The first book on Prognostics and Health Management of Electronics Recently, the field of prognostics for electronic products has received increased attention due to the potential to provide early warning of system failures, forecast maintenance as needed, and reduce life cycle costs. In response to the subject's growing interest among industry, government, and academic professionals, this book provides a road map to the current challenges and opportunities for research and development in Prognostics and Health Management (PHM). The book begins with a review of PHM and the techniques being developed to enable a prognostics approach for electronic products and systems. building on this foundation, the book then presents the state of the art in sensor systems for in-situ health and usage monitoring. Next, it discusses the various models and algorithms that can be utilized in PHM. Finally, it concludes with a discussion of the opportunities in future research. Readers can use the information in this book to: Detect and isolate faults Reduce the occurrence of No Fault Found (NFF) Provide advanced warning of system failures Enable condition-based (predictive) maintenance Obtain knowledge of load history for future design, qualification, and root cause analysis Increase system availability through an extension of maintenance cycles and/or timely repair actions Subtract life cycle costs of equipment from reduction in inspection costs, down time, and inventory Prognostics and Health Management of Electronics is an indispensable reference for electrical engineers in manufacturing, systems maintenance, and management, as well as design engineers in all areas of electronics.
Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-reliability guidelines and approaches essential for achieving their life-cycle, cost-effectiveness, and on-time delivery goals. Its uniquely organized, time-phased approach to design, development, qualification, manufacture, and in-service management shows you step-by-step how to: * Define realistic system requirements in terms of mission profile, operating life, performance expectations, size, weight, and cost * Define the system usage environment so that all operating, shipping, and storage conditions, including electrical, thermal, radiation, and mechanical loads, are assessed using realistic data * Identify potential failure modes, sites, mechanisms, and architecture-stress interactions--PLUS appropriate measures you can take to reduce, eliminate, or accommodate expected failures * Characterize materials and processes by the key controllable factors, such as types and levels of defects, variations in material properties and dimensions, and the manufacturing and assembly processes involved * Use experiment, step-stress, and accelerated methods to ensure optimum design before production begins Detailed design guidelines for substrate...wire and wire, tape automated, and flip-chip bonding...element attachment and case, lead, lead and lid seals--incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions--round out this guide's comprehensive coverage. Detailed guidelines for substrate...wire and wire, tape automated, and flip-chip bonding...element attachment and case, lead, lead and lid seals--incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions--round out this guide's comprehensive coverage. of related interest... PHYSICAL ARCHITECTURE OF VLSI SYSTEMS --Allan D. Kraus, Robert Hannemann and Michael Pecht For the professional engineer involved in the design and manufacture of products containing electronic components, here is a comprehensive handbook to the theory and methods surrounding the assembly of microelectronic and electronic components. The book focuses on computers and consumer electronic products with internal subsystems that reflect mechanical design constraints, cost limitations, and aesthetic and ergonomic concerns. Taking a total system approach to packaging, the book systematically examines: basic chip and computer architecture; design and layout; interassembly and interconnections; cooling scheme; materials selection, including ceramics, glasses, and metals; stress, vibration, and acoustics; and manufacturing and assembly technology. 1994 (0-471-53299-1) pp. SOLDERING PROCESSES AND EQUIPMENT --Michael G. Pecht This comprehensive, fundamentals first handbook outlines the soldering methods and techniques used in the manufacture of microelectronic chips and electronic circuit boards. In a clear, easy-to-access format, the book discusses: soldering processes and classification; the material dynamics of heat soldering when assembling differing materials; wave and reflow soldering; controlling contamination during manufacturing cleanings; techniques for assuring reliability and quality control during manufacturing; rework, repair, and manual assembly; the modern assembly / repair station; and more. The book also provides clear guidelines on assembly techniques as well as an appendix of various solder equipment manufacturers. 1993 (0-471-59167-X) 312 pp.
