This selection from the writings of John Doyle Lee include his autobiography, his confession (regarding the Mountain Meadows Massacre), letters, poems, last words for his families, as well as related historical documents regarding his arrest, trials and execution. The book includes 14 engravings from the 1891 edition, as well as a bibliography.
The South Carolina 2nd Regiment Rifles was organized during the spring of 1862 using the 5th South Carolina Battalion Rifles as its nucleus. It was organized from extra companies initially intended for Orr's Rifles. These companies were organized into a battalion that was officially designated the Fifth South Carolina Infantry Battalion. The unit served in South Carolina, then was ordered to Virginia and assigned to General Jenkins' and Bratton's Brigade. It participated in the Seven Days' Battles and the conflicts at Second Manassas, Sharpsburg, and Fredericksburg. Later the regiment was with Longstreet at Suffolk and D.H. Hill in North Carolina. It moved again with Longstreet but did not take part in the Battle of Chickamauga. The unit was involved in the Knoxville operations, returned to Virginia, and saw action at The Wilderness, Spotsylvania, and Cold Harbor. After enduring the hardships of the Petersburg siege south and north of the James River, it ended the war at Appomattox.
Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.
Investigation of the functional architecture of the human brain using modern noninvasive imaging techniques is a rapidly expanding area of research. A proper knowledge of methodology is needed to appreciate the burgeoning literature in the field. This timely publication provides an excellent catalogue of the main techniques. The authors offer an invaluable analysis of mapping strategies and techniques, providing everything from the foundations to the major pitfalls and practical applications of the modern techniques used in neuroimaging. Contains over 1000 full color pages with more than 200 color figures. Spanning the methodological gamut from the molecular level to the whole brain while discussing anatomy, physiology, and pathology, as well as their integration, Brain Mapping: The Methods, Second Edition, brings the reader a comprehensive, well-illustrated and entirely readable description of the methods for brain mapping. Drs. Toga and Mazziotta provide everything from the foundations to the major pitfalls and practical applications of the technique by assembling an impressive group of experts, all widely known in their field, who contribute an outstanding set of chapters.
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
In new forms of writing this is one of three books which represent stages of a serious artistic search for a modern dialectic of mark, word and image spanning twenty years. With an aesthetic that dissolves conventional boundaries of visual Art and Literature, the abstract alphabetical poem, my it to you and the narrative proem, In the Way of It are both written solely in monosyllables.The selection of spaced prints of alphabetical poems (such as Rubicon) in The Poetry of It was inspired initially by a surrealist experiment in automatic writing in 1988 which triggered an extensive period in which dreams errupted onto the page in the written form of fragmented words. Written in the form of double columns, ‘Mac’s Story’, In The Way of It, gives an account of how these works came to be made along with The Book of It, his humorous satire on contemporary capitalism published in 2010.All three new works celebrate the Centenary of the revolution in visual language made by the avant-gardes in what Marjorie Perloff calls ‘The Futurist Moment’ in Modernist Art.
Edited by the leaders in the fi eld, with chapters from highly renowned international researchers, this is the fi rst coherent overview of the latest in silicon nanomembrane research. As such, it focuses on the fundamental and applied aspects of silicon nanomembranes, ranging from synthesis and manipulation to manufacturing, device integration and system level applications, including uses in bio-integrated electronics, three-dimensional integrated photonics, solar cells, and transient electronics. The first part describes in detail the fundamental physics and materials science involved, as well as synthetic approaches and assembly and manufacturing strategies, while the second covers the wide range of device applications and system level demonstrators already achieved, with examples taken from electronics and photonics and from biomedicine and energy.
Interest in green chemistry and clean processes has grown so much in recent years that topics such as fluorous biphasic catalysis, metal organic frameworks, and process intensification, which were barely mentioned in the First Edition, have become major areas of research. In addition, government funding has ramped up the development of fuel cells and biofuels. This reflects the evolving focus from pollution remediation to pollution prevention. Copiously illustrated with more than 800 figures, the Third Edition provides an update from the frontiers of the field. It features supplementary exercises at the end of each chapter relevant to the chemical examples introduced in each chapter. Particular attention is paid to a new concluding chapter on the use of green metrics as an objective tool to demonstrate proof of synthesis plan efficiency and to identify where further improvements can be made through fully worked examples relevant to the chemical industry. NEW AND EXPANDED RESEARCH TOPICS Metal-organic frameworks Metrics Solid acids for alkylation of isobutene by butanes Carbon molecular sieves Mixed micro- and mesoporous solids Organocatalysis Process intensification and gas phase enzymatic reactions Hydrogen storage for fuel cells Reactive distillation Catalysts in action on an atomic scale UPDATED AND EXPANDED CURRENT EVENTS TOPICS Industry resistance to inherently safer chemistry Nuclear power Removal of mercury from vaccines Removal of mercury and lead from primary explosives Biofuels Uses for surplus glycerol New hard materials to reduce wear Electronic waste Smart growth The book covers traditional green chemistry topics, including catalysis, benign solvents, and alternative feedstocks. It also discusses relevant but less frequently covered topics with chapters such as "Chemistry of Long Wear" and "Population and the Environment." This coverage highlights the importance of chemistry to everyday life and demonstrates the benefits the expanded exploitation of green chemistry can have for society.
The Army Materials and Mechanics Research Center has con ducted the Sagamore Army Materials Research Conference in coop eration with the Materials Science Group of the Department of Chemical Engineering and Materials Science of Syracuse University since 1954. The purpose of the conference has been to gather to gether scientists and engineers from academic institutions, in dustry and government who are uniquely qualified to explore in depth a subject of importance to the Army, the Department of Defense and the scientific community. This volume, Advances in Deformation Processing, addresses the areas of Analytical Advances, Workability, Processing to Optimize Properties, Advanced Applications - Materials, and Advanced Applications - Processes. The dedicated assistance of Mr. Joseph Bernier of the Army Materials and Mechanics Research Center throughout the stages of the conference planning and finally the publication of the Sagamore Conference Proceedings is deeply appreciated. The support of Helen Brown DeMascio of Syracuse University in p- paring the final manuscript is acknowledged. The continued active interest and support of these conferences by Dr. A. E. Gorum, Director of the Army Materials and Mechanics Research Center, is appreciated. Syracuse University Syracuse, New York The Editors vii Contents SESSION I INTRODUCTION A. E. Gorum, Moderator Continuum Mechanics and Deformation Processing 1.
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