Carabid ground beetles, sometimes called "walking jewels", are among the most thoroughly investigated insects in the world. This book presents the results of molecular phylogenetic analyses of 2000 specimens, including 350 species and that cover more than 90% of the known genera, from 500 localities in 35 countries. These comprehensive analyses using mitochondrial DNA-based dating suggest that carabid diversification took place about 40 to 50 million years ago as an explosive radiation of the major genera, coinciding with the collision of the Indian subcontinent and Eurasian land mass. The analyses also lead to surprising conclusions suggesting discontinuous evolution and parallel morphological evolution. With numerous color illustrations, this book presents readers with the dynamic principles of evolution and the magnificent geographic history of the earth as revealed by the study of beetles.
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
This book outlines the development currently underway in the technology of new media and looks further to examine the unforeseen effects of this phenomenon on our culture, our philosophies, and our spiritual outlook.
Widely regarded as the definitive reference in the field, Youmans and Winn Neurological Surgery offers unparalleled, multimedia coverage of the entirety of this complex specialty. Fully updated to reflect recent advances in the basic and clinical neurosciences, the 8th Edition covers everything you need to know about functional and restorative neurosurgery, deep brain stimulation, stem cell biology, radiological and nuclear imaging, and neuro-oncology, as well as minimally invasive surgeries in spine and peripheral nerve surgery, and endoscopic and other approaches for cranial procedures and cerebrovascular diseases. In four comprehensive volumes, Dr. H. Richard Winn and his expert team of editors and authors provide updated content, a significantly expanded video library, and hundreds of new video lectures that help you master new procedures, new technologies, and essential anatomic knowledge in neurosurgery. - Discusses current topics such as diffusion tensor imaging, brain and spine robotic surgery, augmented reality as an aid in neurosurgery, AI and big data in neurosurgery, and neuroimaging in stereotactic functional neurosurgery. - 55 new chapters provide cutting-edge information on Surgical Anatomy of the Spine, Precision Medicine in Neurosurgery, The Geriatric Patient, Neuroanesthesia During Pregnancy, Laser Interstitial Thermal Therapy for Epilepsy, Fetal Surgery for Myelomeningocele, Rehabilitation of Acute Spinal Cord Injury, Surgical Considerations for Patients with Polytrauma, Endovascular Approaches to Intracranial Aneurysms, and much more. - Hundreds of all-new video lectures clarify key concepts in techniques, cases, and surgical management and evaluation. Notable lecture videos include multiple videos on Thalamotomy for Focal Hand Dystonia and a video to accompany a new chapter on the Basic Science of Brain Metastases. - An extensive video library contains stunning anatomy videos and videos demonstrating intraoperative procedures with more than 800 videos in all. - Each clinical section contains chapters on technology specific to a clinical area. - Each section contains a chapter providing an overview from experienced Section Editors, including a report on ongoing controversies within that subspecialty. - Enhanced eBook version included with purchase. Your enhanced eBook allows you to access all of the text, figures, and references from the book on a variety of devices.
Still the most widely used comprehensive resource in orthopaedic surgery, Campbell's Operative Orthopaedics is an essential reference for trainees, a trusted clinical tool for practitioners, and the gold standard for worldwide orthopaedic practice. Unparalleled in scope and depth, this 14th Edition contains updated diagnostic images, practical guidance on when and how to perform every procedure, and rapid access to data in preparation for surgical cases or patient evaluation. Drs. Frederick M. Azar and James H. Beaty, along with other expert contributors from the world-renowned Campbell Clinic, have collaborated diligently to ensure that this 4-volume text remains a valuable resource in your practice, helping you achieve optimal outcomes with every patient. - Features evidence-based surgical coverage throughout to aid in making informed clinical choices for each patient. - Covers multiple procedures for all body regions to provide comprehensive coverage. - Keeps you up to date with even more high-quality procedural videos, a new chapter on biologics in orthopaedics, and expanded and updated content on hip arthroscopy, patellofemoral arthritis and more. - Follows a standard template for every chapter that features highlighted procedural steps, high-quality illustrations for clear visual guidance, and bulleted text. - Enhanced eBook version included with purchase. Your enhanced eBook allows you to access all of the text, figures, and references from the book on a variety of devices
The careful choice of nanoparticles as targets and in drug delivery routes enhances therapeutic efficacy in cancer. Nanoparticle-Based Drug Delivery in Cancer Treatment discusses nanotechnological developments of interfering RNA-based nanoparticles, delivery vehicles, and validated therapeutic RNAi–molecular target interactions and explains the results of clinical and preclinical trials. The book also gives strategies for universal methods of constructing hybrid organic–inorganic nanomaterials that can be widely applied in the biomedical field. Key Features: Reviews recent advances of nanoparticle-mediated siRNA delivery systems and their application in clinical trials for cancer therapy Focuses on material platforms that establish NPs and both localized and controlled gene silencing Emphasizes the most promising systems for clinical application Surveys progress in nanoparticle-based nanomedicine in cancer treatment Describes the most advanced of the nonviral nanocarriers for delivery of oligonucleotides to malignant blood cancer cells This book is a valuable resource for researchers, professors, and students researching drug delivery, gene carriers, cancer therapy, nanotechnology, and nanomaterials.
A comprehensive guide to 3D IC integration and packaging technology3D IC Integration and Packaging fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption. Based on a course developed by its author, this practical guide offers real-world problem-solving methods and teaches the trade-offs inherent in making system-level decisions. Explore key enabling technologies such as TSV, thin-wafer strength measurement and handling, microsolder bumping, redistribution layers, interposers, wafer-to-wafer bonding, chip-to-wafer bonding, 3D IC and MEMS, LED, and complementary metal-oxide semiconductor image sensors integration. Assembly, thermal management, and reliability are covered in complete detail.3D IC Integration and Packaging covers:• 3D integration for semiconductor IC packaging• Through-silicon vias modeling and testing• Stress sensors for thin-wafer handling and strength measurement• Package substrate technologies• Microbump fabrication, assembly, and reliability• 3D Si integration• 2.5D/3D IC integration• 3D IC integration with passive interposer• Thermal management of 2.5D/3D IC integration• Embedded 3D hybrid integration• 3D LED and IC integration• 3D MEMS and IC integration• 3D CMOS image sensors and IC integration• PoP, chip-to-chip interconnects, and embedded fan-out WLP
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