John J. J. Chen's Books

New Nanotechnology Research

By: John P. Reece

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Nanotechnology is a 'catch-all' description of activities at the level of atoms and molecules that have applications in the real world. A manometer is a billionth of a meter, about 1/80,000 of the diameter of a human hair, or 10 times the diameter of a hydrogen atom. Nanotechnology is now used in precision engineering, new materials development as well as in electronics; electromechanical systems as well as mainstream biomedical applications in areas such as gene therapy, drug delivery and novel drug discovery techniques. This book presents the latest research in this frontier field.

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Page Count

260

Publisher

Nova Publishers

Published Date

ISBN 10

1600212131

ISBN 13

9781600212130

Chemistry of Pyrotechnics

Basic Principles and Theory, Third Edition

By: Chris Mocella,John A. Conkling

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Chemistry of Pyrotechnics

Basic Principles and Theory, Third Edition

By: Chris Mocella,John A. Conkling

This book provides chemists with technical insight on pyrotechnics and explosives. It emphasizes basic chemical principles and practical, hands-on knowledge in the preparation of energetic materials. It examines the interactions between and adaptations of pyrotechnics to changing technology in areas such as obscuration science and low-signature flame emission. The updated third edition discusses chemical and pyrotechnic principles, components of high-energy materials, elements of ignition, propagation, and sensitivity. It offers heat compositions, including ignition mixes, delays, thermites, and propellants and investigates the production of smoke and sound as well as light and color.

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Page Count

317

Publisher

CRC Press

Published Date

ISBN 10

1351626566

ISBN 13

9781351626569

Digital Integrated Circuits

Analysis and Design, Second Edition

By: John E. Ayers

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Digital Integrated Circuits

Analysis and Design, Second Edition

By: John E. Ayers

Exponential improvement in functionality and performance of digital integrated circuits has revolutionized the way we live and work. The continued scaling down of MOS transistors has broadened the scope of use for circuit technology to the point that texts on the topic are generally lacking after a few years. The second edition of Digital Integrated Circuits: Analysis and Design focuses on timeless principles with a modern interdisciplinary view that will serve integrated circuits engineers from all disciplines for years to come. Providing a revised instructional reference for engineers involved with Very Large Scale Integrated Circuit design and fabrication, this book delves into the dramatic advances in the field, including new applications and changes in the physics of operation made possible by relentless miniaturization. This book was conceived in the versatile spirit of the field to bridge a void that had existed between books on transistor electronics and those covering VLSI design and fabrication as a separate topic. Like the first edition, this volume is a crucial link for integrated circuit engineers and those studying the field, supplying the cross-disciplinary connections they require for guidance in more advanced work. For pedagogical reasons, the author uses SPICE level 1 computer simulation models but introduces BSIM models that are indispensable for VLSI design. This enables users to develop a strong and intuitive sense of device and circuit design by drawing direct connections between the hand analysis and the SPICE models. With four new chapters, more than 200 new illustrations, numerous worked examples, case studies, and support provided on a dynamic website, this text significantly expands concepts presented in the first edition.

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Page Count

616

Publisher

CRC Press

Published Date

ISBN 10

1439894957

ISBN 13

9781439894958

3D IC Integration and Packaging

By: John H. Lau

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3D IC Integration and Packaging

By: John H. Lau

A comprehensive guide to 3D IC integration and packaging technology3D IC Integration and Packaging fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption. Based on a course developed by its author, this practical guide offers real-world problem-solving methods and teaches the trade-offs inherent in making system-level decisions. Explore key enabling technologies such as TSV, thin-wafer strength measurement and handling, microsolder bumping, redistribution layers, interposers, wafer-to-wafer bonding, chip-to-wafer bonding, 3D IC and MEMS, LED, and complementary metal-oxide semiconductor image sensors integration. Assembly, thermal management, and reliability are covered in complete detail.3D IC Integration and Packaging covers:• 3D integration for semiconductor IC packaging• Through-silicon vias modeling and testing• Stress sensors for thin-wafer handling and strength measurement• Package substrate technologies• Microbump fabrication, assembly, and reliability• 3D Si integration• 2.5D/3D IC integration• 3D IC integration with passive interposer• Thermal management of 2.5D/3D IC integration• Embedded 3D hybrid integration• 3D LED and IC integration• 3D MEMS and IC integration• 3D CMOS image sensors and IC integration• PoP, chip-to-chip interconnects, and embedded fan-out WLP

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Page Count

481

Publisher

McGraw Hill Professional

Published Date

ISBN 10

007184807X

ISBN 13

9780071848077

Ch'ing Documents

An Introductory Syllabus (Volume 1)

By: John K. Fairbank

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Ch'ing Documents

An Introductory Syllabus (Volume 1)

By: John K. Fairbank

Volume 1 of a syllabus and reference work for understanding Ch'ing documents, written by John K. Fairbank and used for one of his history courses at Harvard University. Also includes an introduction, notes, and an appendix.

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Page Count

123

Publisher

BRILL

Published Date

ISBN 10

1684171385

ISBN 13

9781684171385

Book's by John J. J. Chen

New Nanotechnology Research

New Nanotechnology Research

Chemistry of Pyrotechnics

Chemistry of Pyrotechnics

Digital Integrated Circuits

Digital Integrated Circuits

3D IC Integration and Packaging

3D IC Integration and Packaging

Ch'ing Documents

Ch'ing Documents

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