This book documents the technologies, manufacturing, capabilities, and infrastructure that have made China a major player in the electronics industry. This book covers semiconductors, electronic packages, printed circuit boards, computer hardware and software, telecommunications, and various electronic systems. Other topics include the role of research government, associations, research organizations, educational institutions, science and technology information networks, and major companies in establishing an infrastructure where the electronics industry can flourish. This book is intended for corporate planners, business managers, policy managers, technologists, and engineers. They will find this book useful in assisting them to: ?? Comprehend the current status and future growth of China?fs electronics industry; ?? Understand the cultural, economic, and technological factors that drive and inhibit market access and success in China; ?? Make decisions on strategic issues such as market entry, establishing joint ventures or strategic alliances with Chinese electronics companies in order to access the world?fs largest emerging market;?? Formulate strategy to cooperate and compete in the global electronics industry.In its coverage of the important aspects of the Chinese electronics industry, this book:?? Demonstrates how various factors, such as political structures, government policy, science and technology development, education, and labor force, have contributed to the growth and performance of the industry; ?? Reviews Chinese economy in the post-reform period, including general economic status, specialized economic zones, monetary and fiscal policies, foreign direct investment and trade, as well as Sino-U.S. economic relations; ?? Outlines the development of China?fs electronics industry, foreign trade and investment in the electronics industry, and national planning; ?? Evaluates major segments of China?fs electronics industry, such as semiconductors, computer hardware and software, telecommunications, and electronics systems; ?? Includes valuable site reports for key companies and other organizations; ?? Provides statistical information and numerous tables and figures that illustrate the text.
An Integrated Approach to Product Development Reliability Engineering presents an integrated approach to the design, engineering, and management of reliability activities throughout the life cycle of a product, including concept, research and development, design, manufacturing, assembly, sales, and service. Containing illustrative guides that include worked problems, numerical examples, homework problems, a solutions manual, and class-tested materials, it demonstrates to product development and manufacturing professionals how to distribute key reliability practices throughout an organization. The authors explain how to integrate reliability methods and techniques in the Six Sigma process and Design for Six Sigma (DFSS). They also discuss relationships between warranty and reliability, as well as legal and liability issues. Other topics covered include: Reliability engineering in the 21st Century Probability life distributions for reliability analysis Process control and process capability Failure modes, mechanisms, and effects analysis Health monitoring and prognostics Reliability tests and reliability estimation Reliability Engineering provides a comprehensive list of references on the topics covered in each chapter. It is an invaluable resource for those interested in gaining fundamental knowledge of the practical aspects of reliability in design, manufacturing, and testing. In addition, it is useful for implementation and management of reliability programs.
This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The
The book comprehensively covers the various aspects of risk modeling and analysis in technological contexts. It pursues a systems approach to modeling risk and reliability concerns in engineering, and covers the key concepts of risk analysis and mathematical tools used to assess and account for risk in engineering problems. The relevance of incorporating risk-based structures in design and operations is also stressed, with special emphasis on the human factor and behavioral risks. The book uses the nuclear plant, an extremely complex and high-precision engineering environment, as an example to develop the concepts discussed. The core mechanical, electronic and physical aspects of such a complex system offer an excellent platform for analyzing and creating risk-based models. The book also provides real-time case studies in a separate section to demonstrate the use of this approach. There are many limitations when it comes to applications of risk-based approaches to engineering problems. The book is structured and written in a way that addresses these key gap areas to help optimize the overall methodology. This book serves as a textbook for graduate and advanced undergraduate courses on risk and reliability in engineering. It can also be used outside the classroom for professional development courses aimed at practicing engineers or as an introduction to risk-based engineering for professionals, researchers, and students interested in the field.
Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics Includes coverage of environmentally friendly 'green encapsulants' Presents coverage of faults and defects, and how to analyze and avoid them
Supply chains for electronic products are primarily driven by consumer electronics. Every year new mobile phones, computers and gaming consoles are introduced, driving the continued applicability of Moore's law. The semiconductor manufacturing industry is highly dynamic and releases new, better and cheaper products day by day. But what happens to long-field life products like airplanes or ships, which need the same components for decades? How do electronic and also non-electronic systems that need to be manufactured and supported of decades manage to continue operation using parts that were available for a few years at most? This book attempts to answer these questions. This is the only book on the market that covers obsolescence forecasting methodologies, including forecasting tactics for hardware and software that enable cost-effective proactive product life-cycle management. This book describes how to implement a comprehensive obsolescence management system within diverse companies. Strategies to the Prediction, Mitigation and Management of Product Obsolescence is a must-have work for all professionals in product/project management, sustainment engineering and purchasing.
