Emmy Award Winning Artist Ning Yeh releases volume 3 of a four book series titled "108 Flowers". This volume adds yet another step-by-step illustration to his already extensive portfolio of instructional books. 108 Flowers by Ning Yeh is being described by one of his A+ students as being an "Encyclopedia" to painting flowers for the Chinese Brush artist! Explore Ning's third volume as he walks the reader through illustrations of the third set of twenty-seven flowers. Ning starts with an introduction of materials and flower painting basics. Each flower subject has step-by-step notes on color preparation, brush use, and composition detail. The instruction is outlined with an introduction of each flower using a picture of the finished composition, an original by Ning Yeh, accompanied with the English name of the flower and its Chinese name and meaning. He details each stroke on the original painting with numeric sequence in step-by-step fashion. Follow his notations and you will complete twenty-seven different subjects and twenty-eight completed compositions from beginning to end. Subjects in book 3 include Hollyhock, Hyacinth, Hydrangea, Iris, Japanese Iris, Jasmine, Kapok, Lantern Hibiscus, Lichee, Lilac, Lily, Lily of the Nile, Lily of the Valley, Loquat, Lotus, Magnolia, Manihot Hibiscus, Morning Glory, Myrtle, Narcissus, Night Bloom, Orchid, Orchid Tree, Paeonia, Pansy, Passion, Peach Blossom"--Amazon.com.
Because of her background, she had been framed by her fiance and sister. Once she was reborn, the heavens had given her a similar identity. How was she going to use her 'resources' to take revenge this time?!
Thin films are widely used in the electronic device industry. As the trend for miniaturization of electronic devices moves into the nanoscale domain, the reliability of thin films becomes an increasing concern. Building on the author's previous book, Electronic Thin Film Science by Tu, Mayer and Feldman, and based on a graduate course at UCLA given by the author, this new book focuses on reliability science and the processing of thin films. Early chapters address fundamental topics in thin film processes and reliability, including deposition, surface energy and atomic diffusion, before moving onto systematically explain irreversible processes in interconnect and packaging technologies. Describing electromigration, thermomigration and stress migration, with a closing chapter dedicated to failure analysis, the reader will come away with a complete theoretical and practical understanding of electronic thin film reliability. Kept mathematically simple, with real-world examples, this book is ideal for graduate students, researchers and practitioners.
The special focus of this book is the lives and experiences of women in China in the first half of the 20th century. Part One - Historical Interpretations - presents essays by Western-educated Chinese women and men, on the historical role of women in a time of great social and economic upheaval. Part Two - Self-Portraits of Women in Modern China - presents the views of women who experienced life in this period through essays and autobiographies that range from women as concubines to women as factory workers, from women suffering footbinding to women serving as nurses, from women in traditional role in a traditional family to women as scientists and teachers.
This book analyzes how the English as a Second Language (ESL) pedagogic genre has been re-contextualized in the Shanghai Foreign Language Education Press National College English Teaching Contest (SFLEP) for presentation to the contest judges and audience. Departing from prior research on contest discourse, it focuses on the role of teaching contests in re-contextualizing educational practices. Moreover, it addresses the processes of genre blurring and solidification at work in new discourse events. The results presented here serve to frame teaching contest discourse in a fuller contextual configuration and will help contest sponsors, participants, and audience members better understand this popular social event and its relations to real-world teaching practices, while simultaneously helping teachers to understand the relevance of such contest practice. Moreover, the research methods will benefit those linguists who are interested in researching other types of event discourses.
In the context of globalization, this book explores female-themed art films from China and Germany, in order to seek and illustrate how the cultural difference between the ways of representing women and narrating women's themes is shown in the films of both countries.
This book explores female-themed art films from China and Germany and seeks to illustrate how the cultural difference between the ways of representing women and narrating women's themes is shown in both countries' films, by means of analyzing two film elements: mise-en-scène and cinematography. This book analyzes female-themed art films in five topics: Marriage and Love, Birth and Motherhood, Professional Women and Housewives, Death and Despair, and Dreams and Destiny.
This book presents the applications of nanomaterials and nanostructures in photovoltaic solar cells, elaborates how they can help achieve high photoelectric conversion efficiency, and introduces readers to the important work done in this field. It covers the basic physical properties of semiconductors and nanomaterials, as well as the formation and characteristics of the p–n junction and the heterojunction; the basic working principle and structures of nano photovoltaic cells; the important parts of nano photovoltaic cells, namely nano surface trapping and electrodes; nano solar cells based on quantum dots, quantum wires, and organic-inorganic hybrid nano photovoltaic cells; and some reported high-efficiency photovoltaic cells. It also discusses various device structures and important growth techniques for obtaining nanomaterials for solar cells. The book will serve as a useful reference or textbook for researchers, teachers, engineers, and graduate students.
Must-have reference on electronic packaging technology! The electronics industry is shifting towards system packaging technology due to the need for higher chip circuit density without increasing production costs. Electronic packaging, or circuit integration, is seen as a necessary strategy to achieve a performance growth of electronic circuitry in next-generation electronics. With the implementation of novel materials with specific and tunable electrical and magnetic properties, electronic packaging is highly attractive as a solution to achieve denser levels of circuit integration. The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology.
Because of her background, she had been framed by her fiance and sister. Once she was reborn, the heavens had given her a similar identity. How was she going to use her 'resources' to take revenge this time?!
Multi-cellular organisms eliminate individual cells through a self-destruct process known as apoptosis. Apoptosis is critical for proper development and maintenance of tissue homeostasis. The importance of this process is highlighted by the fact that too much or too little apoptosis is the underlying cause of pathologies such as cancer, autoimmune diseases (e.g., lupus, arthritis), and neurodegenerative disorders (e.g., Parkinson's, Alzheimer's). In the early days, apoptotic cells were identified strictly by cell morphology. Now we know that biochemical signatures define a number of death programs, of which apoptosis is the most widely understood. In this review, we discuss genetic insights gained from C. elegans, the importance of caspases, engulfment of apoptotic cells, apoptotic signals, the role of mitochondria, the Bcl-2 family, and the link between dysfunctional apoptosis and disease. Within each topic, we highlight landmark studies that contributed to our current understanding of apoptosis. All together, this research exemplifies tremendous scientific synergy between the disciplines of genetics, biochemistry, developmental cell biology, and structural biology. Continued exploration into mechanisms that regulate apoptosis will undoubtedly lead to insights into disease processes with potential therapeutic strategies.
In this invaluable resource for graduate students and practicing professionals, Tu and Liu provide a comprehensive account of electromigration and give a practical guide on how to manage its effects in microelectronic devices, especially newer devices that make use of 3D architectures. In the era of big data and artificial intelligence, next-generation microelectronic devices for consumers must be smaller, consume less power, cost less, and, most importantly, have higher functionality and reliability than ever before. However, with miniaturization, the average current density increases, and so does the probability of electromigration failure. This book covers all critical elements of electromigration, including basic theory, various failure modes induced by electromigration, methods to prevent failure, and equations for predicting mean-time-to-failure. Furthermore, effects such as stress, Joule heating, current crowding, and oxidation on electromigration are covered, and the new and modified mean-time-to-failure equations based on low entropy production are given. Readers will be able to apply this information to the design and application of microelectronic devices to minimize the risk of electromigration-induced failure in microelectronic devices. This book essential for anyone who wants to understand these critical elements and minimize their effects. It is particularly valuable for both graduate students of electrical engineering and materials science engineering and engineers working in the semiconductor and electronic packaging technology industries.
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