This text focuses on developing an intimate acquaintance with the geometric meaning of curvature and thereby introduces and demonstrates all the main technical tools needed for a more advanced course on Riemannian manifolds. It covers proving the four most fundamental theorems relating curvature and topology: the Gauss-Bonnet Theorem, the Cartan-Hadamard Theorem, Bonnet’s Theorem, and a special case of the Cartan-Ambrose-Hicks Theorem.
Author has written several excellent Springer books.; This book is a sequel to Introduction to Topological Manifolds; Careful and illuminating explanations, excellent diagrams and exemplary motivation; Includes short preliminary sections before each section explaining what is ahead and why
This book is an introduction to manifolds at the beginning graduate level, and accessible to any student who has completed a solid undergraduate degree in mathematics. It contains the essential topological ideas that are needed for the further study of manifolds, particularly in the context of differential geometry, algebraic topology, and related fields. Although this second edition has the same basic structure as the first edition, it has been extensively revised and clarified; not a single page has been left untouched. The major changes include a new introduction to CW complexes (replacing most of the material on simplicial complexes in Chapter 5); expanded treatments of manifolds with boundary, local compactness, group actions, and proper maps; and a new section on paracompactness.
The story of geometry is the story of mathematics itself: Euclidean geometry was the first branch of mathematics to be systematically studied and placed on a firm logical foundation, and it is the prototype for the axiomatic method that lies at the foundation of modern mathematics. It has been taught to students for more than two millennia as a mode of logical thought. This book tells the story of how the axiomatic method has progressed from Euclid's time to ours, as a way of understanding what mathematics is, how we read and evaluate mathematical arguments, and why mathematics has achieved the level of certainty it has. It is designed primarily for advanced undergraduates who plan to teach secondary school geometry, but it should also provide something of interest to anyone who wishes to understand geometry and the axiomatic method better. It introduces a modern, rigorous, axiomatic treatment of Euclidean and (to a lesser extent) non-Euclidean geometries, offering students ample opportunities to practice reading and writing proofs while at the same time developing most of the concrete geometric relationships that secondary teachers will need to know in the classroom. -- P. [4] of cover.
Complex manifolds are smooth manifolds endowed with coordinate charts that overlap holomorphically. They have deep and beautiful applications in many areas of mathematics. This book is an introduction to the concepts, techniques, and main results about complex manifolds (mainly compact ones), and it tells a story. Starting from familiarity with smooth manifolds and Riemannian geometry, it gradually explains what is different about complex manifolds and develops most of the main tools for working with them, using the Kodaira embedding theorem as a motivating project throughout. The approach and style will be familiar to readers of the author's previous graduate texts: new concepts are introduced gently, with as much intuition and motivation as possible, always relating new concepts to familiar old ones, with plenty of examples. The main prerequisite is familiarity with the basic results on topological, smooth, and Riemannian manifolds. The book is intended for graduate students and researchers in differential geometry, but it will also be appreciated by students of algebraic geometry who wish to understand the motivations, analogies, and analytic results that come from the world of differential geometry.
This handbook gives readers a close look at the entire technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatingsùincluding optical lithography, electron beam, ion beam, and x-ray lithography. The book's main theme is the special printing process needed to achieve volume high density IC chip production, especially in the Dynamic Random Access Memory (DRAM) industry. The book leads off with a comparison of various lithography methods, covering the three major patterning parameters of line/space, resolution, line edge and pattern feature dimension control. The book's explanation of resist and resist process equipment technology may well be the first practical description of the relationship between the resist process and equipment parameters. The basics of resist technology are completely coveredùincluding an entire chapter on resist process defectivity and the potential yield limiting effect on device production. Each alternative lithographic technique and testing method is considered and evaluated: basic metrology including optical, scanning-electron-microscope (SEM) techniques and electrical test devices, along with explanations of actual printing tools and their design, construction and performance. The editor devotes an entire chapter to today's sophisticated, complex electron-beam printers, and to the emerging x-ray printing technology now used in high-density CMOS devices. Energetic ion particle printing is a controllable, steerable technology that does not rely on resist, and occupies a final section of the handbook.
The life of a young man as he goes to school and becomes a clergyman; centered entirely in the Mid-Atlantic, with a brief reference to Deerfield taken to be Deerfield Academy in MA. Highly social, not political, writing.
Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.
One of the major biomedical triumphs of the post-World War II era was the defmitive demonstration that hypercholesterolemia is a key causative factor in atherosclerosis; that hypercholesterolemia can be effectively treated; and that treatment significantly reduces not only coronary disease mortality but also all cause mortality. Treatment to lower plasma levels of cholesterol - primarily low density lipoprotein (LDL) cholesterol - is now accepted as best medical practice and both physicians and patients are being educated to take aggressive measures to lower LDL. We can confidently look forward to important decreases in the toll of coronary artery disease over the coming decades. However, there is still uncertainty as to the exact mechanisms by which elevated plasma cholesterol and LDL levels initiate and favor the progression of lesions. There is general consensus that one of the earliest responses to hypercholesterolemia is the adhesion of monocytes to aortic endothelial cells followed by their penetration into the subendothelial space, where they differentiate into macrophages. These cells, and also medial smooth muscle cells that have migrated into the subendothelial space, then become loaded with mUltiple, large droplets of cholesterol esters . . . the hallmark of the earliest visible atherosclerotic lesion, the so-called fatty streak. This lesion is the precursor of the more advanced lesions, both in animal models and in humans. Thus the centrality of hypercholesterolemia cannot be overstated. Still, the atherogenic process is complex and evolves over a long period of time.
The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple’s iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers, as well as scientists and researchers, essential details of FOWLP – such as the temporary bonding and de-bonding of the carrier on a reconstituted wafer/panel, epoxy molding compound (EMC) dispensing, compression molding, Cu revealing, RDL fabrication, solder ball mounting, etc. – are not well understood. Intended to help readers learn the basics of problem-solving methods and understand the trade-offs inherent in making system-level decisions quickly, this book serves as a valuable reference guide for all those faced with the challenging problems created by the ever-increasing interest in FOWLP, helps to remove roadblocks, and accelerates the design, materials, process, and manufacturing development of key enabling technologies for FOWLP.
In this book the author motivates what is to follow in the book by explaining the roles manifolds play in topology, geometry, complex analysis, algebra & classical mechanics with a final pass at general relativity. The book begins with the basics of general topology & gently moves to manifolds, the fundamental group, & covering spaces.
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Organometallic Compounds and Living Organisms provides information pertinent to the fundamental aspects of organometallic compounds and living organisms. This book discusses the biological effects of organometallic compounds. Organized into 10 chapters, this book begins with an overview of the recognition of methylmercuric compounds as the causative agents of Minamata disease, which has generated intensive research of their toxic effects. This text then examines the number of investigative applications of the biological inertness of silicones. Other chapters consider the capacity of many organometals to deactivate enzymes, which makes these compounds very useful for studying the nature of the enzyme active site. This book discusses as well the use and preparation of organometallurium compounds as imaging agents. The final chapter deals with the formation and cleavage of metal(loid)–carbon bonds, which play significant roles in the environmental transformation and circulation of metal(loids). This book is a valuable resource for chemists.
Highlights the history, culture, and comtemporary life of the city and offers detailed walking tours of historic areas and complete visitor information.
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