Lau Wai Shing's Books

Ulsi Front-end Technology: Covering From The First Semiconductor Paper To Cmos Finfet Technology

By: Wai Shing Lau

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Ulsi Front-end Technology: Covering From The First Semiconductor Paper To Cmos Finfet Technology

By: Wai Shing Lau

The main focus of this book is ULSI front-end technology. It covers from the early history of semiconductor science & technology from 1874 to state-of-the-art FINFET technology in 2016. Some ULSI back-end technology is also covered, for example, the science and technology of MIM capacitors for analog CMOS has been included in this book.

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Page Count

247

Publisher

World Scientific

Published Date

ISBN 10

9813222174

ISBN 13

9789813222175

Infrared Characterization For Microelectronics

By: Wai Shing Lau

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Infrared Characterization For Microelectronics

By: Wai Shing Lau

Most of the books on infrared characterization are for applications in chemistry and no book has been dedicated to infrared characterization for microelectronics. The focus of the book will be on practical applications useful to the production line and to the research and development of microelectronics. The background knowledge and significance of doing a particular type of infrared measurement will be discussed in detail. The principal purpose of the book is to serve as a useful handbook for practising engineers and scientists in the field of microelectronics.

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Page Count

175

Publisher

World Scientific

Published Date

ISBN 10

9814500070

ISBN 13

9789814500074

Benchmark Models of Control System Design for Remotely Operated Vehicles

By: Cheng Siong Chin,Michael Wai Shing Lau

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Benchmark Models of Control System Design for Remotely Operated Vehicles

By: Cheng Siong Chin,Michael Wai Shing Lau

This book is intended to meet the needs of those who seek to develop control systems for ROVs when there is no model available during the initial design stage. The modeling, simulation and application of marine vehicles like underwater robotic vehicles (URVs) are multidisciplinary, and combine mathematical aspects from various engineering disciplines. URVs such as remotely operated vehicle (ROVs) are used for a wide range of applications such as exploring the extreme depths of our ocean, where a hard-wired link is still required. Most ROVs operate in extreme environments with uncertainties in the model prior to control system design. However, the method involved extensive testing before the system model could be used for any control actions. It has been found that the range of error can be extensive and uncertain in actual, continuously varying conditions. Hence, it is important to address the problem of reliance on model testing using different modeling approaches. In this book, approaches such as WAMIT, ANSYS-CFX, STAR CCM+, MATLAB and Simulink are used to model parameters for ROVs. A few benchmark models are provided, allowing researchers and students to explore and test different control schemes. Given its scope, the book offers a valuable reference guide for postgraduate and undergraduate students engaged in modeling and simulation for ROV control.

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Page Count

140

Publisher

Springer Nature

Published Date

ISBN 10

9811565112

ISBN 13

9789811565113

Advanced MEMS Packaging

By: John H. Lau,Cheng Kuo Lee,C. S. Premachandran,Yu Aibin

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Advanced MEMS Packaging

By: John H. Lau,Cheng Kuo Lee,C. S. Premachandran,Yu Aibin

A comprehensive guide to 3D MEMS packaging methods and solutions Written by experts in the field, Advanced MEMS Packaging serves as a valuable reference for those faced with the challenges created by the ever-increasing interest in MEMS devices and packaging. This authoritative guide presents cutting-edge MEMS (microelectromechanical systems) packaging techniques, such as low-temperature C2W and W2W bonding and 3D packaging. This definitive resource helps you select reliable, creative, high-performance, robust, and cost-effective packaging techniques for MEMS devices. The book will also aid in stimulating further research and development in electrical, optical, mechanical, and thermal designs as well as materials, processes, manufacturing, testing, and reliability. Among the topics explored: Advanced IC and MEMS packaging trends MEMS devices, commercial applications, and markets More than 360 MEMS packaging patents and 10 3D MEMS packaging designs TSV for 3D MEMS packaging MEMS wafer thinning, dicing, and handling Low-temperature C2C, C2W, and W2W bonding Reliability of RoHS-compliant MEMS packaging Micromachining and water bonding techniques Actuation mechanisms and integrated micromachining Bubble switch, optical switch, and VOA MEMS packaging Bolometer and accelerameter MEMS packaging Bio-MEMS and biosensor MEMS packaging RF MEMS switches, tunable circuits, and packaging

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Page Count

577

Publisher

McGraw Hill Professional

Published Date

ISBN 10

0071627928

ISBN 13

9780071627924

Hong Kong Night

香港之夜

By: Chan Chi Tak 陳滅,Fan Sin Piu 樊善標,Cheng Ching Hang 鄭政恆,Ng Mei Kwan 吳美筠,Lau Wai Shing 劉偉成,Liu Wai Tong 廖偉棠,Chris Song 宋子江,Chow Hon Fai 周漢輝,Jacky Yuen 阮文略,Zeit Fong 方太初

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Hong Kong Night

香港之夜

Edited by Gilbert C. F. Fong, Shelby K. Y. Chan, Lucas Klein, Bei Dao, Christopher Mattison, and Chris Song, the Poetry and Conflict twenty-two volume box set is an extended edition of the single-volume anthology. Included are twenty-two pocket-sized paperbacks and a complimentary USB (incl. video clips and photos of the previous IPNHK) encased in a fine paper box, containing works by each of the poets included in the anthology, accompanied by English and/or Chinese translations. This collection seeks to make accessible the best of contemporary international poetry with outstanding translations. Each of the twenty-two volumes can be purchased separately."--From publisher's website.

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Page Count

122

Publisher

香港中文大學出版社

Published Date

ISBN 10

9629967480

ISBN 13

9789629967482

Book's by Lau Wai Shing

Ulsi Front-end Technology: Covering From The First Semiconductor Paper To Cmos Finfet Technology

Ulsi Front-end Technology: Covering From The First Semiconductor Paper To Cmos Finfet Technology

Infrared Characterization For Microelectronics

Infrared Characterization For Microelectronics

Benchmark Models of Control System Design for Remotely Operated Vehicles

Benchmark Models of Control System Design for Remotely Operated Vehicles

Advanced MEMS Packaging

Advanced MEMS Packaging

Hong Kong Night

Hong Kong Night

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