Title

Login

Join

Book's by Mircea R. Stan

Covers

List

Circadian Rhythms for Future Resilient Electronic Systems

Accelerated Active Self-Healing for Integrated Circuits

By: Xinfei Guo,Mircea R. Stan

Write a review Read reviews Take a Quiz Solve Book Puzzle

Circadian Rhythms for Future Resilient Electronic Systems

Accelerated Active Self-Healing for Integrated Circuits

By: Xinfei Guo,Mircea R. Stan

This book describes methods to address wearout/aging degradations in electronic chips and systems, caused by several physical mechanisms at the device level. The authors introduce a novel technique called accelerated active self-healing, which fixes wearout issues by enabling accelerated recovery. Coverage includes recovery theory, experimental results, implementations and applications, across multiple nodes ranging from planar, FD-SOI to FinFET, based on both foundry provided models and predictive models. Presents novel techniques, tested with experiments on real hardware; Discusses circuit and system level wearout recovery implementations, many of these designs are portable and friendly to the standard design flow; Provides circuit-architecture-system infrastructures that enable the accelerated self-healing for future resilient systems; Discusses wearout issues at both transistor and interconnect level, providing solutions that apply to both; Includes coverage of resilient aspects of emerging applications such as IoT.

Average ratings

N/A

5

0%

4

0%

3

0%

2

0%

1

0%

Solve jigsaw puzzle

Age

Page Count

215

Publisher

Springer

Published Date

ISBN 10

3030200515

ISBN 13

9783030200510

Models and Analysis of Quasistatic Contact

Variational Methods

By: Meir Shillor,Mircea Sofonea,Józef Joachim Telega

Write a review Read reviews Take a Quiz Solve Book Puzzle

Models and Analysis of Quasistatic Contact

Variational Methods

By: Meir Shillor,Mircea Sofonea,Józef Joachim Telega

The mathematical theory of contact mechanics is a growing field in engineering and scientific computing. This book is intended as a unified and readily accessible source for mathematicians, applied mathematicians, mechanicians, engineers and scientists, as well as advanced students. The first part describes models of the processes involved like friction, heat generation and thermal effects, wear, adhesion and damage. The second part presents many mathematical models of practical interest and demonstrates the close interaction and cross-fertilization between contact mechanics and the theory of variational inequalities. The last part reviews further results, gives many references to current research and discusses open problems and future developments. The book can be read by mechanical engineers interested in applications. In addition, some theorems and their proofs are given as examples for the mathematical tools used in the models.

Average ratings

N/A

5

0%

4

0%

3

0%

2

0%

1

0%

Solve jigsaw puzzle

Age

Page Count

288

Publisher

Springer Science & Business Media

Published Date

ISBN 10

3540229159

ISBN 13

9783540229155