John W. Lee's Books

Generalized Linear Models with Random Effects

Unified Analysis via H-likelihood, Second Edition

By: Youngjo Lee,John A. Nelder,Yudi Pawitan

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Generalized Linear Models with Random Effects

Unified Analysis via H-likelihood, Second Edition

By: Youngjo Lee,John A. Nelder,Yudi Pawitan

This is the second edition of a monograph on generalized linear models with random effects that extends the classic work of McCullagh and Nelder. It has been thoroughly updated, with around 80 pages added, including new material on the extended likelihood approach that strengthens the theoretical basis of the methodology, new developments in variable selection and multiple testing, and new examples and applications. It includes an R package for all the methods and examples that supplement the book.

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Page Count

467

Publisher

CRC Press

Published Date

ISBN 10

1351646265

ISBN 13

9781351646260

Reports of Cases Decided in the Court of Chancery

Vol. VI

By: John Hoff Stewart

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Reports of Cases Decided in the Court of Chancery

Vol. VI

By: John Hoff Stewart

Reprint of the original, first published in 1877.

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738

Publisher

BoD – Books on Demand

Published Date

ISBN 10

3385567521

ISBN 13

9783385567528

Understanding Watchman Nee

Spirituality, Knowledge, and Formation

By: Dongsheng John Wu

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Understanding Watchman Nee

Spirituality, Knowledge, and Formation

By: Dongsheng John Wu

This book situates Nee's view within the rich heritage of the Protestant, Catholic, and Eastern Orthodox spiritual traditions, and thus renders Nee's thought more intelligible to Christians of both evangelical and more liberal persuasions. In this book Dongsheng John Wu examines Watchman Nee's thought on the spiritual life, focusing on the relationship between spiritual formation and spiritual knowledge. Different ways of acquiring spiritual understanding are explored, including the respective roles of divine illumination, intellectual studies, and life circumstances. Understanding Watchman Nee begins by synthesizing strategic aspects of Nee's teachings as well as formative events and sources in the development of Nee's own spirituality and theology. It then utilizes the critical work of contemporary theologian Mark McIntosh to bring Nee's voice into dialogue with some important figures in the history of Christian spirituality. Such interactions reveal that Nee's crucial theological convictions exhibit strong parallels with related themes found in the church's spiritual or mystical treasures.

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Page Count

272

Publisher

Wipf and Stock Publishers

Published Date

ISBN 10

1630875732

ISBN 13

9781630875732

Assembly and Reliability of Lead-Free Solder Joints

By: John H. Lau,Ning-Cheng Lee

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Assembly and Reliability of Lead-Free Solder Joints

By: John H. Lau,Ning-Cheng Lee

This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.

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Page Count

545

Publisher

Springer Nature

Published Date

ISBN 10

9811539200

ISBN 13

9789811539206

Henry Lee McFee and Formalist Realism in American Still Life, 1923-1936

By: John Baker

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Henry Lee McFee and Formalist Realism in American Still Life, 1923-1936

By: John Baker

The first full-length study of the life and works of Henry Lee McFee, pioneer American cubist and prominent member of the Woodstock artists colony. McFee's still lifes are considered in detail and a survey of the critics, art theorists, and aestheticians of the period is presented. Nearly 200 illustrations, including 22 color plates. A Center Gallery Publication.

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Page Count

172

Publisher

Bucknell University Press

Published Date

ISBN 10

0838751105

ISBN 13

9780838751107

The Fusarium Laboratory Manual

By: John F. Leslie,Brett A. Summerell

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The Fusarium Laboratory Manual

