Michael Calce's Books

Strategies to the Prediction, Mitigation and Management of Product Obsolescence

By: Bjoern Bartels,Ulrich Ermel,Peter Sandborn,Michael G. Pecht

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Strategies to the Prediction, Mitigation and Management of Product Obsolescence

By: Bjoern Bartels,Ulrich Ermel,Peter Sandborn,Michael G. Pecht

Supply chains for electronic products are primarily driven by consumer electronics. Every year new mobile phones, computers and gaming consoles are introduced, driving the continued applicability of Moore's law. The semiconductor manufacturing industry is highly dynamic and releases new, better and cheaper products day by day. But what happens to long-field life products like airplanes or ships, which need the same components for decades? How do electronic and also non-electronic systems that need to be manufactured and supported of decades manage to continue operation using parts that were available for a few years at most? This book attempts to answer these questions. This is the only book on the market that covers obsolescence forecasting methodologies, including forecasting tactics for hardware and software that enable cost-effective proactive product life-cycle management. This book describes how to implement a comprehensive obsolescence management system within diverse companies. Strategies to the Prediction, Mitigation and Management of Product Obsolescence is a must-have work for all professionals in product/project management, sustainment engineering and purchasing.

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Page Count

288

Publisher

John Wiley & Sons

Published Date

ISBN 10

1118140648

ISBN 13

9781118140642

Guidebook for Managing Silicon Chip Reliability

By: Michael Pecht,Riko Radojcic,Gopal Rao

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Guidebook for Managing Silicon Chip Reliability

By: Michael Pecht,Riko Radojcic,Gopal Rao

Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them. This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future? Chapters discuss: failure sites, operational loads, and failure mechanism intrinsic device sensitivities electromigration hot carrier aging time dependent dielectric breakdown mechanical stress induced migration alpha particle sensitivity electrostatic discharge (ESD) and electrical overstress latch-up qualification screening guidelines for designing reliability Guidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.

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Page Count

228

Publisher

CRC Press

Published Date

ISBN 10

1351443569

ISBN 13

9781351443562

Electronic Packaging Materials and Their Properties

By: Michael Pecht,Rakish Agarwal,F. Patrick McCluskey,Terrance J. Dishongh,Sirus Javadpour,Rahul Mahajan

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Electronic Packaging Materials and Their Properties

By: Michael Pecht,Rakish Agarwal,F. Patrick McCluskey,Terrance J. Dishongh,Sirus Javadpour,Rahul Mahajan

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include: interconnections printed circuit boards substrates encapsulants dielectrics die attach materials electrical contacts thermal materials solders Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

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Page Count

126

Publisher

CRC Press

Published Date

ISBN 10

135183004X

ISBN 13

9781351830041

Electronics Industry in Taiwan

By: Chung-Shing Lee,Michael Pecht

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Electronics Industry in Taiwan

By: Chung-Shing Lee,Michael Pecht

Taiwan's electronics industry, especially the semiconductor and information products sectors, is characterized by rapid growth and high potential. This book investigates the past performance, current status, and future development of this industry, providing engineers with important data. Corporate business planners and electronics managers will find helpful information for decision making regarding joint ventures and alliances with Taiwanese manufacturers.

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Page Count

169

Publisher

CRC Press

Published Date

ISBN 10

1000658201

ISBN 13

9781000658200

Handbook of Electronic Package Design

By: Michael Pecht

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Handbook of Electronic Package Design

By: Michael Pecht

Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development

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Page Count

910

Publisher

CRC Press

Published Date

ISBN 10

1351829971

ISBN 13

9781351829977

The Protection of Geographical Indications

Law and Practice (Third Edition)

By: Michael Blakeney

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The Protection of Geographical Indications

Law and Practice (Third Edition)

By: Michael Blakeney

In this thoroughly revised and updated third edition, Michael Blakeney investigates the European laws which regulate the use of geographical indications (GIs) in the marketing of agricultural products, food, wines and spirits, and cultural products such as handicrafts. Key updates include new material exploring the 2023 Regulation on GIs for craft and industrial products, and the protection of wine GIs under the Common Organisation of Agricultural Markets (CMO).