The Korean Electronics Industry documents the technologies, manufacturing procedures, capabilities, and infrastructure that have made the Republic of Korea successful in the electronics industry. The book covers the major segments of Korea's electronics industry, including semiconductors, packaging, displays, printed circuit boards, and systems. In addition, this book examines the roles that government, associations, research organizations, educational institutions, and major companies have played in establishing an infrastructure where the industry can flourish.
Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development
Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics Includes coverage of environmentally friendly 'green encapsulants' Presents coverage of faults and defects, and how to analyze and avoid them
The first book on Prognostics and Health Management of Electronics Recently, the field of prognostics for electronic products has received increased attention due to the potential to provide early warning of system failures, forecast maintenance as needed, and reduce life cycle costs. In response to the subject's growing interest among industry, government, and academic professionals, this book provides a road map to the current challenges and opportunities for research and development in Prognostics and Health Management (PHM). The book begins with a review of PHM and the techniques being developed to enable a prognostics approach for electronic products and systems. building on this foundation, the book then presents the state of the art in sensor systems for in-situ health and usage monitoring. Next, it discusses the various models and algorithms that can be utilized in PHM. Finally, it concludes with a discussion of the opportunities in future research. Readers can use the information in this book to: Detect and isolate faults Reduce the occurrence of No Fault Found (NFF) Provide advanced warning of system failures Enable condition-based (predictive) maintenance Obtain knowledge of load history for future design, qualification, and root cause analysis Increase system availability through an extension of maintenance cycles and/or timely repair actions Subtract life cycle costs of equipment from reduction in inspection costs, down time, and inventory Prognostics and Health Management of Electronics is an indispensable reference for electrical engineers in manufacturing, systems maintenance, and management, as well as design engineers in all areas of electronics.
The book comprehensively covers the various aspects of risk modeling and analysis in technological contexts. It pursues a systems approach to modeling risk and reliability concerns in engineering, and covers the key concepts of risk analysis and mathematical tools used to assess and account for risk in engineering problems. The relevance of incorporating risk-based structures in design and operations is also stressed, with special emphasis on the human factor and behavioral risks. The book uses the nuclear plant, an extremely complex and high-precision engineering environment, as an example to develop the concepts discussed. The core mechanical, electronic and physical aspects of such a complex system offer an excellent platform for analyzing and creating risk-based models. The book also provides real-time case studies in a separate section to demonstrate the use of this approach. There are many limitations when it comes to applications of risk-based approaches to engineering problems. The book is structured and written in a way that addresses these key gap areas to help optimize the overall methodology. This book serves as a textbook for graduate and advanced undergraduate courses on risk and reliability in engineering. It can also be used outside the classroom for professional development courses aimed at practicing engineers or as an introduction to risk-based engineering for professionals, researchers, and students interested in the field.
This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The
Supply chains for electronic products are primarily driven by consumer electronics. Every year new mobile phones, computers and gaming consoles are introduced, driving the continued applicability of Moore's law. The semiconductor manufacturing industry is highly dynamic and releases new, better and cheaper products day by day. But what happens to long-field life products like airplanes or ships, which need the same components for decades? How do electronic and also non-electronic systems that need to be manufactured and supported of decades manage to continue operation using parts that were available for a few years at most? This book attempts to answer these questions. This is the only book on the market that covers obsolescence forecasting methodologies, including forecasting tactics for hardware and software that enable cost-effective proactive product life-cycle management. This book describes how to implement a comprehensive obsolescence management system within diverse companies. Strategies to the Prediction, Mitigation and Management of Product Obsolescence is a must-have work for all professionals in product/project management, sustainment engineering and purchasing.
Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them. This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future? Chapters discuss: failure sites, operational loads, and failure mechanism intrinsic device sensitivities electromigration hot carrier aging time dependent dielectric breakdown mechanical stress induced migration alpha particle sensitivity electrostatic discharge (ESD) and electrical overstress latch-up qualification screening guidelines for designing reliability Guidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.
