This book presents a detailed summary of research on automatic layout of device-level analog circuits that was undertaken in the late 1980s and early 1990s at Carnegie Mellon University. We focus on the work behind the creation of the tools called KOAN and ANAGRAM II, which form part of the core of the CMU ACACIA analog CAD system. KOAN is a device placer for custom analog cells; ANANGRAM II a detailed area router for these analog cells. We strive to present the motivations behind the architecture of these tools, including detailed discussion of the subtle technology and circuit concerns that must be addressed in any successful analog or mixed-signal layout tool. Our approach in organizing the chapters of the book has been to present our algo rithms as a series of responses to these very real and very difficult analog layout problems. Finally, we present numerous examples of results generated by our algorithms. This research was supported in part by the Semiconductor Research Corpora tion, by the National Science Foundation, by Harris Semiconductor, and by the International Business Machines Corporation Resident Study Program. Finally, just for the record: John Cohn was the designer of the KOAN placer; David Garrod was the designer of the ANAGRAM II router (and its predeces sor, ANAGRAM I). This book was architected by all four authors, edited by John Cohn and Rob Rutenbar, and produced in finished form by John Cohn.
Digital Timing Macromodeling for VLSI Design Verification first of all provides an extensive history of the development of simulation techniques. It presents detailed discussion of the various techniques implemented in circuit, timing, fast-timing, switch-level timing, switch-level, and gate-level simulation. It also discusses mixed-mode simulation and interconnection analysis methods. The review in Chapter 2 gives an understanding of the advantages and disadvantages of the many techniques applied in modern digital macromodels. The book also presents a wide variety of techniques for performing nonlinear macromodeling of digital MOS subcircuits which address a large number of shortcomings in existing digital MOS macromodels. Specifically, the techniques address the device model detail, transistor coupling capacitance, effective channel length modulation, series transistor reduction, effective transconductance, input terminal dependence, gate parasitic capacitance, the body effect, the impact of parasitic RC-interconnects, and the effect of transmission gates. The techniques address major sources of errors in existing macromodeling techniques, which must be addressed if macromodeling is to be accepted in commercial CAD tools by chip designers. The techniques presented in Chapters 4-6 can be implemented in other macromodels, and are demonstrated using the macromodel presented in Chapter 3. The new techniques are validated over an extremely wide range of operating conditions: much wider than has been presented for previous macromodels, thus demonstrating the wide range of applicability of these techniques.
The goal of putting `systems on a chip' has been a difficult challenge that is only recently being met. Since the world is `analog', putting systems on a chip requires putting analog interfaces on the same chip as digital processing functions. Since some processing functions are accomplished more efficiently in analog circuitry, chips with a large amount of analog and digital circuitry are being designed. Whether a small amount of analog circuitry is combined with varying amounts of digital circuitry or the other way around, the problem encountered in marrying analog and digital circuitry are the same but with different scope. Some of the most prevalent problems are chip/package capacitive and inductive coupling, ringing on the RLC tuned circuits that form the chip/package power supply rails and off-chip drivers and receivers, coupling between circuits through the chip substrate bulk, and radiated emissions from the chip/package interconnects. To aggravate the problems of designers who have to deal with the complexity of mixed-signal coupling there is a lack of verification techniques to simulate the problem. In addition to considering RLC models for the various chip/package/board level parasitics, mixed-signal circuit designers must also model coupling through the common substrate when simulating ICs to obtain an accurate estimate of coupled noise in their designs. Unfortunately, accurate simulation of substrate coupling has only recently begun to receive attention, and techniques for the same are not widely known. Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits addresses two major issues of the mixed-signal coupling problem -- how to simulate it and how to overcome it. It identifies some of the problems that will be encountered, gives examples of actual hardware experiences, offers simulation techniques, and suggests possible solutions. Readers of this book should come away with a clear directive to simulate their design for interactions prior to building the design, versus a `build it and see' mentality.
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