By: John F. Leslie,Brett A. Summerell

For the first time in over 20 years, a comprehensive collection of photographs and descriptions of species in the fungal genus Fusarium is available. This laboratory manual provides an overview of the biology of Fusarium and the techniques involved in the isolation, identification and characterization of individual species and the populations in which they occur. It is the first time that genetic, morphological and molecular approaches have been incorporated into a volume devoted to Fusarium identification. The authors include descriptions of species, both new and old, and provide protocols for genetic, morphological and molecular identification techniques. The Fusarium Laboratory Manual also includes some of the evolutionary biology and population genetics thinking that has begun to inform the understanding of agriculturally important fungal pathogens. In addition to practical “how-to” protocols it also provides guidance in formulating questions and obtaining answers about this very important group of fungi. The need for as many different techniques as possible to be used in the identification and characterization process has never been greater. These approaches have applications to fungi other than those in the genus Fusarium. This volume presents an introduction to the genus Fusarium, the toxins these fungi produce and the diseases they can cause. "The Fusarium Laboratory Manual is a milestone in the study of the genus Fusarium and will help bridge the gap between morphological and phylogenetic taxonomy. It will be used by everybody dealing with Fusarium in the Third Millenium." --W.F.O. Marasas, Medical Research Council, South Africa

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Page Count

402

Publisher

John Wiley & Sons

Published Date

ISBN 10

0470276460

ISBN 13

9780470276464

Introduction to Corporate Finance: Asia-Pacific Edition with Online Stud Y Tools 12 Months

By: John R. Graham,Scott B. Smart,Christopher Adam,Brindha Gunasingham

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Introduction to Corporate Finance: Asia-Pacific Edition with Online Stud Y Tools 12 Months

By: John R. Graham,Scott B. Smart,Christopher Adam,Brindha Gunasingham

Introduction to Corporate Finance offers a dynamic, modern and practical approach that illustrates how financial management really works. It features up-to-date content including the impact of the Global Financial Crisis and capital budgeting. Introduction to Corporate Finance is distinguished by the cash-flow 'arc' of the narrative, which gives a practical learning path, and the use of real options, which is a practical analysis tool that is used in corporate finance. Students are thus provided with the most engaging and contemporary learning path of any Australian text, giving them realistic preparation for a career in finance. The strong five part framework of the book is supported by integrated online elements and easy-to-read text.

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Page Count

888

Publisher

Cengage AU

Published Date

ISBN 10

017036433X

ISBN 13

9780170364331

Science-fiction & Fantasy Cinema

Classic Films of Horror, Sci-fi & the Supernatural

By: John Howard Reid

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Science-fiction & Fantasy Cinema

Classic Films of Horror, Sci-fi & the Supernatural

By: John Howard Reid

Science-fiction, fantasy and horror movies cover a broad canvas including Frankenstein and Tod Slaughter, Dracula and Donald Duck, moon men and mad doctors, gorillas and crazy scientists, talking mules and helpful angels. Other categories covered in this book include Alien Encounters, Lost Worlds, Space Travel, Monsters, Creepy Old Houses, Phantom Killers, Mystery Thrillers, Animated Cartoons, and Horror Spoofs such as "Abbott and Costello Meet Frankenstein.

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Page Count

321

Publisher

Lulu.com

Published Date

ISBN 10

1430301139

ISBN 13

9781430301134

The Revolution in Virginia, 1775-1783

By: John E. Selby

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The Revolution in Virginia, 1775-1783

By: John E. Selby

Unsurpassed as a single-volume history, John E. Selby's masterpiece analyzes the political, administrative, and military history of Virginia during the American Revolution. Stressing the contributions, in both men and material, that the state made to the new nation's war effort, Shelby shows how Virginia's leaders responded to the need to expand the state's administration and mobilize its people for war while at the same time looking westward to the vast territory beyond the Appalachians. Now available for the first time in paperback and with a new foreword by the historian Don Higginbotham, this classic is a must-read for anyone interested in the origins of our nation.

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Page Count

460

Publisher

Colonial Williamsburg

Published Date

ISBN 10

0879352337

ISBN 13

9780879352332

Greenhouse Gas Control Technologies

Proceedings of the 5th International Conference on Greenhouse Gas Control Technologies

By: David John Williams

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Greenhouse Gas Control Technologies

Proceedings of the 5th International Conference on Greenhouse Gas Control Technologies

By: David John Williams

Contains 220 papers presented at the GHGT-5 held in August 2000.

