This textbook offers theoretical and practical knowledge of the finite element method. The book equips readers with the skills required to analyze engineering problems using ANSYS®, a commercially available FEA program. Revised and updated, this new edition presents the most current ANSYS® commands and ANSYS® screen shots, as well as modeling steps for each example problem. This self-contained, introductory text minimizes the need for additional reference material by covering both the fundamental topics in finite element methods and advanced topics concerning modeling and analysis. It focuses on the use of ANSYS® through both the Graphics User Interface (GUI) and the ANSYS® Parametric Design Language (APDL). Extensive examples from a range of engineering disciplines are presented in a straightforward, step-by-step fashion. Key topics include: • An introduction to FEM • Fundamentals and analysis capabilities of ANSYS® • Fundamentals of discretization and approximation functions • Modeling techniques and mesh generation in ANSYS® • Weighted residuals and minimum potential energy • Development of macro files • Linear structural analysis • Heat transfer and moisture diffusion • Nonlinear structural problems • Advanced subjects such as submodeling, substructuring, interaction with external files, and modification of ANSYS®-GUI Electronic supplementary material for using ANSYS® can be found at http://link.springer.com/book/10.1007/978-1-4899-7550-8. This convenient online feature, which includes color figures, screen shots and input files for sample problems, allows for regeneration on the reader’s own computer. Students, researchers, and practitioners alike will find this an essential guide to predicting and simulating the physical behavior of complex engineering systems.
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.
This book is a collection of selected papers presented at the 3rd Turkish Migration Conference (TMC). TMC 2015 was hosted by Charles University Prague, Czech Republic from 25 to 27 June 2015. The TMC 2015 was the third event in the series that we were proud to organise and host at Charles University Prague. This selection of papers presented at the conference are only a small portion of contributions. Many other papers are included in edited books and submitted to refereed journals in due course. There were a total of about 146 papers by over 200 authors presented in 40 parallel sessions and three plenary sessions at Jinonice Campus of Charles University Prague. About a fıfth of the sessions at the conference were in Turkish language although the main language was English. Therefore some of the proceedings are in Turkish too. The keynote speakers included Douglas Massey of Princeton University, Caroline Brettell of Southern Methodist University, and Nedim Gürsel of CNRS.
This important, self-contained reference deals with structural life assessment (SLA) and structural health monitoring (SHM) in a combined form. SLA periodically evaluates the state and condition of a structural system and provides recommendations for possible maintenance actions or the end of structural service life. It is a diversified field and relies on the theories of fracture mechanics, fatigue damage process, and reliability theory. For common structures, their life assessment is not only governed by the theory of fracture mechanics and fatigue damage process, but by other factors such as corrosion, grounding, and sudden collision. On the other hand, SHM deals with the detection, prediction, and location of crack development online. Both SLA and SHM are combined in a unified and coherent treatment.
POLITICS AND LAW IN TURKISH MIGRATION - Edited by Ibrahim Sirkeci, Doğa Elçin, and Güven Şeker - Increasingly more scholars and analysts argue that migration controls are deemed to fail simply because of the dynamic nature of human mobility. Nevertheless, migration remains to be a hot topic on political agenda as well as a key area of legislation. Turkey has recently implemented some serious structural changes through a new law of migration and creation of a specialist central general directorate responsible for handling almost anything and everything about migrants and foreigners in the country. On the other hand, politics and political participation of the Turks abroad is part and parcel of the integration debates strongly shaping the mainstream politics of immigration countries in Europe and beyond. This book offers a number of research accounts investigating the political participation and integration, new legislations, and implications of policy and law on migration practices.
The Turkish Migration Conference 2016 is the fourth event in this series, we are proud to organise and host at the University of Vienna, Austria. Perhaps given the growing number of participants and variety in scope of research and debates included at the Conference, it is now an established quality venue fostering scholarship in Turkish Migration Studies. Over the last five years, we have seen over 1000 abstracts submitted to the conference and year on year the number of accepted presentations grew. This year, the conference accommodates over 350 presentations by hundreds of academics from all around the World. The Migration Conference attracting such a healthy number of academics is a good indicator of the success and means the conference serving its purpose and offer a good opportunity for scholarly exchange and networking. Main speakers include Jeffrey Cohen, Ibrahim Sirkeci, Philip Martin, Gudrun Biffl, Karen Phalet, Samim Akgönül, and Katharine Sarikakis.
