John D. Plating's Books

The Hump

America's Strategy for Keeping China in World War II

By: John D. Plating

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The Hump

America's Strategy for Keeping China in World War II

By: John D. Plating

Chronicling the most ambitious airlift in history . . . Carried out over arguably the world’s most rugged terrain, in its most inhospitable weather system, and under the constant threat of enemy attack, the trans-Himalayan airlift of World War II delivered nearly 740,000 tons of cargo to China, making it possible for Chinese forces to wage war against Japan. This operation dwarfed the supply delivery by land over the Burma and Ledo Roads and represented the fullest expression of the U.S. government’s commitment to China. In this groundbreaking work—the first concentrated historical study of the world’s first sustained combat airlift operation—John D. Plating argues that the Hump airlift was initially undertaken to serve as a display of American support for its Chinese ally, which had been at war with Japan since 1937. However, by 1944, with the airlift’s capability gaining momentum, American strategists shifted the purpose of air operations to focus on supplying American forces in China in preparation for the U.S.’s final assault on Japan. From the standpoint of war materiel, the airlift was the precondition that made possible all other allied military action in the China-Burma-India theater, where Allied troops were most commonly inserted, supplied, and extracted by air. Drawing on extensive research that includes Chinese and Japanese archives, Plating tells a spellbinding story in a context that relates it to the larger movements of the war and reveals its significance in terms of the development of military air power. The Hump demonstrates the operation’s far-reaching legacy as it became the example and prototype of the Berlin Airlift, the first air battle of the Cold War. The Hump operation also bore significantly on the initial moves of the Chinese Civil War, when Air Transport Command aircraft moved entire armies of Nationalist troops hundreds of miles in mere days in order to prevent Communist forces from being the ones to accept the Japanese surrender.

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346

Publisher

Texas A&M University Press

Published Date

ISBN 10

1603442375

ISBN 13

9781603442374

The Hump

America's Strategy for Keeping China in World War II

By: John D. Plating

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The Hump

America's Strategy for Keeping China in World War II

By: John D. Plating

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346

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Texas A&M University Press

Published Date

ISBN 10

1603442375

ISBN 13

9781603442374

Chip Scale Package (CSP)

Design, Materials, Processes, Reliability, and Applications

By: John H. Lau,Shi-Wei Ricky Lee

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Chip Scale Package (CSP)

Design, Materials, Processes, Reliability, and Applications

By: John H. Lau,Shi-Wei Ricky Lee

Featuring the latest design techniques, plus details on more than 40 different types of CSP, hands engineers and designers the complete, professional set of working tools to: solve technical and design issues; find the most efficient, cost-effective CSP solutions for deployments; answer questions on interfacing, speed, robustness, and more; compare properties of wirebonds, flip chips, rigid and flex substrates, wafer-level redistribution, and other CSP products; get the latest information on new offerings from Fujitsu, GE, Hitachi, IBM, and other major companies; and learn about CSP products under development.

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Page Count

600

Publisher

McGraw Hill Professional

Published Date

ISBN 10

0070383049

ISBN 13

9780070383043

A Military History of Japan

From the Age of the Samurai to the 21st Century

By: John T. Kuehn

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A Military History of Japan

From the Age of the Samurai to the 21st Century

By: John T. Kuehn

This comprehensive volume traces the evolution of Japanese military history—from 300 AD to present day foreign relations—and reveals how the country's cultural views of power, violence, and politics helped shape Japan's long and turbulent history of war. The legacy of Japanese warfare is steeped in honor, duty, and valor. Yet, some of the more violent episodes in this country's military history have tainted foreign attitudes toward Japan, oftentimes threatening the economic stability of the Pacific region. This book documents Japan's long and stormy history of war and military action, provides a thorough analysis of the social and political changes that have contributed to the evolution of Japan's foreign policy and security decisions, and reveals the truth behind the common myths and misconceptions of this nation's iconic war symbols and events, including samurais, warlords, and kamikaze attacks. Written by an author with military experience and insight into modern-day Japanese culture gained from living in Japan, A Military History of Japan: From the Age of the Samurai to the 21st Century examines how Japan's history of having warrior-based leaderships, imperialist governments, and dictators has shaped the country's concepts of war. It provides a complete military history of Japan—from the beginning of the Imperial institution to the post-Cold War era—in a single volume. This thoughtful resource also contains photos, maps, and a glossary of key Japanese terms to support learning.

