This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules. Table of Contents: Introduction / Background on Technologies for Millimeter-Wave Passive Front-Ends / Three-Dimensional Packaging in Multilayer Organic Substrates / Microstrip-Type Integrated Passives / Cavity-Type Integrated Passives / Three-Dimensional Antenna Architectures / Fully Integrated Three-Dimensional Passive Front-Ends / References
This book presents a step-by-step discussion of the design and development of radio frequency identification (RFID) and RFID-enabled sensors on flexible low cost substrates for UHF frequency bands. Various examples of fully function building blocks (design and fabrication of antennas, integration with ICs and microcontrollers, power sources, as well as inkjet-printing techniques) demonstrate the revolutionary effect of this approach in low cost RFID and RFID-enabled sensors fields. This approach could be easily extended to other microwave and wireless applications as well. The first chapter describes the basic functionality and the physical and IT-related principles underlying RFID and sensors technology. Chapter two explains in detail inkjet-printing technology providing the characterization of the conductive ink, which consists of nano-silver-particles, while highlighting the importance of this technology as a fast and simple fabrication technique especially on flexible organic substrates such as Liquid Crystal Polymer (LCP) or paper-based substrates. Chapter three demonstrates several compact inkjet-printed UHF RFID antennas using antenna matching techniques to match IC's complex impedance as prototypes to provide the proof of concept of this technology. Chapter four discusses the benefits of using conformal magnetic material as a substrate for miniaturized high-frequency circuit applications. In addition, in Chapter five, the authors also touch up the state-of-the-art area of fully-integrated wireless sensor modules on organic substrates and show the first ever 2D sensor integration with an RFID tag module on paper, as well as the possibility of 3D multilayer paper-based RF/microwave structures. Table of Contents: Radio Frequency Identification Introduction / Flexible Organic Low Cost Substrates / Benchmarking RFID Prototypes on Organic Substrates / Conformal Magnetic Composite RFID Tags / Inkjet-Printed RFID-Enabled Sensors
Comprehensive reference text for the development of advanced antenna systems for 5G and beyond Smart Antennas for 5G+ addresses the transformation that simple, conventional antennas have gone through to fulfill the complex and challenging performance expectations of 5G wireless communications and beyond. It also describes the 5G physical layer including the gNodeB, basics of the propagation channel, and user equipment (UE) specific antenna aspects. The authors present various broadband antennas covering mmW bands for 5G+ and B5G applications, explore recent developments in array calibration and plane wave generators, and consider future challenges for 5G+ radio system testing. Novel key performance indicators in which not only conventional RF parameters, but also other parameters and overall radio performance, are examined. The huge shrinkage which was prioritized in 4G modules are now combined with extremely versatile and precise beamforming capacities, thermal mitigation, and link budget compensation design strategies that bring antennas into a new era. As such, antenna integration, flexible and 3D printed elements, the use of metamaterials, and advanced testing of new features are key elements of this book. Additional topics covered in Smart Antennas for 5G+ include: Beamforming, beam-steering, power control, cell breathing, and many other 5G concepts that make the evaluation of a 5G antenna structure a complex process Multi-probe anechoic chamber, reverberation chamber, and wireless cable solutions, RF testing of the 5G antenna systems, and small-cell repeaters for 5G/B5G beamforming Powering and sensing applications in 5G+ printed electronic steerable antenna arrays for reconfigurable intelligent surfaces that stem from metasurfaces 3GPP/ITU standards and models for 5G MIMO base station antennas, propagation channel modeling, and link budget considerations The connection between complex but realistically used designs and the way testing has evolved to determine the value of novel designs makes Smart Antennas for 5G+ a must-have resource for advanced engineers as well as newcomers in the field of 5G wireless communications.
This book presents a method that allows the use of multiresolution principles in a time domain electromagnetic modeling technique that is applicable to general structures. The multiresolution time-domain (MRTD) technique, as it is often called, is presented for general basis functions. Additional techniques that are presented here allow the modeling of complex structures using a subcell representation that permits the modeling discrete electromagnetic effects at individual equivalent grid points. This is accomplished by transforming the application of the effects at individual points in the grid into the wavelet domain. In this work, the MRTD technique is derived for a general wavelet basis using a relatively compact vector notation that both makes the technique easier to understand and illustrates the differences between MRTD basis functions. In addition, techniques such as the uniaxial perfectly matched layer (UPML) for arbitrary wavelet resolution and non-uniform gridding are presented. Using these techniques, any structure that can be simulated in Yee-FDTD can be modeled with in MRTD.