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Page Count

733

Publisher

Edward Elgar Publishing

Published Date

ISBN 10

1035332264

ISBN 13

9781035332267

The Chinese Electronics Industry

By: Michael Pecht,Chung-Shing Lee,Wang Yong Wen,Zong Xiang Fu,Jiang Jun Lu

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The Chinese Electronics Industry

By: Michael Pecht,Chung-Shing Lee,Wang Yong Wen,Zong Xiang Fu,Jiang Jun Lu

The Chinese Electronics Industry documents the technologies, capabilities, and infrastructure that has made China a major player in the Asian electronics industry. This book covers the major segments of China's electronics industry, including semiconductors, packaging, printed circuit boards, computer hardware and software, telecommunications, and electronic systems. In addition, this book examines the role of government, research organizations, educational institutions, and major companies in establishing an infrastructure where the industry can flourish. Specifically, this book will help readers: Comprehend the historical developments, current status, and future growth of China's electronics industry Understand the cultural, economic, and technological factors that drive and inhibit market access and success in China Make decisions on strategic issues, such as market entry, establishing joint ventures or strategic alliances with Chinese electronics companies in order to access world's largest emerging market Formulate strategy to cooperate and compete in the global electronics industry

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Page Count

198

Publisher

CRC Press

Published Date

ISBN 10

1351829858

ISBN 13

9781351829854

Prognostics and Health Management of Electronics

By: Michael G. Pecht

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Prognostics and Health Management of Electronics

By: Michael G. Pecht

The first book on Prognostics and Health Management of Electronics Recently, the field of prognostics for electronic products has received increased attention due to the potential to provide early warning of system failures, forecast maintenance as needed, and reduce life cycle costs. In response to the subject's growing interest among industry, government, and academic professionals, this book provides a road map to the current challenges and opportunities for research and development in Prognostics and Health Management (PHM). The book begins with a review of PHM and the techniques being developed to enable a prognostics approach for electronic products and systems. building on this foundation, the book then presents the state of the art in sensor systems for in-situ health and usage monitoring. Next, it discusses the various models and algorithms that can be utilized in PHM. Finally, it concludes with a discussion of the opportunities in future research. Readers can use the information in this book to: Detect and isolate faults Reduce the occurrence of No Fault Found (NFF) Provide advanced warning of system failures Enable condition-based (predictive) maintenance Obtain knowledge of load history for future design, qualification, and root cause analysis Increase system availability through an extension of maintenance cycles and/or timely repair actions Subtract life cycle costs of equipment from reduction in inspection costs, down time, and inventory Prognostics and Health Management of Electronics is an indispensable reference for electrical engineers in manufacturing, systems maintenance, and management, as well as design engineers in all areas of electronics.

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Page Count

335

Publisher

John Wiley & Sons

Published Date

ISBN 10

0470385839

ISBN 13

9780470385838

Advanced Routing of Electronic Modules

By: Michael Pecht,Yeun Tsun Wong

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Advanced Routing of Electronic Modules

By: Michael Pecht,Yeun Tsun Wong

The rapid growth of the electronic products market has created an increasing need for affordable, reliable, high-speed and high-density multi-layer printed circuit boards (PCBs). This book presents the technologies, algorithms, and methodologies for engineers and others developing the next generation of electronic products. A vision of the future in advanced electronics Advanced Routing of Electronic Modules provides both fundamental theory and advanced technologies for improving routing. Beginning chapters discuss approaches to approximate a minimum rectilinear Steiner tree from a minimum spanning tree and introduce ways to avoid obstacles for routing simple multi-terminal nets sequentially in a workspace. Timing delay, clock skew, and noise control requirements in signal integrity are described as well as computer-aided approaches to managing these requirements in high-speed PCB/MCM routing. Later chapters present the two-layer wiring problem, rip-up and reroute approaches, and parallel routing, including global routing, boundary crossing placement, and detailed maze routing in hardware acceleration. Data structures, data management, and algorithms for parallel routing in a multiple-processor hardware systems are also covered.

