There have been considerable developments in information and communication technology. This has led to an increase in the number of applications available, as well as an increase in their variability. As such, it has become important to understand and master problems related to establishing radio links, the layout and flow of source data, the power available from antennas, the selectivity and sensitivity of receivers, etc. This book discusses digital modulations, their extensions and environment, as well as a few basic mathematical tools. An understanding of degree level mathematics or its equivalent is a prerequisite to reading this book. Digital Communication Techniques is aimed at licensed professionals, engineers, Masters students and researchers whose field is in related areas such as hardware, phase-locked loops, voltage-controlled oscillators or phase noise.
As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forward. As circuits become more and more complex, especially three-dimensional ones, new insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.
The number of transistors in integrated circuits doubles every two years, as stipulated by Moore’s law, and this has been the driving force for the huge development of the microelectronics industry in the past 50 years – currently advanced to the nanometric scale. This e-book is dedicated to electronic noises and parasites, accounting for issues involving substrate coupling and interconnections, in the perspective of the 3D integration: a second track for enhancing integration, also compatible with Moore’s law. This reference explains the modeling of 3D circuits without delving into the latest advances, but highlights crucial problems, for instance electro-thermo-mechanical problems, which could be addressed through 3D modeling. The book also explains electromagnetic interferences , at different modeling levels (device and circuit) oriented towards 3D integration technologies. It also covers substrate noise, such as disturbances of digital blocks, power bounces, phase noise in oscillators, both at the device level, such as carriers or field fluctuations, and circuit levels. The entanglement between interconnect and substrate is also discussed. This e-book serves as a reference for advanced graduates or researchers in the field of micro and nano electronics interested in topics relevant to electromagnetic interference or the ‘noise’ domain, at device or circuit and system levels
This book is dedicated to the study of the theory of electromagnetism. It is not intended to cover all aspects of the topic, but instead will give a certain perspective, that of its relationship with special relativity. Indeed, special relativity is intrinsic to electromagnetism; thus, this paradigm eliminates some false paradoxes. Electromagnetism also discusses the limit of classical mechanics, and covers problems that arise when phenomena related to the propagation of electromagnetic waves are encountered. These are problems that even the greatest scientists of the last two hundred years have not been able to entirely overcome. This book is directed towards the undergraduate level, and will also support the readers as they move on to advanced technical training, such as an engineering or master’s degree.
Smart power integration is at the crossroads of different fields of electronics such as high and low power, engine control and electrothermal studies of devices and circuits. These circuits are complex and are heavily influenced by substrate coupling, especially where 3D integration is concerned. This book provides an overview of smart power integration, including high voltage devices, dedicated and compatible processes, as well as isolation techniques. Two types of integration are highlighted: modular or hybrid integration, together with compatible devices such as the insulated gate bipolar transistor (IGBT); and monolithic integration, specifically through the paradigm of functional integration. Smart Power Integration outlines the main MOS devices for high voltage integrated circuits, and explores into the fields of codesign, coupling hardware and software design, including applications to motor control. Studies focusing on heat pipes for electronics cooling are also outlined.
POCHE - EBOOK SUR MON SITE - Ce qui était marrant c'est qu'ils avaient punaisé dans la salle télé l'affiche du film The Sentinel " :- L'ennemi vient de l'intérieur.C'est moi qui leur ai fait remarquer ! Ils en ont ri mais ils l'ont gardée. Peut-être une piqûre de rappel aux internés du deuxième étage ?
Heat Transfer 2 deals with radiation, heat exchangers and flat plate solar collectors. It presents the treatment of radiation in semi-transparent media to be taken into account for insulation or recovery of high temperature waste heat (energy saving in industry), as well as in certain solar applications (energy transition). The numerous solved exercises allow the reader to grasp the whole range of applications, whether in the field of building, transport, materials or the environment. The appendices contain all the data needed to solve the exercises and will be a valuable source of information. This book is designed for masters and engineering students who are interested in all aspects of heat transfer, but also for engineers who will find the bases needed to understand similar phenomena (conduction-convection-radiation), but which require a different form of reflection and approach.
There have been considerable developments in information and communication technology. This has led to an increase in the number of applications available, as well as an increase in their variability. As such, it has become important to understand and master problems related to establishing radio links, the layout and flow of source data, the power available from antennas, the selectivity and sensitivity of receivers, etc. This book discusses digital modulations, their extensions and environment, as well as a few basic mathematical tools. An understanding of degree level mathematics or its equivalent is a prerequisite to reading this book. Digital Communication Techniques is aimed at licensed professionals, engineers, Masters students and researchers whose field is in related areas such as hardware, phase-locked loops, voltage-controlled oscillators or phase noise.
