The Public Administration Theory Primer explores how the science and art of public administration is definable, describable, replicable, and cumulative. The authors survey a broad range of theories and analytical approaches—from public institutional theory to theories of governance—and consider which are the most promising, influential, and important for the field. This book paints a full picture of how these theories contribute to, and explain, what we know about public administration today. The third edition is fully revised and updated to reflect the latest developments and research in the field including more coverage of governments and governance, feminist theory, emotional labor theory, and grounded research methodology. Expanded chapter conclusions and a brand-new online supplement with sample comprehensive exam questions and summary tables make this an even more valuable resource for all public administration students.
This book provides a comprehensive review of the primary industrial hygiene topics relevant to semiconductor processing: chemical and physical agents, and ventilation systems. The book also has excellent chapters on newer industrial hygiene concerns that are not specific to the semiconductor industry: ergonomics, indoor air quality, personal protective equipment, plan review, and records retention. While much of the information in these chapters can be applied to all industries, the focus and orientation is specific to issues in the semiconductor industry.
Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. - Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics - Includes coverage of environmentally friendly 'green encapsulants' - Presents coverage of faults and defects, and how to analyze and avoid them
This will help us customize your experience to showcase the most relevant content to your age group
Please select from below
Login
Not registered?
Sign up
Already registered?
Success – Your message will goes here
We'd love to hear from you!
Thank you for visiting our website. Would you like to provide feedback on how we could improve your experience?
This site does not use any third party cookies with one exception — it uses cookies from Google to deliver its services and to analyze traffic.Learn More.