From the bestselling authors of the classic What Your Doctor May NOT Tell You books about menopause and pre-menopause comes an easy-to-use guide on balancing hormone levels safely and naturally. Dr. John Lee will help you answer key questions like: Are my symptoms caused by a hormonal imbalance? Which hormones do I need to regain hormone balance? How do I use hormones for optimal health and balance? Plus, learn how and when to use estrogen, testosterone and progesterone cream, in simple, effective language. If you want the ABCs of using natural hormones, this book is for you.
This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple’s iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers, as well as scientists and researchers, essential details of FOWLP – such as the temporary bonding and de-bonding of the carrier on a reconstituted wafer/panel, epoxy molding compound (EMC) dispensing, compression molding, Cu revealing, RDL fabrication, solder ball mounting, etc. – are not well understood. Intended to help readers learn the basics of problem-solving methods and understand the trade-offs inherent in making system-level decisions quickly, this book serves as a valuable reference guide for all those faced with the challenging problems created by the ever-increasing interest in FOWLP, helps to remove roadblocks, and accelerates the design, materials, process, and manufacturing development of key enabling technologies for FOWLP.
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.
Part of the bestselling What Your Doctor May Not Tell You series, an informative, detailed guide to breast cancer, including treatment and prevention. Each year, over 40,000 women in the U.S. die from breast cancer. With statistics rising, conventional methods of treatment are simply not working, and in some cases may even be harmful. Now, Drs. Lee and Zava explain the potentially life-saving facts, such as: likely sources for the increase in breast cancer, including environment, excessive estrogen, progesterone imbalance, diet, and the dangers associated with traditional hormone replacement methods. Readers will learn strategies for lowering their risk and preventing this devastating disease through a revolutionary hormone balance program.
From the bestselling authors of the classic What Your Doctor May NOT Tell You books about menopause and pre-menopause comes an easy-to-use guide on balancing hormone levels safely and naturally. Dr. John Lee will help you answer key questions like: Are my symptoms caused by a hormonal imbalance? Which hormones do I need to regain hormone balance? How do I use hormones for optimal health and balance? Plus, learn how and when to use estrogen, testosterone and progesterone cream, in simple, effective language. If you want the ABCs of using natural hormones, this book is for you.
Arguing that giving estrogen replacement therapy to women after menopause is medically the wrong thing to do, Lee suggests that natural progesterone can prevent most of the unpleasant side effects of menopause, including osteoporosis and weight gain.
This book provides a practical guide for students and practising teachers as to how concepts can form the basis of geography teaching. This is particularly important at this time as the revised national curriculum for Geography (which takes effect from September 2008) has greatly reduced the prescribed 'content' to be covered and instead emphasises that geography is underpinned by a small number of 'key concepts' that provide the building blocks for curriculum planning. The 'new' national curriculum for geography identifies 7 concepts: Place, Space, Scale, Interdependence, Physical and human processes, Environmental interaction and sustainable development, and Cultural understanding and diversity and theses areas are reflected in the book's table of contents. This focus on concepts represents a significant shift in how geography is to be taught in schools, yet there has been little extended discussion of what a 'concept-led' approach to teaching and learning would entail. This book will provide geography teachers with a theoretically robust and practical approach to curriculum planning based on the concepts that underpin the subject..
This handbook gives readers a close look at the entire technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatingsùincluding optical lithography, electron beam, ion beam, and x-ray lithography. The book's main theme is the special printing process needed to achieve volume high density IC chip production, especially in the Dynamic Random Access Memory (DRAM) industry. The book leads off with a comparison of various lithography methods, covering the three major patterning parameters of line/space, resolution, line edge and pattern feature dimension control. The book's explanation of resist and resist process equipment technology may well be the first practical description of the relationship between the resist process and equipment parameters. The basics of resist technology are completely coveredùincluding an entire chapter on resist process defectivity and the potential yield limiting effect on device production.Each alternative lithographic technique and testing method is considered and evaluated: basic metrology including optical, scanning-electron-microscope (SEM) techniques and electrical test devices, along with explanations of actual printing tools and their design, construction and performance. The editor devotes an entire chapter to today's sophisticated, complex electron-beam printers, and to the emerging x-ray printing technology now used in high-density CMOS devices. Energetic ion particle printing is a controllable, steerable technology that does not rely on resist, and occupies a final section of the handbook.