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Page Count

472

Publisher

CRC Press

Published Date

ISBN 10

1040292410

ISBN 13

9781040292419

Risk-Based Engineering

An Integrated Approach to Complex Systems—Special Reference to Nuclear Plants

By: Prabhakar V. Varde,Michael G. Pecht

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Risk-Based Engineering

An Integrated Approach to Complex Systems—Special Reference to Nuclear Plants

By: Prabhakar V. Varde,Michael G. Pecht

The book comprehensively covers the various aspects of risk modeling and analysis in technological contexts. It pursues a systems approach to modeling risk and reliability concerns in engineering, and covers the key concepts of risk analysis and mathematical tools used to assess and account for risk in engineering problems. The relevance of incorporating risk-based structures in design and operations is also stressed, with special emphasis on the human factor and behavioral risks. The book uses the nuclear plant, an extremely complex and high-precision engineering environment, as an example to develop the concepts discussed. The core mechanical, electronic and physical aspects of such a complex system offer an excellent platform for analyzing and creating risk-based models. The book also provides real-time case studies in a separate section to demonstrate the use of this approach. There are many limitations when it comes to applications of risk-based approaches to engineering problems. The book is structured and written in a way that addresses these key gap areas to help optimize the overall methodology. This book serves as a textbook for graduate and advanced undergraduate courses on risk and reliability in engineering. It can also be used outside the classroom for professional development courses aimed at practicing engineers or as an introduction to risk-based engineering for professionals, researchers, and students interested in the field.

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579

Publisher

Springer

Published Date

ISBN 10

9811300909

ISBN 13

9789811300905

Copper Wire Bonding

By: Preeti S Chauhan,Anupam Choubey,ZhaoWei Zhong,Michael G Pecht

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Copper Wire Bonding

By: Preeti S Chauhan,Anupam Choubey,ZhaoWei Zhong,Michael G Pecht

This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material. However, copper wire bonding has several process and reliability concerns due to its material properties. Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation. In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed. The book also discusses best practices and recommendations on the bond process, bond–pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components. In summary, this book: Introduces copper wire bonding technologies Presents copper wire bonding processes Discusses copper wire bonding metallurgies Covers recent advancements in copper wire bonding including the bonding process, equipment changes, bond–pad materials and surface finishes Covers the reliability tests and concerns Covers the current implementation of copper wire bonding in the electronics industry Features 120 figures and tables Copper Wire Bonding is an essential reference for industry professionals seeking detailed information on all facets of copper wire bonding technology.

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Page Count

254

Publisher

Springer Science & Business Media

Published Date

ISBN 10

1461457610

ISBN 13

9781461457619

The Anglo-Saxon Library

By: Michael Lapidge

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The Anglo-Saxon Library

By: Michael Lapidge

This invaluable study sets out the evidence for the nature and holdings of libraries in Anglo-Saxon England, from the sixth century to the eleventh. It is furnished with appendices which include editions of all surviving Anglo-Saxon book inventories, lists of those manuscripts exported from and imported into Anglo-Saxon England, and a catalogue of all classical and patristic works cited by Anglo-Saxon authors. The volume is concluded by a comprehensive index (combining the evidence of inventories, surviving manuscripts, and citations) of all classical and patristic writings known in England before 1100.

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Page Count

422

Publisher

Oxford University Press, USA

Published Date

ISBN 10

0199267227

ISBN 13

9780199267224

Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines

A Focus on Reliability

By: Michael Pecht

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Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines

A Focus on Reliability

By: Michael Pecht

Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-reliability guidelines and approaches essential for achieving their life-cycle, cost-effectiveness, and on-time delivery goals. Its uniquely organized, time-phased approach to design, development, qualification, manufacture, and in-service management shows you step-by-step how to: * Define realistic system requirements in terms of mission profile, operating life, performance expectations, size, weight, and cost * Define the system usage environment so that all operating, shipping, and storage conditions, including electrical, thermal, radiation, and mechanical loads, are assessed using realistic data * Identify potential failure modes, sites, mechanisms, and architecture-stress interactions--PLUS appropriate measures you can take to reduce, eliminate, or accommodate expected failures * Characterize materials and processes by the key controllable factors, such as types and levels of defects, variations in material properties and dimensions, and the manufacturing and assembly processes involved * Use experiment, step-stress, and accelerated methods to ensure optimum design before production begins Detailed design guidelines for substrate...wire and wire, tape automated, and flip-chip bonding...element attachment and case, lead, lead and lid seals--incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions--round out this guide's comprehensive coverage. Detailed guidelines for substrate...wire and wire, tape automated, and flip-chip bonding...element attachment and case, lead, lead and lid seals--incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions--round out this guide's comprehensive coverage. of related interest... PHYSICAL ARCHITECTURE OF VLSI SYSTEMS --Allan D. Kraus, Robert Hannemann and Michael Pecht For the professional engineer involved in the design and manufacture of products containing electronic components, here is a comprehensive handbook to the theory and methods surrounding the assembly of microelectronic and electronic components. The book focuses on computers and consumer electronic products with internal subsystems that reflect mechanical design constraints, cost limitations, and aesthetic and ergonomic concerns. Taking a total system approach to packaging, the book systematically examines: basic chip and computer architecture; design and layout; interassembly and interconnections; cooling scheme; materials selection, including ceramics, glasses, and metals; stress, vibration, and acoustics; and manufacturing and assembly technology. 1994 (0-471-53299-1) pp. SOLDERING PROCESSES AND EQUIPMENT --Michael G. Pecht This comprehensive, fundamentals first handbook outlines the soldering methods and techniques used in the manufacture of microelectronic chips and electronic circuit boards. In a clear, easy-to-access format, the book discusses: soldering processes and classification; the material dynamics of heat soldering when assembling differing materials; wave and reflow soldering; controlling contamination during manufacturing cleanings; techniques for assuring reliability and quality control during manufacturing; rework, repair, and manual assembly; the modern assembly / repair station; and more. The book also provides clear guidelines on assembly techniques as well as an appendix of various solder equipment manufacturers. 1993 (0-471-59167-X) 312 pp.