RFID (radio-frequency identification) is an emerging communication system technology and one of the most rapidly growing segments of todayOCOs automatic identification data collection industry. This cutting-edge resource offers you a solid understanding of the basic technical principles and applications of RFID-enabled sensor systems. The book provides you with a detailed description of RFID and itOCOs operation, along with a fundamental overview of sensors and wireless sensor networks. Moreover, this practical reference gives you step-by-step guidance on how to design RFID-enabled sensors that form a wireless sensor network. You also find detailed coverage of state-of OCothe-art RFID/sensor technology and worldwide applications.
Learn the fundamentals of integrated communication microsystems Advanced communication microsystems—the latest technology to emerge in the semiconductor sector after microprocessors—require integration of diverse signal processing blocks in a power-efficient and cost-effective manner. Typically, these systems include data acquisition, data processing, telemetry, and power management. The overall development is a synergy among system, circuit, and component-level designs with a strong emphasis on integration. This book is targeted at students, researchers, and industry practitioners in the semiconductor area who require a thorough understanding of integrated communication microsystems from a developer's perspective. The book thoroughly and carefully explores: Fundamental requirements of communication microsystems System design and considerations for wired and wireless communication microsystems Advanced block-level design techniques for communication microsystems Integration of communication systems in a hybrid environment Packaging considerations Power and form factor trade-offs in building integrated microsystems Advanced Integrated Communication Microsystems is an ideal textbook for advanced undergraduate and graduate courses. It also serves as a valuable reference for researchers and practitioners in circuit design for telecommunications and related fields.
This book presents a step-by-step discussion of the design and development of radio frequency identification (RFID) and RFID-enabled sensors on flexible low cost substrates for UHF frequency bands. Various examples of fully function building blocks (design and fabrication of antennas, integration with ICs and microcontrollers, power sources, as well as inkjet-printing techniques) demonstrate the revolutionary effect of this approach in low cost RFID and RFID-enabled sensors fields. This approach could be easily extended to other microwave and wireless applications as well. The first chapter describes the basic functionality and the physical and IT-related principles underlying RFID and sensors technology. Chapter two explains in detail inkjet-printing technology providing the characterization of the conductive ink, which consists of nano-silver-particles, while highlighting the importance of this technology as a fast and simple fabrication technique especially on flexible organic substrates such as Liquid Crystal Polymer (LCP) or paper-based substrates. Chapter three demonstrates several compact inkjet-printed UHF RFID antennas using antenna matching techniques to match IC's complex impedance as prototypes to provide the proof of concept of this technology. Chapter four discusses the benefits of using conformal magnetic material as a substrate for miniaturized high-frequency circuit applications. In addition, in Chapter five, the authors also touch up the state-of-the-art area of fully-integrated wireless sensor modules on organic substrates and show the first ever 2D sensor integration with an RFID tag module on paper, as well as the possibility of 3D multilayer paper-based RF/microwave structures. Table of Contents: Radio Frequency Identification Introduction / Flexible Organic Low Cost Substrates / Benchmarking RFID Prototypes on Organic Substrates / Conformal Magnetic Composite RFID Tags / Inkjet-Printed RFID-Enabled Sensors
Learn the fundamentals of integrated communication microsystems Advanced communication microsystems—the latest technology to emerge in the semiconductor sector after microprocessors—require integration of diverse signal processing blocks in a power-efficient and cost-effective manner. Typically, these systems include data acquisition, data processing, telemetry, and power management. The overall development is a synergy among system, circuit, and component-level designs with a strong emphasis on integration. This book is targeted at students, researchers, and industry practitioners in the semiconductor area who require a thorough understanding of integrated communication microsystems from a developer's perspective. The book thoroughly and carefully explores: Fundamental requirements of communication microsystems System design and considerations for wired and wireless communication microsystems Advanced block-level design techniques for communication microsystems Integration of communication systems in a hybrid environment Packaging considerations Power and form factor trade-offs in building integrated microsystems Advanced Integrated Communication Microsystems is an ideal textbook for advanced undergraduate and graduate courses. It also serves as a valuable reference for researchers and practitioners in circuit design for telecommunications and related fields.
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