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Page Count

422

Publisher

Bloomsbury Publishing USA

Published Date

ISBN 13

9798216117674

Proceedings of the 43rd Industrial Waste Conference May 1988, Purdue University

By: John M. Bell

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Proceedings of the 43rd Industrial Waste Conference May 1988, Purdue University

By: John M. Bell

This Purdue volume includes 89 technical papers presented at the 43rd Purdue Industrial Waste Conference, held May 10, 11, and 12, 1988 at Purdue University. The papers address topics within broad categories such as toxic and hazardous wastes; site remediation; landfills; biological systems; sorptive processes; processes and product development; industrial wastes; and laws, regulations, and training. The data and information contained in this volume reflect some of the latest information available on industrial waste and waste management.

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Page Count

1042

Publisher

CRC Press

Published Date

ISBN 10

135109291X

ISBN 13

9781351092913

Proceedings of the 45th Industrial Waste Conference May 1990, Purdue University

By: John W. Bell

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Proceedings of the 45th Industrial Waste Conference May 1990, Purdue University

By: John W. Bell

New and timely research, methods, and processes are described in 92 technical papers. This new volume in the Purdue series presents a compendium of valuable information that can be directly applied to today's big problems of environmental control, treatment, regulation, and compliance.

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Page Count

873

Publisher

CRC Press

Published Date

ISBN 10

1351084488

ISBN 13

9781351084482

Proceedings of the 44th Industrial Waste Conference May 1989, Purdue University

By: John W. Bell

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Proceedings of the 44th Industrial Waste Conference May 1989, Purdue University

By: John W. Bell

New research-case histories and operating data-on every conceivable facet of today's big problem are detailed in the latest Purdue Book-with unparalleled appropriate, usable information and data for your current industrial waste problems from the May 1989 Conference.

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Page Count

963

Publisher

CRC Press

Published Date

ISBN 10

135108447X

ISBN 13

9781351084475

Reliability of RoHS-Compliant 2D and 3D IC Interconnects

By: John H. Lau

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Reliability of RoHS-Compliant 2D and 3D IC Interconnects

By: John H. Lau

Proven 2D and 3D IC lead-free interconnect reliability techniques Reliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource. Covers reliability of: 2D and 3D IC lead-free interconnects CCGA, PBGA, WLP, PQFP, flip-chip, lead-free SAC solder joints Lead-free (SACX) solder joints Low-temperature lead-free (SnBiAg) solder joints Solder joints with voids, high strain rate, and high ramp rate VCSEL and LED lead-free interconnects 3D LED and 3D MEMS with TSVs Chip-to-wafer (C2W) bonding and lead-free interconnects Wafer-to-wafer (W2W) bonding and lead-free interconnects 3D IC chip stacking with low-temperature bonding TSV interposers and lead-free interconnects Electromigration of lead-free microbumps for 3D IC integration

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Page Count

640

Publisher

McGraw Hill Professional

Published Date

ISBN 10

007175380X

ISBN 13

9780071753807

Book's by John D. Plating

The Hump

The Hump

The Hump

The Hump

Chip Scale Package (CSP)

Chip Scale Package (CSP)

A Military History of Japan

A Military History of Japan

Proceedings of the 43rd Industrial Waste Conference May 1988, Purdue University

Proceedings of the 43rd Industrial Waste Conference May 1988, Purdue University

Proceedings of the 45th Industrial Waste Conference May 1990, Purdue University

Proceedings of the 45th Industrial Waste Conference May 1990, Purdue University

Proceedings of the 44th Industrial Waste Conference May 1989, Purdue University

Proceedings of the 44th Industrial Waste Conference May 1989, Purdue University

Reliability of RoHS-Compliant 2D and 3D IC Interconnects

Reliability of RoHS-Compliant 2D and 3D IC Interconnects

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