John M. Lee's Books

Handbook of VLSI Microlithography, 2nd Edition

By: John N. Helbert

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Handbook of VLSI Microlithography, 2nd Edition

By: John N. Helbert

This handbook gives readers a close look at the entire technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatingsùincluding optical lithography, electron beam, ion beam, and x-ray lithography. The book's main theme is the special printing process needed to achieve volume high density IC chip production, especially in the Dynamic Random Access Memory (DRAM) industry. The book leads off with a comparison of various lithography methods, covering the three major patterning parameters of line/space, resolution, line edge and pattern feature dimension control. The book's explanation of resist and resist process equipment technology may well be the first practical description of the relationship between the resist process and equipment parameters. The basics of resist technology are completely coveredùincluding an entire chapter on resist process defectivity and the potential yield limiting effect on device production. Each alternative lithographic technique and testing method is considered and evaluated: basic metrology including optical, scanning-electron-microscope (SEM) techniques and electrical test devices, along with explanations of actual printing tools and their design, construction and performance. The editor devotes an entire chapter to today's sophisticated, complex electron-beam printers, and to the emerging x-ray printing technology now used in high-density CMOS devices. Energetic ion particle printing is a controllable, steerable technology that does not rely on resist, and occupies a final section of the handbook.

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Page Count

1026

Publisher

Cambridge University Press

Published Date

ISBN 10

0080946801

ISBN 13

9780080946801

Handbook of VLSI Microlithography

By: John N. Helbert

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Handbook of VLSI Microlithography

By: John N. Helbert

This handbook gives readers a close look at the entire technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatingsùincluding optical lithography, electron beam, ion beam, and x-ray lithography. The book's main theme is the special printing process needed to achieve volume high density IC chip production, especially in the Dynamic Random Access Memory (DRAM) industry. The book leads off with a comparison of various lithography methods, covering the three major patterning parameters of line/space, resolution, line edge and pattern feature dimension control. The book's explanation of resist and resist process equipment technology may well be the first practical description of the relationship between the resist process and equipment parameters. The basics of resist technology are completely coveredùincluding an entire chapter on resist process defectivity and the potential yield limiting effect on device production.Each alternative lithographic technique and testing method is considered and evaluated: basic metrology including optical, scanning-electron-microscope (SEM) techniques and electrical test devices, along with explanations of actual printing tools and their design, construction and performance. The editor devotes an entire chapter to today's sophisticated, complex electron-beam printers, and to the emerging x-ray printing technology now used in high-density CMOS devices. Energetic ion particle printing is a controllable, steerable technology that does not rely on resist, and occupies a final section of the handbook.

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1025

Publisher

William Andrew

Published Date

ISBN 10

0815517807

ISBN 13

9780815517801

Philip Vickers Fithian

Journal and Letters, 1767-1774

By: Philip Fithian

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Philip Vickers Fithian

Journal and Letters, 1767-1774

By: Philip Fithian

The life of a young man as he goes to school and becomes a clergyman; centered entirely in the Mid-Atlantic, with a brief reference to Deerfield taken to be Deerfield Academy in MA. Highly social, not political, writing.

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382

Publisher

Applewood Books

Published Date

ISBN 10

1429005300

ISBN 13

9781429005302

Heterogeneous Integrations

By: John H. Lau

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Heterogeneous Integrations

By: John H. Lau

Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.

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Page Count

381

Publisher

Springer

Published Date

ISBN 10

9811372241

ISBN 13

9789811372247

Oxidative Stress and Vascular Disease

By: John F. Keaney Jr.

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Oxidative Stress and Vascular Disease

By: John F. Keaney Jr.

One of the major biomedical triumphs of the post-World War II era was the defmitive demonstration that hypercholesterolemia is a key causative factor in atherosclerosis; that hypercholesterolemia can be effectively treated; and that treatment significantly reduces not only coronary disease mortality but also all cause mortality. Treatment to lower plasma levels of cholesterol - primarily low density lipoprotein (LDL) cholesterol - is now accepted as best medical practice and both physicians and patients are being educated to take aggressive measures to lower LDL. We can confidently look forward to important decreases in the toll of coronary artery disease over the coming decades. However, there is still uncertainty as to the exact mechanisms by which elevated plasma cholesterol and LDL levels initiate and favor the progression of lesions. There is general consensus that one of the earliest responses to hypercholesterolemia is the adhesion of monocytes to aortic endothelial cells followed by their penetration into the subendothelial space, where they differentiate into macrophages. These cells, and also medial smooth muscle cells that have migrated into the subendothelial space, then become loaded with mUltiple, large droplets of cholesterol esters . . . the hallmark of the earliest visible atherosclerotic lesion, the so-called fatty streak. This lesion is the precursor of the more advanced lesions, both in animal models and in humans. Thus the centrality of hypercholesterolemia cannot be overstated. Still, the atherogenic process is complex and evolves over a long period of time.

