Computational mechanics, as a science employed for the numerical model ing of processes in nature and engineering, has over the last few decades developed two strands. The first concerns the putting of more and more powerful software packages into computational practice, using increas ingly high-performance computers with increasingly large memory. The traditional finite element and finite difference approaches are still preva lent. Over the years however, researchers have met with new problems; their solutions on the basis of traditional methods are at best difficult and at worst impossible to obtain. Such problems provided a powerful impetus in the development of the second strand, resulting in the development of es sentially new approaches for numerical modeling, for example meshless methods, "molecular" dynamics, neuron networks. The current state of the art formed the basis of many papers presented at the Fifth World Congress on Computational Mechanics, Vienna 2002. It is within the framework of the second strand that this book has been written.
The book is targeted at engineers, university lecturers, postgraduates, and final year undergraduate students involved in computational modelling and experimental and theoretical analysis of the high-temperature behavior of engineering structures. It will also be of interest to researchers developing the thermal strength theory as a branch of continuum mechanics. Thermal integrity is a multidisciplinary field combining the expertise of mechanical engineers, material scientists and applied mathematicians, each approaching the problem from their specific viewpoint. This monograph draws on the research of a broad scientific community including the author’s contribution. The scope of thermal strength analysis was considerably extended thanks to modern computers and the implementation of FEM codes. However, the author believes that some material models adopted in the advanced high-performance software, are not sufficiently justificated due to lack of easy-to-follow books on the theoretical and experimental aspects of thermal integrity. The author endeavors to provide a thorough yet sufficiently simple presentation of the underlying concepts, making the book compelling to a wide audience.
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