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Page Count

470

Publisher

John Wiley & Sons

Published Date

ISBN 10

0471594466

ISBN 13

9780471594468

The Japanese Electronics Industry

By: Wataru Nakayama,WIlliam Boulton,Michael Pecht

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The Japanese Electronics Industry

By: Wataru Nakayama,WIlliam Boulton,Michael Pecht

The explosive growth of the Japanese electronics industry continues to be driven by a combination of market forces and the unique characteristics of the Japanese social organization and people. As an industrial phenomenon, the Japanese electronics industry receives considerable attention from researchers in various fields. However, most of their studies focus on either historical analyses intent on discovering the secret of the industry's enormous success, or on the issue of America's competitiveness in the face of challenges from Japanese technology. Moreover, none of these studies can be free of the bias that stems from each researcher's own upbringing and environment. The authors of The Japanese Electronics Industry have pooled their diverse experience and talents to create a balanced, objective study of this complex subject. They illuminate the history and characteristics of the industry, show the current state of the industry, and explore the research, development, and education vital to the future of the industry.

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Page Count

156

Publisher

CRC Press

Published Date

ISBN 10

1584880260

ISBN 13

9781584880264

Reliability Engineering

By: Kailash C. Kapur,Michael Pecht

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Reliability Engineering

By: Kailash C. Kapur,Michael Pecht

An Integrated Approach to Product Development Reliability Engineering presents an integrated approach to the design, engineering, and management of reliability activities throughout the life cycle of a product, including concept, research and development, design, manufacturing, assembly, sales, and service. Containing illustrative guides that include worked problems, numerical examples, homework problems, a solutions manual, and class-tested materials, it demonstrates to product development and manufacturing professionals how to distribute key reliability practices throughout an organization. The authors explain how to integrate reliability methods and techniques in the Six Sigma process and Design for Six Sigma (DFSS). They also discuss relationships between warranty and reliability, as well as legal and liability issues. Other topics covered include: Reliability engineering in the 21st Century Probability life distributions for reliability analysis Process control and process capability Failure modes, mechanisms, and effects analysis Health monitoring and prognostics Reliability tests and reliability estimation Reliability Engineering provides a comprehensive list of references on the topics covered in each chapter. It is an invaluable resource for those interested in gaining fundamental knowledge of the practical aspects of reliability in design, manufacturing, and testing. In addition, it is useful for implementation and management of reliability programs.

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Page Count

528

Publisher

John Wiley & Sons

Published Date

ISBN 10

1118841794

ISBN 13

9781118841792

The Korean Electronics Industry

By: Michael Pecht

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The Korean Electronics Industry

By: Michael Pecht

The Korean Electronics Industry documents the technologies, manufacturing procedures, capabilities, and infrastructure that have made the Republic of Korea successful in the electronics industry. The book covers the major segments of Korea's electronics industry, including semiconductors, packaging, displays, printed circuit boards, and systems. In addition, this book examines the roles that government, associations, research organizations, educational institutions, and major companies have played in establishing an infrastructure where the industry can flourish.