Micro-nanoelectronics Devices: Modeling of Diffusion and Operation Processes concentrates on the modeling of diffusion processes and the behavior of modern integrated components, from material, to architecture. It goes through the process, the device and the circuit regarding today's widely discussed nano-electronics, both from an industry perspective and that of public entities. - Seeks to provide the core of modeling in micro (nano) electronics - Introduces the equations underlying the modelizations and, ultimately, the related simulations - Proposes what modifications should be made with respect to modeling
At the end of the Second World War, a new technological trend was born: integrated electronics. This trend relied on the enormous rise of integrable electronic devices. Analog Devices and Circuits is composed of two volumes: the first deals with analog components, and the second with associated analog circuits. The goal here is not to create an overly comprehensive analysis, but rather to break it down into smaller sections, thus highlighting the complexity and breadth of the field. This first volume, after a brief history, describes the two main devices, namely bipolar transistors and MOS, with particular importance given to the modeling aspect. In doing so, we deal with new devices dedicated to radio frequency, which touches on nanoelectronics. We will also address some of the notions related to quantum mechanics. Finally, Monte Carlo methods, by essence statistics, will be introduced, which have become more and more important since the middle of the twentieth century. The second volume deals with the circuits that "use" the analog components that were introduced in Volume 1. Here, a particular emphasis is placed on the main circuit: the operational amplifier.
This book is dedicated to the study of the theory of electromagnetism. It is not intended to cover all aspects of the topic, but instead will give a certain perspective, that of its relationship with special relativity. Indeed, special relativity is intrinsic to electromagnetism; thus, this paradigm eliminates some false paradoxes. Electromagnetism also discusses the limit of classical mechanics, and covers problems that arise when phenomena related to the propagation of electromagnetic waves are encountered. These are problems that even the greatest scientists of the last two hundred years have not been able to entirely overcome. This book is directed towards the undergraduate level, and will also support the readers as they move on to advanced technical training, such as an engineering or master’s degree.
Micro-nanoelectronics Devices: Modeling of Diffusion and Operation Processes concentrates on the modeling of diffusion processes and the behavior of modern integrated components, from material, to architecture. It goes through the process, the device and the circuit regarding today's widely discussed nano-electronics, both from an industry perspective and that of public entities. - Seeks to provide the core of modeling in micro (nano) electronics - Introduces the equations underlying the modelizations and, ultimately, the related simulations - Proposes what modifications should be made with respect to modeling
As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forward. As circuits become more and more complex, especially three-dimensional ones, new insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.
Smart power integration is at the crossroads of different fields of electronics such as high and low power, engine control and electrothermal studies of devices and circuits. These circuits are complex and are heavily influenced by substrate coupling, especially where 3D integration is concerned. This book provides an overview of smart power integration, including high voltage devices, dedicated and compatible processes, as well as isolation techniques. Two types of integration are highlighted: modular or hybrid integration, together with compatible devices such as the insulated gate bipolar transistor (IGBT); and monolithic integration, specifically through the paradigm of functional integration. Smart Power Integration outlines the main MOS devices for high voltage integrated circuits, and explores into the fields of codesign, coupling hardware and software design, including applications to motor control. Studies focusing on heat pipes for electronics cooling are also outlined.
The number of transistors in integrated circuits doubles every two years, as stipulated by Moore’s law, and this has been the driving force for the huge development of the microelectronics industry in the past 50 years – currently advanced to the nanometric scale. This e-book is dedicated to electronic noises and parasites, accounting for issues involving substrate coupling and interconnections, in the perspective of the 3D integration: a second track for enhancing integration, also compatible with Moore’s law. This reference explains the modeling of 3D circuits without delving into the latest advances, but highlights crucial problems, for instance electro-thermo-mechanical problems, which could be addressed through 3D modeling. The book also explains electromagnetic interferences , at different modeling levels (device and circuit) oriented towards 3D integration technologies. It also covers substrate noise, such as disturbances of digital blocks, power bounces, phase noise in oscillators, both at the device level, such as carriers or field fluctuations, and circuit levels. The entanglement between interconnect and substrate is also discussed. This e-book serves as a reference for advanced graduates or researchers in the field of micro and nano electronics interested in topics relevant to electromagnetic interference or the ‘noise’ domain, at device or circuit and system levels
Reprint of the original, first published in 1859. The publishing house Anatiposi publishes historical books as reprints. Due to their age, these books may have missing pages or inferior quality. Our aim is to preserve these books and make them available to the public so that they do not get lost.
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