Ken Gilleo's Books

Ken Gilleo's Polymer Thick Film provides you with all the essential concepts, process descriptions, performance data, and general information you will need to reach your own conclusions. The focus will be on polymer thick film's major subsets, which include conductive inks, printed resistors, dielectric films or pastes, and polymer assembly material.

*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC)*Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)

This engineering reference covers the most important assembly processes in modern electronic packaging. It includes flip chip assembly and processes, die-attach, and BGA and CSP rework.

This engineering reference covers new techniques in electronic packaging - flip chip, BGA, and MEMs. It includes high density packaging and cleaning options.

This engineering reference covers the most important assembly processes in modern electronic packaging.

While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of appropriate packaging solutions for the protection, assembly, and long term reliable operation. This book rigorously examines the properties of the materials used in MEMS and MOEN assembly then evaluates them in terms of their routing, electrical performance, thermal management and reliability. With this as a starting point, the book moves on to discuss advanced packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging.

This engineering reference covers the most important assembly processes in modern electronic packaging.

This engineering reference covers the most important assembly processes in modern electronic packaging. It includes flip chip assembly and processes, die-attach, and BGA and CSP rework.

Book's by Ken Gilleo

Polymer Thick Film

Polymer Thick Film

Area Array Packaging Handbook: Manufacturing and Assembly

Area Array Packaging Handbook: Manufacturing and Assembly

Area Array Packaging Processes

Area Array Packaging Processes

Area Array Package Design

Area Array Package Design

Area Array Packaging Materials

Area Array Packaging Materials

MEMS/MOEM Packaging

MEMS/MOEM Packaging

Area Array Packaging Materials

Area Array Packaging Materials

Polymer Thick Film

Polymer Thick Film

Area Array Packaging Processes

Area Array Packaging Processes

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