Karl Worthmann's Books

Hierarchical Power Systems: Optimal Operation Using Grid Flexibilities

By: Tim Aschenbruck,Jörg Dickert,Willem Esterhuizen,Bartosz Filipecki,Sara Grundel,Christoph Helmberg,Tobias K. S. Ritschel,Philipp Sauerteig,Stefan Streif,Andreas Wasserrab,Karl Worthmann

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Hierarchical Power Systems: Optimal Operation Using Grid Flexibilities

By: Tim Aschenbruck,Jörg Dickert,Willem Esterhuizen,Bartosz Filipecki,Sara Grundel,Christoph Helmberg,Tobias K. S. Ritschel,Philipp Sauerteig,Stefan Streif,Andreas Wasserrab,Karl Worthmann

This book explains the power grid as a hierarchy made up of the transmission, distribution, and microgrid levels. Interfaces among these levels are explored to show how flexibility in power demand associated with residential batteries can be communicated through the entire grid to facilitate optimal power flow computations within the transmission grid. To realize this approach, the authors combine semi-definite optimal power flow with model-order reduction at the distribution level and with a new heuristic algorithm for stable power flow at the transmission level. To demonstrate its use, a numerical case study based on modified IEEE 9-bus and 33-bus systems for the transmission and distribution grid, respectively, is included. This book shows how exploiting the flexibility on the residential level improves the performance of the power flow with the transmission grid.

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Springer Nature

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ISBN 10

3031256999

ISBN 13

9783031256998

Handbook of Lead-Free Solder Technology for Microelectronic Assemblies

By: Karl J. Puttlitz,Kathleen A. Stalter

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Handbook of Lead-Free Solder Technology for Microelectronic Assemblies

By: Karl J. Puttlitz,Kathleen A. Stalter

This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.

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