Direct and Allosteric Control of Glutamate Receptors describes in detail recent research that has demonstrated that glutamate receptors are subject to numerous modulatory controls. Significant new insights into the physiology and pathophysiology of the nervous system have been obtained by these discoveries. The sites on the receptor proteins where modulation occurs have provided a platform of opportunities for medicinal chemists to design new therapeutic modalities. These new drugs will be of major significance in treating diseases (such as stroke, Alzheimer's, epilepsy, Parkinson's, Huntington's, neurotrauma, schizophrenia, pain, and anxiety) associated with abnormal excitatory amino acid neurotransmission and function.
This book describes the use of free air cooling to improve the efficiency of, and cooling of, equipment for use in telecom infrastructures. Discussed at length is the cooling of communication installation rooms such as data centers or base stations, and this is intended as a valuable tool for the people designing and manufacturing key parts of communication networks. This book provides an introduction to current cooling methods used for energy reduction, and also compares present cooling methods in use in the field. The qualification methods and standard reliability assessments are reviewed, and their inability to assess the risks of free air cooling is discussed. The method of identifying the risks associated with free air cooling on equipment performance and reliability is introduced. A novel method of assessment for free air cooling is also proposed that utilizes prognostics and health management (PHM). This book also: Describes how the implementation of free air cooling can save energy for cooling within the telecommunications infrastructure. Analyzes the potential risks and failures of mechanisms possible in the implementation of free air cooling, which benefits manufacturers and equipment designers. Presents prognostics-based assessments to identify and mitigate the risks of telecommunications equipment under free air cooling conditions, which can provide the early warning of equipment failures at operation stage without disturbing the data centers' service. Optimum Cooling for Data Centers is an ideal book for researchers and engineers interested in designing and manufacturing equipment for use in telecom infrastructures.
This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material. However, copper wire bonding has several process and reliability concerns due to its material properties. Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation. In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed. The book also discusses best practices and recommendations on the bond process, bond–pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components. In summary, this book: Introduces copper wire bonding technologies Presents copper wire bonding processes Discusses copper wire bonding metallurgies Covers recent advancements in copper wire bonding including the bonding process, equipment changes, bond–pad materials and surface finishes Covers the reliability tests and concerns Covers the current implementation of copper wire bonding in the electronics industry Features 120 figures and tables Copper Wire Bonding is an essential reference for industry professionals seeking detailed information on all facets of copper wire bonding technology.
Every step in the business bankruptcy litigation process is covered in Aspen Publishersand’ Bankruptcy Litigation Manual, from the drafting of the first pleadings through the appellate process. In fact, by making the Bankruptcy Litigation Manual a part of your working library, you not only get detailed coverage of virtually all the topics and issues you must consider in any bankruptcy case, you also get field-tested answers to questions you confront every day, such as: How to stay continuing litigation against a corporate debtorand’s non-debtor officers? What are the limits on suing a bankruptcy trustee? Is the Deprizio Doctrine still alive? Does an individual debtor have an absolute right to convert a case from Chapter 7 to Chapter 13? What prohibitions exist on cross-collateralization in financing disputes? Are option contracts and“executoryand” for bankruptcy purposes? When, and under what circumstances, may a bankruptcy court enjoin an administrative proceeding against a Chapter 11 debtor? What are the current standards for administrative priority claims? When must a creditor assert its setoff rights? When can a remand order issued by a district court be reviewed by a court of appeals? What are the limits on challenging pre-bankruptcy real property mortgage foreclosures as fraudulent transfers? Can an unsecured lender recover contract-based legal fees incurred in post- bankruptcy litigation on issues of bankruptcy law? Is there a uniform federal limitation on perfecting security interests that primes a longer applicable state law period, thus subjecting lenders to a preference attack? Do prior bankruptcy court orders bar a plaintiffand’s later state court suit and warrant removal of the action in federal court? Michael L. Cook, a partner at Schulte Roth and& Zabel LLP in New York and former long-time Adjunct Professor at New York University School of