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404

Publisher

Springer Science & Business Media

Published Date

ISBN 10

1461546494

ISBN 13

9781461546498

Chiplet Design and Heterogeneous Integration Packaging

By: John H. Lau

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Chiplet Design and Heterogeneous Integration Packaging

By: John H. Lau

The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

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Page Count

542

Publisher

Springer Nature

Published Date

ISBN 10

9811999171

ISBN 13

9789811999178

Fan-Out Wafer-Level Packaging

By: John H. Lau

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Fan-Out Wafer-Level Packaging

By: John H. Lau

This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple’s iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers, as well as scientists and researchers, essential details of FOWLP – such as the temporary bonding and de-bonding of the carrier on a reconstituted wafer/panel, epoxy molding compound (EMC) dispensing, compression molding, Cu revealing, RDL fabrication, solder ball mounting, etc. – are not well understood. Intended to help readers learn the basics of problem-solving methods and understand the trade-offs inherent in making system-level decisions quickly, this book serves as a valuable reference guide for all those faced with the challenging problems created by the ever-increasing interest in FOWLP, helps to remove roadblocks, and accelerates the design, materials, process, and manufacturing development of key enabling technologies for FOWLP.

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Page Count

319

Publisher

Springer

Published Date

ISBN 10

9811088845

ISBN 13

9789811088841

Fredholm Operators and Einstein Metrics on Conformally Compact Manifolds

By: John M. Lee

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Fredholm Operators and Einstein Metrics on Conformally Compact Manifolds

By: John M. Lee

Volume 183, number 864 (end of volume).

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American Mathematical Soc.

Published Date

ISBN 10

0821839152

ISBN 13

9780821839157

Semiconductor Advanced Packaging

By: John H. Lau

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Semiconductor Advanced Packaging

By: John H. Lau

The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

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Page Count

513

Publisher

Springer Nature

Published Date

ISBN 10

9811613761

ISBN 13

9789811613760

Organometallic Compounds and Living Organisms

By: John Thayer

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Organometallic Compounds and Living Organisms

By: John Thayer

Organometallic Compounds and Living Organisms provides information pertinent to the fundamental aspects of organometallic compounds and living organisms. This book discusses the biological effects of organometallic compounds. Organized into 10 chapters, this book begins with an overview of the recognition of methylmercuric compounds as the causative agents of Minamata disease, which has generated intensive research of their toxic effects. This text then examines the number of investigative applications of the biological inertness of silicones. Other chapters consider the capacity of many organometals to deactivate enzymes, which makes these compounds very useful for studying the nature of the enzyme active site. This book discusses as well the use and preparation of organometallurium compounds as imaging agents. The final chapter deals with the formation and cleavage of metal(loid)–carbon bonds, which play significant roles in the environmental transformation and circulation of metal(loids). This book is a valuable resource for chemists.

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Page Count

286

Publisher

Elsevier

Published Date

ISBN 10

0323157653

ISBN 13

9780323157650

Vascular Protection

Molecular Mechanisms, Novel Therapeutic Principles and Clinical Applications

By: Gabor M. Rubanyi,Victor J. Dzau,John P. Cooke

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Vascular Protection

Molecular Mechanisms, Novel Therapeutic Principles and Clinical Applications

By: Gabor M. Rubanyi,Victor J. Dzau,John P. Cooke

Vascular Protection explores advances in vascular biology and how they translate into innovations in drug therapy for vascular disease. It addresses recent advances in the knowledge of endothelial vasoactive factors and other biologically active molecules as well as gene therapy. Written by leading experts in their respective fields, each chapter e

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Page Count

492

Publisher

CRC Press

Published Date

ISBN 10

0203166477

ISBN 13

9780203166475

National Geographic Traveler: Washington D. C.

By: John Milliken Thompson

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National Geographic Traveler: Washington D. C.

By: John Milliken Thompson

Highlights the history, culture, and comtemporary life of the city and offers detailed walking tours of historic areas and complete visitor information.