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Page Count

1373

Publisher

CSIRO PUBLISHING

Published Date

ISBN 10

0643066721

ISBN 13

9780643066724

Chiplet Design and Heterogeneous Integration Packaging

By: John H. Lau

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Chiplet Design and Heterogeneous Integration Packaging

By: John H. Lau

The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

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Page Count

542

Publisher

Springer Nature

Published Date

ISBN 10

9811999171

ISBN 13

9789811999178

Heterogeneous Integrations

By: John H. Lau

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Heterogeneous Integrations

By: John H. Lau

Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.

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Page Count

381

Publisher

Springer

Published Date

ISBN 10

9811372241

ISBN 13

9789811372247

Fan-Out Wafer-Level Packaging

By: John H. Lau

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Fan-Out Wafer-Level Packaging

By: John H. Lau

This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple’s iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers, as well as scientists and researchers, essential details of FOWLP – such as the temporary bonding and de-bonding of the carrier on a reconstituted wafer/panel, epoxy molding compound (EMC) dispensing, compression molding, Cu revealing, RDL fabrication, solder ball mounting, etc. – are not well understood. Intended to help readers learn the basics of problem-solving methods and understand the trade-offs inherent in making system-level decisions quickly, this book serves as a valuable reference guide for all those faced with the challenging problems created by the ever-increasing interest in FOWLP, helps to remove roadblocks, and accelerates the design, materials, process, and manufacturing development of key enabling technologies for FOWLP.

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Page Count

319

Publisher

Springer

Published Date

ISBN 10

9811088845

ISBN 13

9789811088841

America's Military Adversaries

From Colonial Times to the Present

By: John C. Fredriksen

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America's Military Adversaries

From Colonial Times to the Present

By: John C. Fredriksen

This work chronicles the lives and accomplishments of over 200 enemies who have fought, plotted, spied on, and in some instances defeated U.S. forces over the past three centuries. Books on American military heroes abound. But this book is the first to focus on America's talented enemies—the generals, admirals, Indian chiefs and warriors, submarine captains, fighter pilots, and spies who opposed the United States with military force or other means. Often these military leaders were among the best minds of their times. For more than two centuries, the new nation's most constant military opponents were the Native Americans, led by such capable chiefs as American Horse and Little Wolf. Under D'Iberville, Canada's French colonialists became formidable foes, but they were soon surpassed by the rigorously disciplined redcoats of Great Britain under Howe and Cornwallis. Ironically, the most effective enemies in the history of the United States were not the leaders of foreign military forces—like Mexico's Santa Anna, Japan's Yamamoto, or Vietnam's Vo Nguyen Giap. They arose from among its own citizens during the Civil War, the bloodiest conflict in American history.

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Page Count

636

Publisher

Bloomsbury Publishing USA

Published Date

ISBN 10

1576076040

ISBN 13

9781576076040

Organic Syntheses, Volume 96

By: John L Wood

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Organic Syntheses, Volume 96

By: John L Wood

The current volume continues the tradition of the Organic Syntheses series, providing carefully checked and edited experimental procedures that describe important synthetic methods, transformations, reagents, and synthetic building blocks or intermediates with demonstrated utility in organic synthesis. These significant and interesting procedures should prove worthwhile to many synthetic chemists working in increasingly diverse areas. A trusted guide for professionals in organic and medicinal chemistry in academia, government, and industries, including pharmaceuticals, fine chemicals, agrochemicals, and biotechnological products.

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Page Count

648

Publisher

John Wiley & Sons

Published Date

ISBN 10

1119707765

ISBN 13

9781119707769

Theory of the Moon's Motion. Deduced from the Law of Universal Gravitation

By: John Nelson Stockwell

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Theory of the Moon's Motion. Deduced from the Law of Universal Gravitation

By: John Nelson Stockwell

Reprint of the original, first published in 1881.

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Page Count

421

Publisher

BoD – Books on Demand

Published Date

ISBN 10

3385456983

ISBN 13

9783385456983

Semiconductor Advanced Packaging

By: John H. Lau

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Semiconductor Advanced Packaging

By: John H. Lau

The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

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Page Count

513

Publisher

Springer Nature

Published Date

ISBN 10

9811613761

ISBN 13

9789811613760

Book's by John W. Lee

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