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Page Count

152

Publisher

CRC Press

Published Date

ISBN 10

1000154025

ISBN 13

9781000154023

IC Component Sockets

By: Weifeng Liu,Michael Pecht

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IC Component Sockets

By: Weifeng Liu,Michael Pecht

A broad and practical reference to IC socket technology The first and only comprehensive resource on IC (Integrated Circuit) socket technology, IC Component Sockets offers a complete overview of socket technology and design in order to provide engineers and their managers with a good understanding of these specialized technologies and the processes for evaluating them. The authors, both acknowledged experts in the field, address all relevant aspects of the subject-including materials, design, performance characteristics, failure modes and mechanisms, and qualification and reliability assessment-with emphasis on the technology's inherent advantages and challenges. Topics of interest include: * Socket design and contact technologies * Performance characteristics and material properties * Contact failure modes and mechanisms * Qualification testing conditions * Qualification sequences and setup * IEEE prediction methodology * Theoretical calculation of contact reliability Including a list of standards and specifications, this book is an important and timely resource for today's electronics engineers concerned with evaluating and perfecting socket design, manufacture, and use.

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242

Publisher

John Wiley & Sons

Published Date

ISBN 10

0471460508

ISBN 13

9780471460503

Papers on Quintilian and Ancient Declamation

By: Michael Winterbottom

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Papers on Quintilian and Ancient Declamation

By: Michael Winterbottom

Declamation - the practice of training young men to speak in public by setting them to compose and deliver speeches on fictional legal cases - was central to the Greek and Roman educational systems over many centuries and has been the subject of a recent explosion of scholarly interest. The work of Michael Winterbottom has been seminal in this regard, and the present volume brings together a broad selection of his scholarly articles and reviews published since 1964, creating an authoritative and accessible resource for this burgeoning field of study. The assembled papers focus on two related topics: the rhetorician Quintilian and ancient declamation in practice. Quintilian, who taught rhetoric at Rome in the second half of the first century AD, was the author of the Institutio Oratoria, a key text for Roman educational practice, rhetoric, and literary criticism. Subjects explored in the present collection range widely over not only the establishment and interpretation of the text and its literary and historical context, but also Quintilian's views on inspiration, morality, philosophy, and declamation, of which he was a practitioner. While the volume also offers detailed examinations of the texts and interpretations of a wide range of Latin and Greek authors of declamations, such as Seneca the Elder, Sopatros, and Ennodius, there is a particular focus on two collections wrongly attributed to Quintilian, the so-called 'Minor' and 'Major Declamations'. A major re-assessment of the manuscript tradition of the latter collection is published here for the first time.

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Page Count

555

Publisher

Oxford University Press

Published Date

ISBN 10

0192573063

ISBN 13

9780192573063

Word Parts Dictionary

Standard and Reverse Listings of Prefixes, Suffixes, Roots and Combining Forms, 2d ed.

By: Michael J. Sheehan

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Word Parts Dictionary

Standard and Reverse Listings of Prefixes, Suffixes, Roots and Combining Forms, 2d ed.

By: Michael J. Sheehan

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Page Count

297

Publisher

McFarland

Published Date

ISBN 10

078643564X

ISBN 13

9780786435647

Next Generation Microchannel Heat Exchangers

By: Michael M. Ohadi,Kyosung Choo,Serguei Dessiatoun,Edvin Cetegen

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Next Generation Microchannel Heat Exchangers

By: Michael M. Ohadi,Kyosung Choo,Serguei Dessiatoun,Edvin Cetegen

In Next Generation Microchannel Heat Exchangers, the authors’ focus on the new generation highly efficient heat exchangers and presentation of novel data and technical expertise not available in the open literature. Next generation micro channels offer record high heat transfer coefficients with pressure drops much less than conventional micro channel heat exchangers. These inherent features promise fast penetration into many mew markets, including high heat flux cooling of electronics, waste heat recovery and energy efficiency enhancement applications, alternative energy systems, as well as applications in mass exchangers and chemical reactor systems. The combination of up to the minute research findings and technical know-how make this book very timely as the search for high performance heat and mass exchangers that can cut costs in materials consumption intensifies.

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124

Publisher

Springer Science & Business Media

Published Date

ISBN 10

1461407788

ISBN 13

9781461407782

Encapsulation Technologies for Electronic Applications

By: Haleh Ardebili,Jiawei Zhang,Michael G. Pecht

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Encapsulation Technologies for Electronic Applications

By: Haleh Ardebili,Jiawei Zhang,Michael G. Pecht

Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. - Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics - Includes coverage of environmentally friendly 'green encapsulants' - Presents coverage of faults and defects, and how to analyze and avoid them

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Page Count

510

Publisher

William Andrew

Published Date

ISBN 10

0128119799

ISBN 13

9780128119792

Crime and Criminals

By: Michael Newton

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Crime and Criminals

By: Michael Newton

Surveys the growth and development of crime and criminal justice, particularly in the United States; examines particular types of crime; and profiles notable examples.