This handbook gives readers a close look at the entire technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatingsùincluding optical lithography, electron beam, ion beam, and x-ray lithography. The book's main theme is the special printing process needed to achieve volume high density IC chip production, especially in the Dynamic Random Access Memory (DRAM) industry. The book leads off with a comparison of various lithography methods, covering the three major patterning parameters of line/space, resolution, line edge and pattern feature dimension control. The book's explanation of resist and resist process equipment technology may well be the first practical description of the relationship between the resist process and equipment parameters. The basics of resist technology are completely coveredùincluding an entire chapter on resist process defectivity and the potential yield limiting effect on device production. Each alternative lithographic technique and testing method is considered and evaluated: basic metrology including optical, scanning-electron-microscope (SEM) techniques and electrical test devices, along with explanations of actual printing tools and their design, construction and performance. The editor devotes an entire chapter to today's sophisticated, complex electron-beam printers, and to the emerging x-ray printing technology now used in high-density CMOS devices. Energetic ion particle printing is a controllable, steerable technology that does not rely on resist, and occupies a final section of the handbook.
Reprint of the second edition of the first American law dictionary. In this edition Bouvier revised about half of his entries and added a thousand new ones. He also incorporated numerous local references, which were compiled through an extensive correspondence with members of all but one of the state bars. The second volume concludes with two appendices. The first is a list of English Chancery, Common Law and Ecclesiastical Reports and a list of the titles published by The Law Library (First, Second and Third Series). The second is a reprint of Robert Kelham's A Dictionary of the Norman or Old French Language. 2 volumes. viii, [13]-740; 772 pp.
Proven 2D and 3D IC lead-free interconnect reliability techniques Reliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource. Covers reliability of: 2D and 3D IC lead-free interconnects CCGA, PBGA, WLP, PQFP, flip-chip, lead-free SAC solder joints Lead-free (SACX) solder joints Low-temperature lead-free (SnBiAg) solder joints Solder joints with voids, high strain rate, and high ramp rate VCSEL and LED lead-free interconnects 3D LED and 3D MEMS with TSVs Chip-to-wafer (C2W) bonding and lead-free interconnects Wafer-to-wafer (W2W) bonding and lead-free interconnects 3D IC chip stacking with low-temperature bonding TSV interposers and lead-free interconnects Electromigration of lead-free microbumps for 3D IC integration
This open access book provides an overview and analysis of the causes and consequences of the massive and highly consequential transition in reproductive behaviour that occurred in Asia, Latin America, and Africa since the mid-20th century. In the 1950s contraceptive use was rare and women typically spend most of their reproductive years bearing and rearing children. By 2020 fertility and contraceptive use in Asia and Latin America reached levels commonly observed in the developed world. Africa’s fertility is still high, but transitions have started in all countries. This monograph is the first to provide a comprehensive analysis of these trends and their determinants, covering changes in reproductive behaviour (e.g., use of contraception and abortion), preferences (e.g., desire to limit and space births) and the role of socioeconomic development (e.g., education). The role of government policies and in particular family planning programs is discussed in depth. Particular attention is given to provide a balanced assessment of several political and scientific controversies that have beset the field. As such this book provides an interesting read for a wide audience of undergraduate and graduate students, researchers, and public health policy makers.
Ultrasocial argues that rather than environmental destruction and extreme inequality being due to human nature, they are the result of the adoption of agriculture by our ancestors. Human economy has become an ultrasocial superorganism (similar to an ant or termite colony), with the requirements of superorganism taking precedence over the individuals within it. Human society is now an autonomous, highly integrated network of technologies, institutions, and belief systems dedicated to the expansion of economic production. Recognizing this allows a radically new interpretation of free market and neoliberal ideology which - far from advocating personal freedom - leads to sacrificing the well-being of individuals for the benefit of the global market. Ultrasocial is a fascinating exploration of what this means for the future direction of the humanity: can we forge a better, more egalitarian, and sustainable future by changing this socio-economic - and ultimately destructive - path? Gowdy explores how this might be achieved.
The Kentucky Encyclopedia's 2,000-plus entries are the work of more than five hundred writers. Their subjects reflect all areas of the commonwealth and span the time from prehistoric settlement to today's headlines, recording Kentuckians' achievements in art, architecture, business, education, politics, religion, science, and sports. Biographical sketches portray all of Kentucky's governors and U.S. senators, as well as note congressmen and state and local politicians. Kentucky's impact on the national scene is registered in the lives of such figures as Carry Nation, Henry Clay, Louis Brandeis, and Alben Barkley. The commonwealth's high range from writers Harriette Arnow and Jesse Stuart, reformers Laura Clay and Mary Breckinridge, and civil rights leaders Whitney Young, Jr., and Georgia Powers, to sports figures Muhammad Ali and Adolph Rupp and entertainers Loretta Lynn, Merle Travis, and the Everly Brothers. Entries describe each county and county seat and each community with a population above 2,500. Broad overview articles examine such topics as agriculture, segregation, transportation, literature, and folklife. Frequently misunderstood aspects of Kentucky's history and culture are clarified and popular misconceptions corrected. The facts on such subjects as mint juleps, Fort Knox, Boone's coonskin cap, the Kentucky hot brown, and Morgan's Raiders will settle many an argument. For both the researcher and the more casual reader, this collection of facts and fancies about Kentucky and Kentuckians will be an invaluable resource.
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