Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficient and cost-effective processing have been steady. This has continued in the face of steadily decreasing feature sizes, impressive increases in wafer size and a continuing array of new materials used in devices today. There are a number of excellent existing references and monographs on CMP in circulation and we defer to them for detailed background information. They are cited in the text. Our focus here is on the important area of process mod els which have not kept pace with the tremendous expansion of applications of CMP. Preston's equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. We call that an "integrated model" and, more specifically, we include the important role of the mechanical elements of the process.
This book mainly focuses on ecological approaches for preventing and controlling non-point source (NPS) pollution on the basis of forestry measures. In addition to the effects of ecological control, it introduces readers to the characteristics of NPS pollution in Taihu Lake watershed, water eutrophication evaluation methods, and potential countermeasures. Given the crucial role of surface runoff and soil erosion in producing water pollution, the book presents forestry measures to combat them, such as the creation of public welfare forests, urban forestry, planting techniques for hedgerows on slope land, the establishment of shelter belts, nitrogen and phosphorus absorption by hydrophytes, and sustainable management for wetlands. Moreover, the results are supplemented by a wealth of numerical calculations, tables, figures and photographs. The book offers a valuable guide for researchers, educators and professionals working in the areas of water environment, water security and ecological construction. Prof. Jianfeng Zhang works at the Institute of Subtropical Forestry, Chinese Academy of Forestry, Fuyang, China.
This book provides a systematic and accessible approach to stochastic differential equations, backward stochastic differential equations, and their connection with partial differential equations, as well as the recent development of the fully nonlinear theory, including nonlinear expectation, second order backward stochastic differential equations, and path dependent partial differential equations. Their main applications and numerical algorithms, as well as many exercises, are included. The book focuses on ideas and clarity, with most results having been solved from scratch and most theories being motivated from applications. It can be considered a starting point for junior researchers in the field, and can serve as a textbook for a two-semester graduate course in probability theory and stochastic analysis. It is also accessible for graduate students majoring in financial engineering.
This book analyzes the theory of ecological engineering of human settlements and provides case studies on the improvement of degraded lands and vegetation restoration, especially focusing on saline-alkali land, abandoned land, water source areas, and the impact of green belts on noise and air quality on the highways. In addition, it discusses the issue of biodiversity conservation strategies in rural landscape construction and demonstrates experiment measurement and field survey methods. The results obtained are supplemented by numerical calculations, presented in the form of tables and figures. As the first monograph on this subject, the book provides a wealth of ideas and resources for researchers, professionals and practitioners in the field of human settlements.
With the rapid development of artificial intelligence and the emergence of various new sensors, autonomous driving has grown in popularity in recent years. The implementation of autonomous driving requires new sources of sensory data, such as cameras, radars, and lidars, and the algorithm processing requires a high degree of parallel computing. In this regard, traditional CPUs have insufficient computing power, while DSPs are good at image processing but lack sufficient performance for deep learning. Although GPUs are good at training, they are too “power-hungry,” which can affect vehicle performance. Therefore, this book looks to the future, arguing that custom ASICs are bound to become mainstream. With the goal of ICs design for autonomous driving, this book discusses the theory and engineering practice of designing future-oriented autonomous driving SoC chips. The content is divided into thirteen chapters, the first chapter mainly introduces readers to the current challenges and research directions in autonomous driving. Chapters 2–6 focus on algorithm design for perception and planning control. Chapters 7–10 address the optimization of deep learning models and the design of deep learning chips, while Chapters 11-12 cover automatic driving software architecture design. Chapter 13 discusses the 5G application on autonomous drving. This book is suitable for all undergraduates, graduate students, and engineering technicians who are interested in autonomous driving.
This book introduces the research background and significance of carbon emissions in the tunnel industry and systematically reviewed the research progresses of carbon emission researches for tunnels, LCA (life cycle assessment) research framework, and uncertainty research progress. The authors propose a novel modular carbon emission calculation method for highway tunnel construction and expounds on the modular LCA system boundary theory of tunnel construction. This method does not require abundant knowledge of LCA modeling, which is convenient for general engineering and technical personnel to calculate the carbon emission level of tunnel construction. The calculation formulas for input and carbon emissions of each module are provided. It also analyzes the parameter uncertainty, model uncertainty, and scenario uncertainty of the carbon emissions from tunnel construction by the Monte Carlo method. Further, this book proposes the fitting model of carbon emissions of unit engineering quantity in tunnel construction, which benefits to simplify the calculation of carbon emissions.This book is mainly aimed at engineering and technical personnel in the construction industry, especially tunnel and underground engineering, including tunnel design engineers; tunnel construction engineers, experts, and scholars; tunnel owners; management departments.
The most recent advances in research on coastal saline soil rehabilitation and utilization based on forestry approach are discussed. The forestry approach is emphasized rather than physical or engineering measures to ameliorate saline soils, which is significant for coastal environmental improvement and land resources expansion. The monograph is a useful reference for researchers using techniques of ecology, forestry and agronomy. Prof. Jianfeng Zhang works at the Institute of Subtropical Forestry, Chinese Academy of Forestry. He has been working on afforestation in saline soils for over 20 years.
This book is the second volume of a two-volume book set which introduces software-defined chips. In this book, the programming model of the software-defined chips is analyzed by tracing the coevolution of modern general-purpose processors and programming models. The enhancement in hardware security and reliability of the software-defined chips are described from the perspective of dynamic and partial reconfiguration. The challenges and prospective trends of software-defined chips are also discussed. Current applications in the fields of artificial intelligence, cryptography, 5G communications, etc., are presented in detail. Potential applications in the future, including post-quantum cryptography, evolutionary computing, etc., are also discussed. This book is suitable for scientists and researchers in the areas of electrical and electronic engineering and computer science. Postgraduate students, practitioners and professionals in related areas are also potentially interested in the topic of this book.
Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficient and cost-effective processing have been steady. This has continued in the face of steadily decreasing feature sizes, impressive increases in wafer size and a continuing array of new materials used in devices today. There are a number of excellent existing references and monographs on CMP in circulation and we defer to them for detailed background information. They are cited in the text. Our focus here is on the important area of process mod els which have not kept pace with the tremendous expansion of applications of CMP. Preston's equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. We call that an "integrated model" and, more specifically, we include the important role of the mechanical elements of the process.
Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficient and cost-effective processing have been steady. This has continued in the face of steadily decreasing feature sizes, impressive increases in wafer size and a continuing array of new materials used in devices today. There are a number of excellent existing references and monographs on CMP in circulation and we defer to them for detailed background information. They are cited in the text. Our focus here is on the important area of process mod els which have not kept pace with the tremendous expansion of applications of CMP. Preston's equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. We call that an "integrated model" and, more specifically, we include the important role of the mechanical elements of the process.
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