Law, has gathered together some of the countryand’s top bankruptcy litigators to contribute to Bankruptcy Litigation Manual. Contributing Authors: Jay Alix, Southfield, MI Neal Batson, Alston and& Bird, LLP, Atlanta, GA Kenneth K. Bezozo, Haynes and Boone, New York, NY Susan Block-Lieb, Fordham University School of Law, Newark, NJ Peter W. Clapp, Valle Makoff, LLP, San Francisco, CA Dennis J. Connolly, Alston and& Bird, LLP, Atlanta, GA David N. Crapo, Gibbons P.C., Newark, NJ Karen A. Giannelli, Gibbons P.C., Newark, NJ David M. Hillman, Schulte Roth and& Zabel, LLP, New York, NY Alfred S. Lurey, Kilpatrick and& Stockton, Atlanta, GA Gerald Munitz, Butler Rubin, Salterelli and& Boyd, LLP, Chicago, IL Robert L. Ordin, Retired Bankruptcy Court Judge Stephen M. Pezanosky, Haynes and Boone, LLP, Partner and Chair of Bankruptcy Section, Fort Worth, TX Robin E. Phelan, Haynes and Boone, LLP Dallas, TX Daniel H. Squire, Wilmer Cutler Pickering Hale and Dorr, LLP, Washington, DC Michael L. Temin, Fox Rothschild, LLP, Philadelphia, PA Sheldon S. Toll, Law Office ofSheldon S. Toll, Southfield, MI Jason H. Watson, Alston and& Bird, LLP, Atlanta, GA Kit Weitnauer, Alston and& Bird, LLP, Atlanta, GA Written by Mr. Cook and nineteen other experts, Bankruptcy Litigation Manual provides authoritative, up-to-date information on virtually every aspect of the bankruptcy litigation process, from discovery through appeal.
This book describes the use of free air cooling to improve the efficiency of, and cooling of, equipment for use in telecom infrastructures. Discussed at length is the cooling of communication installation rooms such as data centers or base stations, and this is intended as a valuable tool for the people designing and manufacturing key parts of communication networks. This book provides an introduction to current cooling methods used for energy reduction, and also compares present cooling methods in use in the field. The qualification methods and standard reliability assessments are reviewed, and their inability to assess the risks of free air cooling is discussed. The method of identifying the risks associated with free air cooling on equipment performance and reliability is introduced. A novel method of assessment for free air cooling is also proposed that utilizes prognostics and health management (PHM). This book also: Describes how the implementation of free air cooling can save energy for cooling within the telecommunications infrastructure. Analyzes the potential risks and failures of mechanisms possible in the implementation of free air cooling, which benefits manufacturers and equipment designers. Presents prognostics-based assessments to identify and mitigate the risks of telecommunications equipment under free air cooling conditions, which can provide the early warning of equipment failures at operation stage without disturbing the data centers' service. Optimum Cooling for Data Centers is an ideal book for researchers and engineers interested in designing and manufacturing equipment for use in telecom infrastructures.
This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material. However, copper wire bonding has several process and reliability concerns due to its material properties. Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation. In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed. The book also discusses best practices and recommendations on the bond process, bond–pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components. In summary, this book: Introduces copper wire bonding technologies Presents copper wire bonding processes Discusses copper wire bonding metallurgies Covers recent advancements in copper wire bonding including the bonding process, equipment changes, bond–pad materials and surface finishes Covers the reliability tests and concerns Covers the current implementation of copper wire bonding in the electronics industry Features 120 figures and tables Copper Wire Bonding is an essential reference for industry professionals seeking detailed information on all facets of copper wire bonding technology.
A broad and practical reference to IC socket technology The first and only comprehensive resource on IC (Integrated Circuit) socket technology, IC Component Sockets offers a complete overview of socket technology and design in order to provide engineers and their managers with a good understanding of these specialized technologies and the processes for evaluating them. The authors, both acknowledged experts in the field, address all relevant aspects of the subject-including materials, design, performance characteristics, failure modes and mechanisms, and qualification and reliability assessment-with emphasis on the technology's inherent advantages and challenges. Topics of interest include: * Socket design and contact technologies * Performance characteristics and material properties * Contact failure modes and mechanisms * Qualification testing conditions * Qualification sequences and setup * IEEE prediction methodology * Theoretical calculation of contact reliability Including a list of standards and specifications, this book is an important and timely resource for today's electronics engineers concerned with evaluating and perfecting socket design, manufacture, and use.