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129

Publisher

Infobase Publishing

Published Date

ISBN 10

1604136286

ISBN 13

9781604136289

The Art Abandonment Project

Create and Share Random Acts of Art

By: Michael deMeng,Andrea Matus deMeng

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The Art Abandonment Project

Create and Share Random Acts of Art

By: Michael deMeng,Andrea Matus deMeng

Art sharing at its sneakiest!Art sharing at its sneakiest! The Art Abandonment Project is your guide to expressing yourself through random acts of art! Create something for the joy of making it, and then leave it for an unsuspecting person to find--be it on a shelf at the library, a park bench, a table at a coffee shop or anywhere a stranger might stumble upon it. Inside you'll discover fun ideas for monthly abandonment challenges, way to connect with other "abandoneers" in the creative community, the value of sharing with others and more. • Learn the ins and outs of being an abandoneer. • Get ideas and inspiration for monthly abandoning challenges. • See examples of abandoned art, and read the stories of the artists as well as the "finders." • Receive helpful encouragement for letting go of your creations (sometimes it's hard!). • Connect with the Art Abandonment community and learn how to share your own stories with others. Join the art abandonment project, set your art fee and make someone's day!

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Page Count

371

Publisher

Penguin

Published Date

ISBN 10

1440330018

ISBN 13

9781440330018

Cyber Crime & Warfare: All That Matters

By: Peter Warren,Michael Streeter

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Cyber Crime & Warfare: All That Matters

By: Peter Warren,Michael Streeter

In Cyber Crime: All That Matters, Peter Warren and Michael Streeter outline the history, scale and importance of cyber crime. In particular they show how cyber crime, cyber espionage and cyber warfare now pose a major threat to society. After analysing the origins of computer crime among early hackers the authors describe how criminal gangs and rogue states have since moved into the online arena with devastating effect at a time when the modern world - including all the communication services and utilities we have come to take for granted - has become utterly dependent on computers and the internet.

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137

Publisher

John Murray

Published Date

ISBN 10

1444190008

ISBN 13

9781444190007

Influence of Temperature on Microelectronics and System Reliability

A Physics of Failure Approach

By: Pradeep Lall,Michael G. Pecht,Edward B. Hakim

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Influence of Temperature on Microelectronics and System Reliability

A Physics of Failure Approach

By: Pradeep Lall,Michael G. Pecht,Edward B. Hakim

This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The

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332

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CRC Press

Published Date

ISBN 10

0429605595

ISBN 13

9780429605598

Design and Analysis of Accelerated Tests for Mission Critical Reliability

By: Michael J. LuValle,Bruce G. LeFevre,SirRaman Kannan

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Design and Analysis of Accelerated Tests for Mission Critical Reliability

By: Michael J. LuValle,Bruce G. LeFevre,SirRaman Kannan

Early approaches to accelerated testing were based on the assumption that there was a simple acceleration factor that would correspond to a linear scaling of time from the operating stress to the accelerating stress. This corresponds to the simplest physical model of the kinetics governing the underlying degradation, but this simple model does not always hold. We need to understand what more complex physical models may look like. Design & Analysis of Accelerated Tests for Mission Critical Reliability presents innovative theory and methods for recognizing and handling the more complicated, cases often encountered in practice. The theory integrates a physical understanding of underlying phenomena and the statistical modeling of observation "noise" to provide a single theoretical framework for accelerated testing. The treatment includes general approaches that can be used with various computational software packages and an explicit computing environment in S-PLUS. Source code written by the authors is included and available for download from http://www.crcpress.com/e_products/downloads. For practitioners, this book provides immediately useable tools. For researchers, it presents intriguing open questions. And for the academic community, numerous worked examples, end-of-chapter exercises, and a format that relegates technical and theoretical details to chapter appendices make this an outstanding supplementary textbook for senior and graduate-level students.