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276

Publisher

National Geographic Books

Published Date

ISBN 10

1426202253

ISBN 13

9781426202254

Epigenetics, Nuclear Organization & Gene Function

With implications of epigenetic regulation and genetic architecture for human development and health

By: John C. Lucchesi

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Epigenetics, Nuclear Organization & Gene Function

With implications of epigenetic regulation and genetic architecture for human development and health

By: John C. Lucchesi

Epigenetics is the study of heritable changes in gene function that do not involve changes in the DNA sequence. These changes, consisting principally of DNA methylation, histone modifications, and non-coding RNAs, maintain or modulate the initial impact of regulatory factors that recognize and associate with particular genomic sequences. Epigenetic modifications are manifest in all aspects of normal cellular differentiation and function, but they can also have damaging effects that result in pathologies such as cancer. Research is continuously uncovering the role of epigenetics in a variety of human disorders, providing new avenues for therapeutic interventions and advances in regenerative medicine. This book's primary goal is to establish a framework that can be used to understand the basis of epigenetic regulation and to appreciate both its derivation from genetics and interdependence with genetic mechanisms. A further aim is to highlight the role played by the three-dimensional organization of the genetic material itself (the complex of DNA, histones and non-histone proteins referred to as chromatin), and its distribution within a functionally compartmentalized nucleus. This architectural organization of the genome plays a major role in the subsequent retrieval, interpretation, and execution of both genetic and epigenetic information.

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Page Count

240

Publisher

Oxford University Press

Published Date

ISBN 10

0192567160

ISBN 13

9780192567161

Generations

An American Family

By: John Egerton

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Generations

An American Family

By: John Egerton

Winner of the 1984 Lillian Smith Award The saga of the Ledfords of Lancaster, Kentucky, Generations transcends family biography to become a social history of our national experience, a metaphor of America. This twentieth anniversary edition brings the Ledfords' remarkable story up to date.

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Page Count

388

Publisher

University Press of Kentucky

Published Date

ISBN 10

0813127831

ISBN 13

9780813127835

Introduction to Smooth Manifolds

By: John M. Lee

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Introduction to Smooth Manifolds

By: John M. Lee

Author has written several excellent Springer books.; This book is a sequel to Introduction to Topological Manifolds; Careful and illuminating explanations, excellent diagrams and exemplary motivation; Includes short preliminary sections before each section explaining what is ahead and why

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Page Count

646

Publisher

Springer Science & Business Media

Published Date

ISBN 10

0387217525

ISBN 13

9780387217529

Molecular Genetics of Cancer

By: John K. Cowell

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Molecular Genetics of Cancer

By: John K. Cowell

Since the first volume was published, there has been significant success in isolating genes responsible for particular cancers as well as a major improvement in our understanding of the molecular events leading to tumors. This book explores possible genetic treatments that can suppress cancer cells that have formed tumors and it presents the details of the isolation and characterization of new human cancer genes that have recently been identified. Molecular Genetics of Cancer, 2E is an essential book for anyone involved in cancer research and the search for a cure.

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Page Count

544

Publisher

Gulf Professional Publishing

Published Date

ISBN 10

0121501000

ISBN 13

9780121501006

Novel Therapies for CNS Injuries

Rationales and Results

By: Patti L. Peterson,John W. Phillis

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Novel Therapies for CNS Injuries

Rationales and Results

By: Patti L. Peterson,John W. Phillis

This book provides reviews of the epidemiology, evaluation, and patient management of central nervous system (CNS) injuries. Internationally recognized clinicians and basic scientists discuss recent research that has significantly advanced the understanding of the pathophysiology of neuronal death and facilitated development of new therapeutic approaches. Novel therapeutic agents evaluated in animal models and currently in clinical trials include: calcium antagonists glutamate receptor antagonists inhibitors of glutamate release endothelial adhesion and nerve growth factors opioids antioxidants, gangliosides thrombolytic agents All of these options, as well as hypothermia as a potentially therapeutic approach, are discussed in this comprehensive volume. It will be invaluable to neurologists, neurosurgeons, intensivists, and emergency medicine physicians who care for CNS injured patients.

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Page Count

426

Publisher

CRC Press

Published Date

ISBN 10

0849376521

ISBN 13

9780849376528

Riemannian Manifolds

An Introduction to Curvature

By: John M. Lee

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Riemannian Manifolds

An Introduction to Curvature

By: John M. Lee

This text focuses on developing an intimate acquaintance with the geometric meaning of curvature and thereby introduces and demonstrates all the main technical tools needed for a more advanced course on Riemannian manifolds. It covers proving the four most fundamental theorems relating curvature and topology: the Gauss-Bonnet Theorem, the Cartan-Hadamard Theorem, Bonnet’s Theorem, and a special case of the Cartan-Ambrose-Hicks Theorem.

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