FROM LED TO SOLID STATE LIGHTING A comprehensive and practical reference complete with hands-on exercises and experimental data In From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications, accomplished mechanical engineers Shi-Wei Ricky Lee, Jeffery C. C. Lo, Mian Tao, and Huaiyu Ye deliver a practical overview of the design and construction of LED lighting modules, from the fabrication of the LED chip to the LED modules incorporated in complete LED lighting fixtures. The distinguished authors discuss the major advantages of solid-state lighting, including energy savings, environmental friendliness, and lengthy operational life, as well as the contributions offered by the packaging of light-emitting diodes in the pursuit of these features. Readers will discover presentations of the technical issues that arise in packaging LED components, like interconnection, phosphor deposition, and encapsulation. They’ll also find insightful elaborations on optical design, analysis, and characterization. Discussions of LED applications, technology roadmaps, and IP issues round out the included material. This important book also includes: Thorough introductions to lighting, photometry, and colorimetry, the fundamentals of light-emitting diodes, and the fabrication of LED wafers and chips Practical discussions of the packaging of LED chips, wafer-level packaging of LED arrays, and optical and electrical characterization Comprehensive explorations of board-level assembly and LED modules and optical and electrical characterization In-depth examinations of thermal management, reliability engineering for LED packaging, and applications for general lighting Perfect for post-graduate students and practicing engineers studying or working in the field of LED manufacturing for solid state lighting applications, From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications is also an indispensable resource for managers and technicians seeking a one-stop guide to the subject.
Animals play crucial roles in Buddhist thought and practice. However, many symbolically or culturally significant animals found in India, where Buddhism originated, do not inhabit China, to which Buddhism spread in the medieval period. In order to adapt Buddhist ideas and imagery to the Chinese context, writers reinterpreted and modified the meanings different creatures possessed. Medieval sources tell stories of monks taming wild tigers, detail rituals for killing snakes, and even address the question of whether a parrot could achieve enlightenment. Huaiyu Chen examines how Buddhist ideas about animals changed and were changed by medieval Chinese culture. He explores the entangled relations among animals, religions, the state, and local communities, considering both the multivalent meanings associated with animals and the daily experience of living with the natural world. Chen illustrates how Buddhism influenced Chinese knowledge and experience of animals as well as how Chinese state ideology, Daoism, and local cultic practices reshaped Buddhism. He shows how Buddhism, Confucianism, and Daoism developed doctrines, rituals, discourses, and practices to manage power relations between animals and humans. Drawing on a wide range of sources, including traditional texts, stone inscriptions, manuscripts, and visual culture, this interdisciplinary book bridges history, religious studies, animal studies, and environmental studies. In examining how Buddhist depictions of the natural world and Chinese taxonomies of animals mutually enriched each other, In the Land of Tigers and Snakes offers a new perspective on how Buddhism took root in Chinese society.
The biomaterials surface, which may only be a few atomic layers thick, constitutes the important interface between the biomaterials and the external biological environment and plays a key role in the chemical and biological actions in vitro and in vivo. Hence, in order to monitor and fathom the biological performance of biomaterials, the surface properties must be well known. Recently, surface modification of biomaterials has attracted considerable attention as selective surface properties such as cytocompatibility can be altered while desirable bulk properties such as mechanical strength can be retained. In this respect, surface characterization techniques are indispensable in this important and burgeoning research area. No single technique can provide all the information, and quite often, different analytical tools are required to address a problem related to biomaterials research. To obtain surface chemical and morphological information, spectroscopic techniques such as X-ray photoelectron spectroscopy (XPS), Auger electron spectroscopy (AES), secondary ion mass spectroscopy (SIMS), and microscopic methods such as confocal microscopy, scanning electron microscopy, atomic force microscopy (AFM) are typically carried out. Other surface characterization methods such as contact angle (CA) measurement and ellipsometry are also widely used in biomaterials research. It should be emphasized that each technique has its strengths and weaknesses, and complete characterization frequently requires more than one method. In this chapter, we introduce and describe some of the common surface characterization techniques suitable for biomaterials. Initial discussion starts with spectroscopic techniques, their operation principles, and data analysis with specific examples. The discussions related to spectroscopic characterization are focused on XPS, AES, SIMS, surface matrix-assisted laser desorption ionization mass spectrometry (Surface-MALDI-MS), infrared spectroscopy, Raman spectroscopy, electron energy loss spectroscopy and ultraviolet spectroscopy. After spectroscopic characterization techniques, this chapter focuses on microscopic characterization. This part of the chapter is specifically focused on optical, electron and confocal microscopic techniques. Microscopic technique also discusses recent advances in atomic level characterization using scanning tunnelling microscopy and AFM. Finally, the chapter deals with specific surface characterization techniques for morphology with profilometry followed by surface charge measurement using CAs. The last section of the chapter deals with ellipsometry, a specular optical technique which provides unequalled capabilities for thin film metrology. Throughout this chapter, specific discussions are focused on examples based on applications as well as advantages, disadvantages, and challenges.
FROM LED TO SOLID STATE LIGHTING A comprehensive and practical reference complete with hands-on exercises and experimental data In From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications, accomplished mechanical engineers Shi-Wei Ricky Lee, Jeffery C. C. Lo, Mian Tao, and Huaiyu Ye deliver a practical overview of the design and construction of LED lighting modules, from the fabrication of the LED chip to the LED modules incorporated in complete LED lighting fixtures. The distinguished authors discuss the major advantages of solid-state lighting, including energy savings, environmental friendliness, and lengthy operational life, as well as the contributions offered by the packaging of light-emitting diodes in the pursuit of these features. Readers will discover presentations of the technical issues that arise in packaging LED components, like interconnection, phosphor deposition, and encapsulation. They’ll also find insightful elaborations on optical design, analysis, and characterization. Discussions of LED applications, technology roadmaps, and IP issues round out the included material. This important book also includes: Thorough introductions to lighting, photometry, and colorimetry, the fundamentals of light-emitting diodes, and the fabrication of LED wafers and chips Practical discussions of the packaging of LED chips, wafer-level packaging of LED arrays, and optical and electrical characterization Comprehensive explorations of board-level assembly and LED modules and optical and electrical characterization In-depth examinations of thermal management, reliability engineering for LED packaging, and applications for general lighting Perfect for post-graduate students and practicing engineers studying or working in the field of LED manufacturing for solid state lighting applications, From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications is also an indispensable resource for managers and technicians seeking a one-stop guide to the subject.
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