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249

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CRC Press

Published Date

ISBN 10

1135436193

ISBN 13

9781135436193

The Correspondence of Robert Boyle, 1636-1691 Vol 2

By: Michael Hunter,Antonio Clericuzio,Lawrence M Principe

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The Correspondence of Robert Boyle, 1636-1691 Vol 2

By: Michael Hunter,Antonio Clericuzio,Lawrence M Principe

Robert Boyle (1627-1691) was one of the most influential scientific and theological thinkers of his time. This is the first edition of his correspondence, transcribed from the original manuscripts. It is fully annotated, with an introduction and general index. The four volumes cover the time periods of Volume 1: 1936-91, Volume 2: 1662-5, Volume 3: 1666-7 and finally Volume 4 1668 to 77.

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683

Publisher

Taylor & Francis

Published Date

ISBN 10

1000521761

ISBN 13

9781000521764

The Military and Colonial Destruction of the Roman Landscape of North Africa, 1830-1900

By: Michael Greenhalgh

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The Military and Colonial Destruction of the Roman Landscape of North Africa, 1830-1900

By: Michael Greenhalgh

The French invaded Algeria in 1830, and found a landscape rich in Roman remains, which they proceeded to re-use to support the constructions such as fortresses, barracks and hospitals needed to fight the natives (who continued to object to their presence), and to house the various colonisation projects with which they intended to solidify their hold on the country, and to make it both modern and profitable. Arabs and Berbers had occasionally made use of the ruins, but it was still a Roman and Early Christian landscape when the French arrived. In the space of two generations, this was destroyed, just as were many ancient remains in France, in part because “real” architecture was Greek, not Roman.

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1039

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BRILL

Published Date

ISBN 10

9004271635

ISBN 13

9789004271630

My Pinterest

By: Michael R. Miller

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My Pinterest

By: Michael R. Miller

Step-by-step instructions with callouts to photos that show you exactly what to do on Pinterest Help when you run into problems or limitations Tips and Notes to help you get the most from Pinterest Full-color, step-by-step tasks walk you through getting and keeping Pinterest working just the way you want. Learn how to: • Sign up for Pinterest and find friends to follow • Create new pinboards • Find interesting items to pin • Organize your Pinterest boards • Search Pinterest for interesting items • Repin other people’s pins • Comment on other pins • Pin and play videos • Install the Pinterest bookmarklet in your web browser • Practice proper Pinterest etiquette • Use Pinterest on your iPhone • Create collaborative pinboards • Use Pinterest to promote your business

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466

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Que Publishing

Published Date

ISBN 10

0133070859

ISBN 13

9780133070859

China's Electronics Industry

The Definitive Guide for Companies and Policy Makers with Interest in China

By: Michael G. Pecht

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China's Electronics Industry

The Definitive Guide for Companies and Policy Makers with Interest in China

By: Michael G. Pecht

China's Electronics Industry is a comprehensive and current report on the technologies, manufacturing capabilities, and infrastructure that have made China a major player in the electronics industry. Not only does it cover the past, present, and future of important electronic technologies, but also the pros and cons of conducting business in China. This is an important reference for any company planning a venture in China as well as those who have already taken their first steps. It will also be of great interest to researchers and policy makers who need to know more about the role of central government in promoting strategic industries and assisting national science and technology development. Much of the data contained in the report is from 2006. No country has burst onto the economic scene as dramatically as China has in the past decade. It is the world's largest producer of many electronic products and has a leading edge semiconductor industry. This timely and comprehensive report from America's leading authority is a critical for anyone who is interested in working with China in the electronics field including business managers, academics, government institutes, foreign investors, as well as those who are interested in the past, present and future growth of China's Electronics Industry. If you are thinking about doing business in china's electronics industry, you must have this book.

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267

Publisher

William Andrew

Published Date

ISBN 10

0815516436

ISBN 13

9780815516439

Pediatric Radiological Signs

By: Michael Grunebaum

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Pediatric Radiological Signs

By: Michael Grunebaum

This book offers a systematical, concise approach to a joint pediatric radiological sign of various diseases in the major body system. Each chapter starts with those signs concerned with the newborn period, continues through infancy and childhood to adolescence. It encompasses the congenital anomalies, inflammatory diseases, vascular disorders, tumors and metabolic diseases. The disease entities are arranged in an alphabetical order. The book is intended for the physician in Pediatric-Imaging or in General-Imaging, as well as for those in Pediatrics and its subspecialties. It may be of help to residents in the various professions who are confronted with their board examination. Medical students, in their clinical training, may also find assistance in making use of this reference guide.

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564

Publisher

iUniverse

Published Date

ISBN 10

0595339603

ISBN 13

9780595339600

Book's by Michael Calce

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