The Finite Element Method and Applications with ANSYS® provides the reader with theoretical and practical knowledge of the finite element method and with the skills required to analyze engineering problems with ANSYS®, a commercially available FEA program. This self-contained, introductory text minimizes the need for additional reference material, covering the fundamental topics in finite element methods, as well as advanced topics concerning modeling and analysis with ANSYS®. These subjects are introduced through extensive examples from various engineering disciplines and are presented in a clear, step-by-step fashion. The book focuses on the use of ANSYS® through both the Graphics User Interface (GUI) and the ANSYS® Parametric Design Language (APDL). This volume addresses these specific areas: An introduction to FEM Fundamentals and analysis capabilities of ANSYS®, with practical modeling considerations Fundamentals of discretization and approximation functions Modeling techniques and details of mesh generation in ANSYS® Creating solutions and reviewing results Finite element equations based on the method of weighted residuals and on the principle of minimum potential energy The use of commands and APDL and the development of macro files Example problems and solutions corresponding to linear structural analysis Example problems and solutions related to heat transfer and moisture diffusion Nonlinear structural problems Advanced subjects such as submodeling, substructuring, interaction with external files, and modification of ANSYS®-GUI Additional materials for this book, including the "input" files for the example problems, as well as the colored figures and screen shots, allowing them to be regenerated on the reader's own computer, may be downloaded from http://extras.springer.com. Students, researchers, and practicing engineers will find this an essential reference for use in predicting and simulating the physical behavior of complex engineering systems using ANSYS®.
This textbook offers theoretical and practical knowledge of the finite element method. The book equips readers with the skills required to analyze engineering problems using ANSYS®, a commercially available FEA program. Revised and updated, this new edition presents the most current ANSYS® commands and ANSYS® screen shots, as well as modeling steps for each example problem. This self-contained, introductory text minimizes the need for additional reference material by covering both the fundamental topics in finite element methods and advanced topics concerning modeling and analysis. It focuses on the use of ANSYS® through both the Graphics User Interface (GUI) and the ANSYS® Parametric Design Language (APDL). Extensive examples from a range of engineering disciplines are presented in a straightforward, step-by-step fashion. Key topics include: • An introduction to FEM • Fundamentals and analysis capabilities of ANSYS® • Fundamentals of discretization and approximation functions • Modeling techniques and mesh generation in ANSYS® • Weighted residuals and minimum potential energy • Development of macro files • Linear structural analysis • Heat transfer and moisture diffusion • Nonlinear structural problems • Advanced subjects such as submodeling, substructuring, interaction with external files, and modification of ANSYS®-GUI Electronic supplementary material for using ANSYS® can be found at http://link.springer.com/book/10.1007/978-1-4899-7550-8. This convenient online feature, which includes color figures, screen shots and input files for sample problems, allows for regeneration on the reader’s own computer. Students, researchers, and practitioners alike will find this an essential guide to predicting and simulating the physical behavior of complex engineering systems.
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.
This book is a collection of selected papers presented at the 3rd Turkish Migration Conference (TMC). TMC 2015 was hosted by Charles University Prague, Czech Republic from 25 to 27 June 2015. The TMC 2015 was the third event in the series that we were proud to organise and host at Charles University Prague. This selection of papers presented at the conference are only a small portion of contributions. Many other papers are included in edited books and submitted to refereed journals in due course. There were a total of about 146 papers by over 200 authors presented in 40 parallel sessions and three plenary sessions at Jinonice Campus of Charles University Prague. About a fıfth of the sessions at the conference were in Turkish language although the main language was English. Therefore some of the proceedings are in Turkish too. The keynote speakers included Douglas Massey of Princeton University, Caroline Brettell of Southern Methodist University, and Nedim Gürsel of CNRS.
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