intervention. Other language editions available: French--Stock No. 13814 (ISBN 0-8213-3814-5); Spanish--Stock No. 13813 (ISBN 0-8213-3813-7).
Now, enjoy the improvised edtion of VIKRAM & THE VAMPIRE. It is an abridged collection of the 11 most entertaining tales and legends of "Vetala Panchavimshati". It is the series of spellbinding stories told to the wise King Vikramaditya by the wily ghost Vetaal., the Vampire. Sir Richard Burton abridged and translated and her wife Isabel Burton edited the original Sanskrit works. It was first published by Kama Shastra Society of London-Benares; for private circulation only in 1870. No doubt Bruton was fascinated by Sanskrit as were other open-minded free thinkers since India was colonised by England at the beginning of the 17th-century. He explained the terms as he conceived, half or full or none. So, Pradeep Thakur has completely replaced the Footnotes, with a detailed glossary. The Glossary goes full-length of about 200 pages; with great detail and all possible information to each term, so it could be critically analysed and be understandable in true sense.
This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The
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