Rating and Uprating of Electronic Parts is the first practical guide for engineers involved in uprating electronic parts. The aim of the book is to give the reader a well-defined, risk-informed methodology which will enable one to determine whether an electronics part will meet the performance requirements when used outside the manufacturers specified ratings, as listed in the part datasheet.The goal of the book is not to promote or deter the use of parts outside the manufacturer-specified ratings. The goal is to help the electronics industry to use parts in an effective and reliable manner. After studying this book, you will be able to: determine how to find a part that will meet the datasheet specifications of the application environment, including the temperature ratings avoid pitfalls and risks associated using parts outside their rated specifications apply a methodology to uprate a part for your target application conditions mitigate the technical and legal risks associated with the use of parts outside the performance specifications address future trends and needs related to part ratingsWho is this book for?This book is for the component engineers, test engineers, purchase engineers, engineering managers, system engineers, design engineers, quality assurance personnel and manufacturing engineers, associated with the selection, qualification, and management of electronic parts. The book is meant to support the complete supply chain that may make or use uprated parts; including product manufacturers, electrical test laboratories, after-market part suppliers, regulatory bodies, part manufacturers and even legal counsels.
The definitive guide to the clinical and scientific aspects of pulmonary medicine―fully updated with the latest advances in the field A Doody's Core Title for 2023! Fishman’s Pulmonary Diseases and Disorders delivers unparalleled coverage of pulmonary medicine. With nearly 2500 illustrations, 60 videos, and 22,000 references, this peerless, two-volume resource provides a comprehensive overview of the scientific basis of lung function in health and disease. You’ll find detailed coverage of the broad array of disorders affecting the respiratory system, including obstructive and restrictive diseases, pulmonary vascular disorders, sleep-disordered breathing, lung neoplasms, respiratory infections, and respiratory failure. In addition, you’ll learn about all the latest advances, including molecular development of the lung, stem cells and respiratory disease, the genetics of pulmonary disease, the growth of personalized medicine, technical advances in lung transplantation, and much more. Notable new content in the 6th edition includes discussion of the respiratory effects of vaping, detailed consideration of the idiopathic interstitial pneumonitides, state-of the-art discussion of lung nodules, a summary of the use of immunotherapy in the treatment of lung cancer, COVID-19-related lung disease and its management, and a comprehensive discussion of noninvasive ventilation, including its use in ambulatory and ICU settings. In addition, new chapters on cystic lung disease, lung cancer screening, the lung microbiome, developmental lung disorders, nocardiosis and actinomycosis, and application of ECMO are included.
Turn to the field's definitive text for a thoroughunderstanding of the clinical and scientific aspects of pulmonary medicine Since 1980, Fishman's Pulmonary Diseases and Disorders has delivered unparalleled coverage of pulmonary medicine and the underlying basic and applied science upon which clinical practice is based. The Fifth Edition, with 270 contributing authors, includes over 2,000 illustrations, 60 videos, and 18,000 references. The book opens with a comprehensive overview of the scientific basis of lung function in health and disease. It then provides detailed coverage of the broad array of diseases and disorders affecting the respiratory system, including obstructive and restrictive diseases, pulmonary vascular disorders, sleep-disordered breathing, lung neoplasms,respiratory infections, and respiratory failure, among others. The Fifth Edition has been completely updated to reflect the many advancements that have been made in pulmonary medicine over the past few years, including: Molecular development of the lung Stem cells and respiratory disease Genetics of pulmonary disease and the growth of personalized medicine Technical advances in lung transplantation Growth in immunology and immunosuppressive management Diagnosis and treatment of pulmonary hypertension Circadian rhythms and sleep biology Rapid evolution in lung imaging techniques, including functional imaging Contemporary interventional bronchoscopic techniques You will also find state-of-the-art coverage of thelatest topics in critical care medicine, including: Early diagnosis and management of sepsis Multiple organ dysfunction syndrome (MODS) Acute respiratory distress syndrome (ARDS) Management of agitation and delirium in the ICU The newly defined entity of "chronic critical illness
Thank you for visiting our website. Would you like to provide feedback on how we could improve your experience?
This site does not use any third party cookies with one exception — it uses cookies from Google to deliver its services and to analyze traffic.Learn More.